JPS63166412A - Semi-conductor cleaning device - Google Patents
Semi-conductor cleaning deviceInfo
- Publication number
- JPS63166412A JPS63166412A JP31556686A JP31556686A JPS63166412A JP S63166412 A JPS63166412 A JP S63166412A JP 31556686 A JP31556686 A JP 31556686A JP 31556686 A JP31556686 A JP 31556686A JP S63166412 A JPS63166412 A JP S63166412A
- Authority
- JP
- Japan
- Prior art keywords
- filter pack
- filter
- pack
- contamination
- piezoelectric element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 238000004140 cleaning Methods 0.000 title claims description 19
- 238000011109 contamination Methods 0.000 claims abstract description 19
- 238000012544 monitoring process Methods 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 7
- 230000006866 deterioration Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 238000010606 normalization Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Filtering Of Dispersed Particles In Gases (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は半導体清浄化装置に関し、特に清浄な空間を作
るためのクリーンルームの天井やクリーンベンチに使用
されるものである。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a semiconductor cleaning device, and is particularly used for the ceiling or clean bench of a clean room for creating a clean space.
（従来の技術）
周知の如く、半導体素子の微細化に伴い、製造プロセス
には超清浄空間が必要であり、該超清浄空間を確保する
度にクリーンルームあるいはクリーンベンチを用いてい
る。(Prior Art) As is well known, with the miniaturization of semiconductor devices, an ultra-clean space is required for the manufacturing process, and a clean room or a clean bench is used each time the ultra-clean space is secured.
第４図及び第５図は夫々従来の半導体清浄化装置を示し
、第５図は第４図の部分拡大図である。4 and 5 each show a conventional semiconductor cleaning apparatus, and FIG. 5 is a partially enlarged view of FIG. 4.
図中の１はフレームである。このフレーム１の内側には
、炉材２とセパレータ３からなるフィルターパック（Ｈ
ＥＰＡフィルター）４が設けられている。1 in the figure is a frame. Inside this frame 1, a filter pack (H
EPA filter) 4 is provided.
このように半導体清浄化装置は、空気中の塵埃を高効率
（粒径０．３ｇの粒子に対して９９．９７％以上）で除
去するフィルターパックを備えており、該フィルターパ
ックを通して清浄な、空気を供給している。ところで、
該清浄化装置の該フィルターパックは７〜８年使用して
いると、目詰り等劣化が起り、除塵効率は著しく低下し
てくる。従って、従来は該フィルターパックの劣化がか
なり進み、該正常化装置の性能が低下してから新しいフ
ィルターパックと交換していた。In this way, the semiconductor cleaning device is equipped with a filter pack that removes dust in the air with high efficiency (99.97% or more for particles with a particle size of 0.3 g). supplying air. by the way,
If the filter pack of the cleaning device has been used for 7 to 8 years, it will become clogged and deteriorate, resulting in a significant drop in dust removal efficiency. Therefore, conventionally, the filter pack was replaced with a new one after the filter pack deteriorated considerably and the performance of the normalization device decreased.
しかしながら、従来技術によれば、以下に述べを使用す
ると、清浄空間を確保するはずのクリーンルームの天井
あるいはクリーンベンチから逆に汚染された空気が供給
され、クリーンルームあるいはクリーンベンチ内の空気
清浄度を低下させ、製造プロセス中の半導体素子の特性
を悪化させ、歩留りの低下を招く。また、汚染度合を監
視してもフィルタ一部を取り外すという大変大掛かりな
作業が必要である。However, according to the prior art, when the following is used, contaminated air is supplied from the ceiling or clean bench of the clean room that is supposed to ensure a clean space, reducing the air cleanliness inside the clean room or clean bench. This causes deterioration of the characteristics of semiconductor elements during the manufacturing process, leading to a decrease in yield. Furthermore, even if the degree of contamination is monitored, it is necessary to remove a portion of the filter, which is a very large-scale operation.
