JPS63167535U - - Google Patents
Info
- Publication number
- JPS63167535U JPS63167535U JP6079687U JP6079687U JPS63167535U JP S63167535 U JPS63167535 U JP S63167535U JP 6079687 U JP6079687 U JP 6079687U JP 6079687 U JP6079687 U JP 6079687U JP S63167535 U JPS63167535 U JP S63167535U
- Authority
- JP
- Japan
- Prior art keywords
- decorative
- board
- direct
- floor structure
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000005338 heat storage Methods 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- 239000002356 single layer Substances 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Floor Finish (AREA)
Description
第１図は本考案の実施例に係る床構造の一部断
面図、第２図は実施態様例の化粧床板の一部拡大
断面図である。
１……コンクリートスラブ、２……断熱材、３
……発熱体、４……凝固式蓄熱板、５……均熱板
、６……化粧床板。
FIG. 1 is a partially sectional view of a floor structure according to an embodiment of the present invention, and FIG. 2 is a partially enlarged sectional view of a decorative floorboard according to an embodiment. 1... Concrete slab, 2... Insulation material, 3
... Heating element, 4 ... Coagulation type heat storage plate, 5 ... Soaking plate, 6 ... Decorative floor board.
補正 昭６２．６．２３
実用新案登録請求の範囲を次のように補正する
。Amendment June 23, 1982 The scope of claims for utility model registration is amended as follows.
【実用新案登録請求の範囲】
１ コンクリートスラブの上面に断熱材と発熱体
と蓄熱板とを順次積層し、蓄熱板の上面に均熱板
を介して化粧床板を張設したことを特徴とする、
直置型遮音性暖房床構造。
２ 化粧床板が単層または複層の合成樹脂板や合
成樹脂注入木材の上面に化粧単板を張設したもの
であることを特徴とする、前記請求範囲第１項記
載の直置型遮音性暖房床構造。
３ 化粧床板の熱伝導率が０．１乃至０．３Ｋｃ
ａｌ／ｍ２ｈ℃、熱伝導抵抗が０．０１乃至０．
０７ｍ２ｈ℃／Ｋｃａｌであることを特徴とする
、直置型遮音性暖房床構造。[Scope of Claim for Utility Model Registration] 1. A product characterized in that a heat insulating material, a heating element, and a heat storage board are sequentially laminated on the top surface of a concrete slab, and a decorative floor board is placed on top of the heat storage board via a heat equalizing plate. ,
Direct-mounted sound-insulating heated floor structure. 2. Direct-mounted sound insulating heating according to claim 1, wherein the decorative floorboard is a single-layer or multi-layer synthetic resin board or synthetic resin-infused wood with a decorative veneer stretched over the top surface. floor structure. 3 Thermal conductivity of decorative floorboards is 0.1 to 0.3Kc
al/m 2 h°C, thermal conduction resistance is 0.01 to 0.
07 m 2 h°C/Kcal.
Claims (1)
と蓄熱板とを順次積層し、蓄熱板の上面に均熱板
を介して化粧床板を張設したことを特徴とする、
直置型遮音性暖房床構造。 ２ 化粧床板が単層または複層の合成樹脂板や合
成樹脂注入板の上面に化粧単板を張設したもので
あることを特徴とする、前記請求範囲第１項記載
の直置型遮音性暖房床構造。 ３ 化粧床板の熱伝導率が０．１乃至０．３Ｋｃ
ａｌ／m2ｈ°ｃ、熱伝導抵抗が０．０１乃至０．
０７m2ｈ°ｃ／Ｋｃａｌであることを特徴とする
、直置型遮音性暖房床構造。[Scope of Claim for Utility Model Registration] 1. A product characterized in that a heat insulating material, a heating element, and a heat storage board are sequentially laminated on the top surface of a concrete slab, and a decorative floor board is placed on top of the heat storage board via a heat equalizing plate. ,
Direct-mounted sound-insulating heated floor structure. 2. Direct-mounted sound insulating heating according to claim 1, wherein the decorative floorboard is a single-layer or multi-layer synthetic resin board or a synthetic resin injection board with a decorative veneer stretched over the top surface. floor structure. 3 Thermal conductivity of decorative floorboards is 0.1 to 0.3Kc
al/m 2 h°c, thermal conduction resistance is 0.01 to 0.
07 m 2 h°c/Kcal, a direct-mounted sound-insulating heating floor structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6079687U JPS63167535U (en) | 1987-04-21 | 1987-04-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6079687U JPS63167535U (en) | 1987-04-21 | 1987-04-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63167535U true JPS63167535U (en) | 1988-11-01 |
Family
ID=30893535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6079687U Pending JPS63167535U (en) | 1987-04-21 | 1987-04-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63167535U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03123018U (en) * | 1990-03-27 | 1991-12-16 |
-
1987
- 1987-04-21 JP JP6079687U patent/JPS63167535U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03123018U (en) * | 1990-03-27 | 1991-12-16 |
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