JPS63170240A - Low melting glass composition - Google Patents
Low melting glass compositionInfo
- Publication number
- JPS63170240A JPS63170240A JP175887A JP175887A JPS63170240A JP S63170240 A JPS63170240 A JP S63170240A JP 175887 A JP175887 A JP 175887A JP 175887 A JP175887 A JP 175887A JP S63170240 A JPS63170240 A JP S63170240A
- Authority
- JP
- Japan
- Prior art keywords
- ferrite
- sealing
- sendust
- film
- compsn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 title claims abstract description 12
- 238000002844 melting Methods 0.000 title claims abstract description 7
- 230000008018 melting Effects 0.000 title claims abstract description 6
- 239000000203 mixture Substances 0.000 title claims description 14
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 229910000702 sendust Inorganic materials 0.000 abstract description 15
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 229910011255 B2O3 Inorganic materials 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052593 corundum Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 2
- 230000003628 erosive effect Effects 0.000 abstract 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract 1
- 239000010408 film Substances 0.000 description 11
- 239000010409 thin film Substances 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000005394 sealing glass Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
- C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明はセンダスト薄膜を被着したフェライトヘッドの
封着に好適な低融点ガラス組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a low melting point glass composition suitable for sealing a ferrite head coated with a sendust thin film.
（従来の技術）
従来、フェライトをガラスで封着する技術は、たとえば
磁気ディスク装置用磁気ヘッドの製造において通常採用
されている。ところが近時、磁気記録の高記録密度化、
狭トラツク化に伴い磁気ヘッドの形状、寸法は小形化、
高精度化される傾向にある。このため磁気ヘッドとして
スパッタリング法によってフェライトにセンダスト膜、
すなわち、重址比で鉄８３％、アルミニウム６％シリコ
ン１１％の組成からなる合金膜を２０〜３０声の膜朧に
被着させた薄膜フェライトヘッドが用いられるようにな
ってきた。このセンダスト膜は熱膨張係数（α）が１３
０ Ｘ １０”−’／’Ｃと大きいためフェライトのα
もこれに伴なって１２０〜１３０ ｘ １０−’／℃の
ものが用いられる。また、センダスト膜は保持力■。が
大き過ずぎるので低電力化できるように５５０℃で熱処
理を施こして保持力Ｈ０を小とする必要がある。(Prior Art) Conventionally, a technique of sealing ferrite with glass has been commonly employed, for example, in manufacturing magnetic heads for magnetic disk drives. However, in recent years, the recording density of magnetic recording has increased,
As the track becomes narrower, the shape and dimensions of the magnetic head become smaller.
There is a trend toward higher precision. For this reason, as a magnetic head, a sendust film is applied to ferrite using a sputtering method.
That is, a thin film ferrite head in which an alloy film having a composition of 83% iron, 6% aluminum, and 11% silicon is deposited on a thin film of 20 to 30 degrees has come to be used. This sendust film has a coefficient of thermal expansion (α) of 13
Since it is large as 0 x 10"-'/'C, the α of ferrite is
Along with this, those having a temperature of 120 to 130 x 10-'/°C are used. In addition, the Sendust film has a strong holding power■. is too large, so it is necessary to perform heat treatment at 550° C. to reduce the holding force H0 so that the power consumption can be reduced.
したがって、上述した薄膜フェライトヘッドを封着する
ガラスの組成をセンダスト膜のαに対応した高膨張率に
構成した場合、このガラスはその軟化点が低下して良好
な封着がなされないという問題点を有している。そのた
め軟化点を、低下させることなく、またセンダスト膜の
７ニ一ル温度５５０℃を受けても良好な封着が可能とな
る組成物が要望されている。Therefore, if the composition of the glass for sealing the thin film ferrite head described above is configured to have a high expansion coefficient corresponding to α of the sendust film, the problem is that the softening point of this glass decreases and good sealing cannot be achieved. have. Therefore, there is a need for a composition that does not lower its softening point and is capable of good sealing even when exposed to the 7-niel temperature of 550° C. of the Sendust film.
（発明が解決しようとする問題点）
上述のように通常の封着用ガラスは熱膨張係数が大きく
なると軟化点が下がりセンダスト薄膜を被着したフェラ
イトヘッドの封着には好ましくない問題点を有している
。(Problems to be Solved by the Invention) As mentioned above, ordinary sealing glass has a problem in that as its coefficient of thermal expansion increases, its softening point decreases, making it unfavorable for sealing ferrite heads coated with sendust thin films. ing.