（発明が解決しようとする問題点）
本発明は上記事情に鑑みてなされたもので、フィルター
パックの汚染度合を正確に監視してフィルターパックの
交換時期を正確に判断するとともに、フィルターパック
からの逆汚染を未然に防ぐことが可能な半導体清浄化装
置を提供することを目的とする。(Problems to be Solved by the Invention) The present invention has been made in view of the above circumstances, and it is possible to accurately monitor the degree of contamination of the filter pack to accurately judge when to replace the filter pack, and to remove water from the filter pack. An object of the present invention is to provide a semiconductor cleaning device that can prevent back contamination.
［発明の構成］
（問題点を解決するための手段と作用）本発明は、フレ
ームと、このフレームの内側に設けられたフィルターパ
ックと、このフィルターパックの汚染度合を監視する手
段とを具備することを要旨とする。[Structure of the Invention] (Means and Effects for Solving the Problems) The present invention includes a frame, a filter pack provided inside the frame, and a means for monitoring the degree of contamination of the filter pack. The gist is that.
本発明に係るフィルターパックの汚染を監視する手段と
しては、例えばフィルターパックに圧電素子を設けこれ
によりフィルターパックの重量変化を見てフィルターパ
ックの汚染度合を監視する手段、あるいはフィルターパ
ックの一部を着脱可能に構成し、この部分のみを取出し
て全体のフィルターパックの汚染度合を監視する手段、
あるいは着脱可能なフィルターパックの一部に圧電素子
を設けてフィルターパックの汚染度合を監視する手段等
が挙げられる。As a means for monitoring contamination of a filter pack according to the present invention, for example, a piezoelectric element is provided in the filter pack, and a means for monitoring the degree of contamination of the filter pack by observing changes in the weight of the filter pack, or a means for monitoring the degree of contamination of the filter pack, or a means for monitoring the degree of contamination of the filter pack by monitoring changes in the weight of the filter pack. means configured to be removable and to monitor the degree of contamination of the entire filter pack by taking out only this part;
Alternatively, a piezoelectric element may be provided in a part of a removable filter pack to monitor the degree of contamination of the filter pack.
本発明によれば、フィルターパックの汚染度合を正確に
監視してフィルターパックの目詰り等の劣化による正常
化装置の性能低下を未然に防ぐとともに、フィルターパ
ックからの逆汚染をなくすことができる。According to the present invention, it is possible to accurately monitor the degree of contamination of the filter pack to prevent performance deterioration of the normalization device due to deterioration such as clogging of the filter pack, and to eliminate back contamination from the filter pack.
（実施例） 以下、本発明の実施例を図を参照して説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
（実施例１）
第１図は実施例１に係る半導体清浄化装置の説明図であ
る。(Example 1) FIG. 1 is an explanatory diagram of a semiconductor cleaning apparatus according to Example 1.
図中の１１は、フレームである。このフレーム１１の内
側には、フィルターパック１２がフレーム１１と同形状
の圧電素子１３を介して接着されている。このフィルタ
ーパック１２は、アコーディオン状に折込んだ炉材１４
と、この炉材１４間に折込まれたセパレータ１５とから
構成される。11 in the figure is a frame. A filter pack 12 is bonded to the inside of this frame 11 via a piezoelectric element 13 having the same shape as the frame 11. This filter pack 12 consists of a furnace material 14 folded into an accordion shape.
and a separator 15 folded between the furnace materials 14.
前記圧電素子１２には電圧計１６が接続されている。こ
うした構造の装置において、前記電圧計１６の読みより
前記フィルターパック１２の重量を読取り、常時該フィ
ルターパック１２の重量をモニターする。つまり、前記
フィルターパック１２の重量変化を圧電素子による電圧
変化・により検知する。具体的には、例えば通常のフィ
ルターパック１２の使用前の重量は６００ａ＋ｍ（１）
ｘ６００ｕ＋（横）Ｘ１５０ａｍ（厚さ）の大きさで３
〜４Ｋｇであり、２〜３割程度が増した時点で新しいフ
ィルターパックと交換する。A voltmeter 16 is connected to the piezoelectric element 12. In an apparatus having such a structure, the weight of the filter pack 12 is read from the reading of the voltmeter 16, and the weight of the filter pack 12 is constantly monitored. That is, a change in the weight of the filter pack 12 is detected by a voltage change caused by a piezoelectric element. Specifically, for example, the weight of the normal filter pack 12 before use is 600a+m(1)
3 with the size of x600u + (width) x 150am (thickness)
~4Kg, and when it increases by about 20 to 30%, replace it with a new filter pack.
