JPS63167783U - - Google Patents
Info
- Publication number
- JPS63167783U JPS63167783U JP6040487U JP6040487U JPS63167783U JP S63167783 U JPS63167783 U JP S63167783U JP 6040487 U JP6040487 U JP 6040487U JP 6040487 U JP6040487 U JP 6040487U JP S63167783 U JPS63167783 U JP S63167783U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit board
- hybrid integrated
- printed circuit
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6040487U JPS63167783U (enExample) | 1987-04-20 | 1987-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6040487U JPS63167783U (enExample) | 1987-04-20 | 1987-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63167783U true JPS63167783U (enExample) | 1988-11-01 |
Family
ID=30892785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6040487U Pending JPS63167783U (enExample) | 1987-04-20 | 1987-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63167783U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07147471A (ja) * | 1993-11-26 | 1995-06-06 | Nec Corp | 搭載用ｈｉｃモジュール用接続金具 |
-
1987
- 1987-04-20 JP JP6040487U patent/JPS63167783U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07147471A (ja) * | 1993-11-26 | 1995-06-06 | Nec Corp | 搭載用ｈｉｃモジュール用接続金具 |