本発明は上記問題点を除去するためなされたもので、セ
ンダスト膜の熱膨張係数に近似した熱膨張係数を有し、
しかもセンダスト膜の５５０℃の熱処理においても良
好な封着がなされ、またフェライトヘッド製作時の加工
中において外部からの薬液による侵蝕に対しても十分耐
えられる低融点ガラス組成物を提供することを目的とす
る。The present invention was made to eliminate the above problems, and has a thermal expansion coefficient close to that of the sendust film,
Moreover, the purpose is to provide a low-melting point glass composition that provides good sealing even when the sendust film is heat-treated at 550°C, and that can sufficiently withstand corrosion by external chemicals during processing during the production of ferrite heads. shall be.
（発明の構成）
（問題点を解決するための手段と作用）本発明者はセン
ダスト膜に近似した熱膨張係数を有し、 しかも軟化温
度においては４００℃以下の低温度となることなく５５
０℃の熱処理温度においてフェライトヘッドとの良好な
濡れ性が得られる次に示す組成範囲のものを見いだした
。(Structure of the Invention) (Means and Effects for Solving the Problems) The present inventor has developed a film that has a coefficient of thermal expansion similar to that of Sendust film, and has a softening temperature of 55° C. without becoming as low as 400° C.
We have found a composition within the following composition range that provides good wettability with the ferrite head at a heat treatment temperature of 0°C.
すなわち、重量比でＰｂＯ４５〜６０％、 Ｓｉ０．１
０〜１８％、 ８２０３１０〜ｔａ％、 ＺｎＯ５〜ｌ
Ｏ％、 Ａｆｆｉ、０３３〜８％、 Ｎａ２Ｏ５〜１３
％からなる組成物である。That is, PbO45-60%, Si0.1 in weight ratio
0~18%, 820310~ta%, ZnO5~l
O%, Affi, 033~8%, Na2O5~13
It is a composition consisting of %.
上記組成において各成分範囲を限定した理由について述
べる。ＰｂＯが６０％を上回り、あるいはＳｉｎ、が１
０％を下回ると軟化点が低下して封着温度を下げるとと
もに熱膨張係数が増大し、耐久性が悪化する。 また、
ＰｂＯが４５％を下回り、あるいはＳｉｎ、が１８％を
上回ると熱膨張係数が小さくなると同時に５５０℃での
封着が困難となる。 Ｂ、０．およびＺｎＯは熱膨張係
数を抑制する方向に作用し、Ｎａ２Ｏは熱膨張係数を増
加させる方向に大きく作用させるとともにこのＮａ、
０は耐久性をも悪化させるので上記範囲外にあることは
好ましくない、 Ａｆｆｉ、０３は耐久性の向上に効
果を有するが、８％を上回ると濡れ性を悪くする。The reason for limiting the range of each component in the above composition will be described. PbO exceeds 60% or Sin is 1
When it is less than 0%, the softening point decreases, lowering the sealing temperature, and increasing the coefficient of thermal expansion, resulting in poor durability. Also,
If PbO is less than 45% or Sin is more than 18%, the coefficient of thermal expansion becomes small and at the same time sealing at 550° C. becomes difficult. B, 0. and ZnO act in the direction of suppressing the coefficient of thermal expansion, and Na2O acts greatly in the direction of increasing the coefficient of thermal expansion.
A value of 0 also deteriorates durability, so a value outside the above range is not preferable.Affi, 03 is effective in improving durability, but if it exceeds 8%, it deteriorates wettability.
（実施例）
以下、本発明の詳細を・表に示す第１ないし第４の実施
例について述べる。各原料は表に示す組成ガラスとなる
ようにそれぞれ調整し、白金るつぼにて１３００℃〜１
４０（Ｉｃに加熱して溶融した。そして実装の試料を作
成して熱膨張係数の測定と、５５０℃でフェライトに溶
着してフェライトとの濡れ性およびフェライトヘッド作
成途中における洗浄、研削液への浸漬等による耐久性と
について調べた。(Example) Hereinafter, details of the present invention will be described with reference to first to fourth examples shown in the table. Each raw material was adjusted to have the composition glass shown in the table, and heated in a platinum crucible at 1300°C to 100°C.
40 (Ic) and melted. Mounting samples were prepared to measure the coefficient of thermal expansion, and were welded to ferrite at 550°C to check wettability with ferrite, cleaning during ferrite head creation, and compatibility with grinding fluid. Durability due to immersion etc. was investigated.