上記実施例１によれば、圧電素子１３及び電圧計１６の
付加によりフィルターパック１２の重量を常時正確にモ
ニターでき、目詰り等によるフィルターパックの劣化を
直ちに知ることができる。According to the first embodiment, the weight of the filter pack 12 can be accurately monitored at all times by adding the piezoelectric element 13 and the voltmeter 16, and deterioration of the filter pack due to clogging or the like can be immediately detected.
また、このことから新しいフィルターパック１２との交
換時期を正しく判断でき、フィルターパックの劣化に起
因する清浄化装置の性能低下を未然に防ぐことができる
。従って、常に超清浄空間を確保することが可能となり
、デバイスの特性及び歩留りが大幅に向上する。Further, from this, it is possible to correctly judge the time to replace the filter pack 12 with a new one, and it is possible to prevent the performance of the cleaning device from deteriorating due to deterioration of the filter pack. Therefore, it is possible to always ensure an ultra-clean space, and device characteristics and yields are greatly improved.
（実施例２）
第２図及び第３図は夫々本発明の実施例２に係る半導体
清浄化装置の説明図である。この装置は、フィルターパ
ック１２の一部をカセット方式にしてその一部１２ａを
着脱可能にした構造となっている。(Embodiment 2) FIGS. 2 and 3 are explanatory diagrams of a semiconductor cleaning apparatus according to Embodiment 2 of the present invention, respectively. This device has a structure in which a part of the filter pack 12 is made into a cassette type, and the part 12a is detachable.
この構造の装置によれば、フィルターパック１２の一部
１２ａが着脱可能になっているため、この部分１２ａの
みを取出し、目視でこの部分１２ａの汚染状況を確認で
きる。従って、フィルタ−バック１２全体の汚染状況を
予測でき、実施例１と同様な効果を得ることができる。According to the device having this structure, since the part 12a of the filter pack 12 is removable, it is possible to take out only this part 12a and visually check the contamination status of this part 12a. Therefore, the contamination status of the entire filter bag 12 can be predicted, and the same effects as in the first embodiment can be obtained.
（実施例３）
第３図は本発明の実施例３に係る半導体洗浄化装置の説
明図である。同装置は、上記実施例１及び実施例２の夫
々の思想を組入れたもので、着脱可能にしたフィルター
パック１２の一部１２ａに枠状の圧電素子１３を設け、
かつ該圧電素子１３に電圧計１６を接続させたことを要
旨とする。(Embodiment 3) FIG. 3 is an explanatory diagram of a semiconductor cleaning apparatus according to Embodiment 3 of the present invention. The device incorporates the ideas of the first and second embodiments described above, and a frame-shaped piezoelectric element 13 is provided in a part 12a of a detachable filter pack 12.
The gist is that a voltmeter 16 is connected to the piezoelectric element 13.
なお、上記実施例２及び３において、着脱自在なフィル
ターパックの大きさが図示されているものに限らないこ
とは勿論である。In addition, in the above-mentioned Examples 2 and 3, it goes without saying that the size of the detachable filter pack is not limited to that shown in the drawings.
［発明の効果コ
以上詳述した如く本発明によれば、フィルターパックの
汚染度合を正確に監視できフィルターパックの交換時期
を正確に判断できるとともに、フィルターパックからの
逆汚染を未然に防止してデバイスの特性及び歩留りを大
幅に向上しえる高信頼性の半導体清浄化装置を提供でき
る。[Effects of the Invention] As detailed above, according to the present invention, it is possible to accurately monitor the degree of contamination of the filter pack, accurately judge when to replace the filter pack, and prevent back contamination from the filter pack. A highly reliable semiconductor cleaning apparatus that can significantly improve device characteristics and yield can be provided.
