JPS63167736U - - Google Patents
Info
- Publication number
- JPS63167736U JPS63167736U JP6171787U JP6171787U JPS63167736U JP S63167736 U JPS63167736 U JP S63167736U JP 6171787 U JP6171787 U JP 6171787U JP 6171787 U JP6171787 U JP 6171787U JP S63167736 U JPS63167736 U JP S63167736U
- Authority
- JP
- Japan
- Prior art keywords
- resistance value
- thick film
- film circuit
- pattern
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6171787U JPS63167736U (de) | 1987-04-22 | 1987-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6171787U JPS63167736U (de) | 1987-04-22 | 1987-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63167736U true JPS63167736U (de) | 1988-11-01 |
Family
ID=30895316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6171787U Pending JPS63167736U (de) | 1987-04-22 | 1987-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63167736U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108076583A (zh) * | 2016-11-14 | 2018-05-25 | 富士施乐株式会社 | 集合基板、基板装置的制造方法 |
| WO2024101240A1 (ja) * | 2022-11-09 | 2024-05-16 | 京セラ株式会社 | 多層基板、複合フィルタ、通信装置、多層基板の検査方法、多層基板の製造方法、および複合フィルタの製造方法 |
-
1987
- 1987-04-22 JP JP6171787U patent/JPS63167736U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108076583A (zh) * | 2016-11-14 | 2018-05-25 | 富士施乐株式会社 | 集合基板、基板装置的制造方法 |
| CN108076583B (zh) * | 2016-11-14 | 2021-12-24 | 富士胶片商业创新有限公司 | 集合基板、基板装置的制造方法 |
| WO2024101240A1 (ja) * | 2022-11-09 | 2024-05-16 | 京セラ株式会社 | 多層基板、複合フィルタ、通信装置、多層基板の検査方法、多層基板の製造方法、および複合フィルタの製造方法 |