すなわち濡れ性についてはアルゴンガス等の不活性雰囲
気中でフェライト上に試料を置き５５０℃を１時間保持
したのち、フェライト表面への接触角を測定した結果、
全面に一様な状態で溶着し、良好な封着を行なうことが
できた。また耐久性については使用上問題となる侵蝕は
全く見られず極めて良好であった。In other words, the wettability was determined by placing a sample on ferrite in an inert atmosphere such as argon gas, maintaining the temperature at 550°C for 1 hour, and then measuring the contact angle to the ferrite surface.
It was possible to weld uniformly over the entire surface and achieve good sealing. Furthermore, the durability was extremely good, with no corrosion that would pose a problem during use.
本発明は以」〕述べた組成からなる低融点ガラス組成物
であるから、センダスト薄膜を被着したフェライトヘッ
ドと熱膨張係数を合わせることができるので封着後のク
ラックの発生がないことはもち論、軟化温度においても
センダスト膜の７ニ一ル温度である５５０℃によく適合
して濡れ性にすぐれた良好な封着を可能とし、また耐久
性においても溶剤や薬液等の侵蝕を受けるおそれのない
格別な利点を有する。Since the present invention is a low melting point glass composition having the composition described above, it is possible to match the coefficient of thermal expansion with the ferrite head coated with the sendust thin film, so it is possible that no cracks will occur after sealing. In addition, the softening temperature is well compatible with the Sendust film's 7th temperature of 550°C, allowing for good sealing with excellent wettability.Also, in terms of durability, there is a risk of corrosion by solvents, chemicals, etc. It has special advantages.
Claims (1)
０〜１８％、Ｂ＿２Ｏ＿３ １０〜１８％、ＺｎＯ ５
〜１０％、ＡｌＯ＿３ ３〜８％、Ｎａ＿２Ｏ ５〜１
３％からなることを特徴とするフェライト封着用低融点
ガラス組成物。In weight percentage, PbO 45-60%, SiO_2 1
0-18%, B_2O_3 10-18%, ZnO 5
~10%, AlO_3 3-8%, Na_2O 5-1
A low melting point glass composition for sealing ferrite, characterized by comprising 3%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP175887A JPS63170240A (en) | 1987-01-09 | 1987-01-09 | Low melting glass composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP175887A JPS63170240A (en) | 1987-01-09 | 1987-01-09 | Low melting glass composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63170240A true JPS63170240A (en) | 1988-07-14 |
| JPH0432011B2 JPH0432011B2 (en) | 1992-05-28 |
Family
ID=11510476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP175887A Granted JPS63170240A (en) | 1987-01-09 | 1987-01-09 | Low melting glass composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170240A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01199309A (en) * | 1988-02-03 | 1989-08-10 | Sanyo Electric Co Ltd | Glass for joining core for composite type magnetic head |
| JPH0333028A (en) * | 1989-06-19 | 1991-02-13 | Internatl Business Mach Corp <Ibm> | Less abrasive sealing glass for magnetic tape head and its device |
| US5224001A (en) * | 1989-11-29 | 1993-06-29 | Matsushita Electric Industrial Co., Ltd. | Magnetic head |
| US5245492A (en) * | 1989-11-28 | 1993-09-14 | Matsushita Electric Industrial Co., Ltd. | Magnetic head |
| US6503858B1 (en) | 1995-06-16 | 2003-01-07 | Hitachi, Ltd. | Glass composition, structure, and apparatus using the same |
-
1987
- 1987-01-09 JP JP175887A patent/JPS63170240A/en active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01199309A (en) * | 1988-02-03 | 1989-08-10 | Sanyo Electric Co Ltd | Glass for joining core for composite type magnetic head |
| JPH0333028A (en) * | 1989-06-19 | 1991-02-13 | Internatl Business Mach Corp <Ibm> | Less abrasive sealing glass for magnetic tape head and its device |
| US5245492A (en) * | 1989-11-28 | 1993-09-14 | Matsushita Electric Industrial Co., Ltd. | Magnetic head |
| US5224001A (en) * | 1989-11-29 | 1993-06-29 | Matsushita Electric Industrial Co., Ltd. | Magnetic head |
| US6503858B1 (en) | 1995-06-16 | 2003-01-07 | Hitachi, Ltd. | Glass composition, structure, and apparatus using the same |
| US6512655B1 (en) | 1995-06-16 | 2003-01-28 | Hitachi, Ltd. | Magnetic head with sealing glass composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0432011B2 (en) | 1992-05-28 |
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