第１図は本発明の実施例１に係る半導体清浄化装置の説
明図、第２図は本発明の実施例２に係る半導体清浄化装
置の説明図、第３図は本発明の実施例′３に係る半導体
清浄化装置の説明図、第４図は従来の半導体清浄化装置
の説明図、第５図は第４図の部分拡大図、第６図は実施
例２に係る装置のフィルターパック部分の全体図の説明
図である。
１１・・・フレーム、１２・・・フィルターパック、１
３・・・圧電素子、１４・・・炉材、１５・・・セパレ
ータ、１６・・・電圧計。
出願人代理人 弁理士 鈴江武彦
第１図
第２図
￥＆３図
第４図1 is an explanatory diagram of a semiconductor cleaning apparatus according to a first embodiment of the present invention, FIG. 2 is an explanatory diagram of a semiconductor cleaning apparatus according to a second embodiment of the present invention, and FIG. 3 is an explanatory diagram of a semiconductor cleaning apparatus according to a second embodiment of the present invention. 4 is an explanatory diagram of a conventional semiconductor cleaning device, FIG. 5 is a partially enlarged view of FIG. 4, and FIG. 6 is a filter pack of the device according to Example 2. It is an explanatory view of an overall view of a part. 11...Frame, 12...Filter pack, 1
3... Piezoelectric element, 14... Furnace material, 15... Separator, 16... Voltmeter. Applicant's agent Patent attorney Takehiko Suzue Figure 1 Figure 2 ￥ & 3 Figure 4
Claims (4)
ィルターパックと、このフィターパックの汚染度合を監
視する手段とを具備することを特徴とする半導体清浄化
装置。(1) A semiconductor cleaning device comprising a frame, a filter pack provided inside the frame, and means for monitoring the degree of contamination of the filter pack.
より前記フィルターパックの重量を計算することを特徴
とする特許請求の範囲第１項記載の半導体清浄化装置。(2) The semiconductor cleaning apparatus according to claim 1, characterized in that the filter pack is provided with a pressure bonding element, and the weight of the filter pack is calculated based on this.
ことを特徴とする特許請求の範囲第１項記載の半導体清
浄化装置。(3) The semiconductor cleaning device according to claim 1, wherein a portion of the filter pack is detachable.
とともに、この部分に圧着素子を設けてフィルターパッ
ク部分の重量を計算することを特徴とする特許請求の範
囲第１項記載の半導体清浄化装置。(4) The semiconductor cleaning apparatus according to claim 1, wherein a part of the filter pack is made detachable and a pressure-bonding element is provided in this part to calculate the weight of the filter pack part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31556686A JPS63166412A (en) | 1986-12-26 | 1986-12-26 | Semi-conductor cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31556686A JPS63166412A (en) | 1986-12-26 | 1986-12-26 | Semi-conductor cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63166412A true JPS63166412A (en) | 1988-07-09 |
Family
ID=18066885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31556686A Pending JPS63166412A (en) | 1986-12-26 | 1986-12-26 | Semi-conductor cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63166412A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0414115U (en) * | 1990-05-18 | 1992-02-05 | ||
| US6001151A (en) * | 1997-04-11 | 1999-12-14 | Aac Eurovent Limited | Filter assemblies |
| US7595012B2 (en) | 2006-12-26 | 2009-09-29 | Fanuc Ltd | Injection molding machine and method of adjusting control condition for reverse rotation of screw in injection molding machine |
-
1986
- 1986-12-26 JP JP31556686A patent/JPS63166412A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0414115U (en) * | 1990-05-18 | 1992-02-05 | ||
| US6001151A (en) * | 1997-04-11 | 1999-12-14 | Aac Eurovent Limited | Filter assemblies |
| US7595012B2 (en) | 2006-12-26 | 2009-09-29 | Fanuc Ltd | Injection molding machine and method of adjusting control condition for reverse rotation of screw in injection molding machine |
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