JPS63170935U - - Google Patents
Info
- Publication number
- JPS63170935U JPS63170935U JP6436687U JP6436687U JPS63170935U JP S63170935 U JPS63170935 U JP S63170935U JP 6436687 U JP6436687 U JP 6436687U JP 6436687 U JP6436687 U JP 6436687U JP S63170935 U JPS63170935 U JP S63170935U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- retaining plate
- developing
- temperature
- developed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Description
第１図は本考案の実施例による現像装置の一部
破断正面図、第２図は同実施例による現像装置の
平面図、第３図は同実施例による現像装置の要部
を示す図、及び第４図は従来の現像装置を示す図
である。
２……被現像物、３……保持具、５……噴射ノ
ズル、６……排出口、１１，１２……保温プレー
ト、１３……現像手段、１７ａ……上側チヤンバ
ー部、１７ｂ……下側チヤンバー部、１８……温
度センサ、１９……液体、２０……容器、２１…
…ヒータ、２２……クーラ、２３……ポンプ、２
４……制御装置、２５，２６……配管、Ａ，Ｂ，
Ｃ……配線。
FIG. 1 is a partially cutaway front view of a developing device according to an embodiment of the present invention, FIG. 2 is a plan view of the developing device according to the same embodiment, and FIG. 3 is a diagram showing main parts of the developing device according to the same embodiment. and FIG. 4 are diagrams showing a conventional developing device. 2... Object to be developed, 3... Holder, 5... Injection nozzle, 6... Outlet, 11, 12... Heat retention plate, 13... Developing means, 17a... Upper chamber portion, 17b... Lower Side chamber part, 18...Temperature sensor, 19...Liquid, 20...Container, 21...
...Heater, 22...Cooler, 23...Pump, 2
4...Control device, 25, 26...Piping, A, B,
C...Wiring.
Claims (1)
レートの温度を検知する温度センサと、該温度セ
ンサからの検知信号に基づいて前記保温プレート
の温度を所定値に調整する調整手段と、前記保温
プレート上に載置した前記被現像物を現像する現
像手段とを具備してなることを特徴とする現像装
置。 a heat-retaining plate on which the object to be developed is placed; a temperature sensor for detecting the temperature of the heat-retaining plate; an adjusting means for adjusting the temperature of the heat-retaining plate to a predetermined value based on a detection signal from the temperature sensor; and the heat-retaining plate. A developing device comprising: a developing means for developing the object to be developed placed on a plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6436687U JPS63170935U (en) | 1987-04-27 | 1987-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6436687U JPS63170935U (en) | 1987-04-27 | 1987-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170935U true JPS63170935U (en) | 1988-11-07 |
Family
ID=30900457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6436687U Pending JPS63170935U (en) | 1987-04-27 | 1987-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170935U (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS552213A (en) * | 1978-06-19 | 1980-01-09 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Developing method |
| JPS5972136A (en) * | 1982-10-19 | 1984-04-24 | Toshiba Corp | Forming method for resist pattern |
| JPS5950439B2 (en) * | 1975-12-27 | 1984-12-08 | アイダエンジニアリング カブシキガイシヤ | How to balance the power of balance |
| JPS60158626A (en) * | 1984-01-30 | 1985-08-20 | Canon Inc | Semiconductor exposure device |
| JPS61281527A (en) * | 1985-06-06 | 1986-12-11 | Mitsubishi Electric Corp | Semiconductor wafer heat-processing device |
-
1987
- 1987-04-27 JP JP6436687U patent/JPS63170935U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5950439B2 (en) * | 1975-12-27 | 1984-12-08 | アイダエンジニアリング カブシキガイシヤ | How to balance the power of balance |
| JPS552213A (en) * | 1978-06-19 | 1980-01-09 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Developing method |
| JPS5972136A (en) * | 1982-10-19 | 1984-04-24 | Toshiba Corp | Forming method for resist pattern |
| JPS60158626A (en) * | 1984-01-30 | 1985-08-20 | Canon Inc | Semiconductor exposure device |
| JPS61281527A (en) * | 1985-06-06 | 1986-12-11 | Mitsubishi Electric Corp | Semiconductor wafer heat-processing device |