JPS63166040A - Optical recording medium and its production - Google Patents

Abstract

PURPOSE:To securely adhere an underlying layer and substrate and to prevent deterioration after writing of a record by providing the underlying layer consisting of a coated film contg. the hydrolyzate of a silicon compd. having at least one -NH- group and silicon bonded with a hydrolyzable group in the molecule between a recording layer and the substrate. CONSTITUTION:The underlying layer 5 and the recording layer 6 are formed on the substrate 31. The underlying layer 5 is the coated film of the hydrolyzate of the silicon compd. having the -NH- group and the silicon bonded with the hydrolyzable group in the molecule. The silicon compd. which is >=one kinds of compds. having at least one epoxy group and >=one kinds of compds. having at least one amino group and in which at least one compds. have the hydrolyzable group is used for such silicon compd. Said compd. is the reaction product obtd. by the reaction of said epoxy group and amino group. The adhesion between the substrate 31 consisting of the resin, more particularly polycarbonate resin and the underlying layer 5 is thereby enhanced and the deterioration in adhesive strength after writing of the record is obviated.

Description

[Detailed description of the invention]! BACKGROUND OF THE INVENTION TECHNICAL FIELD The present invention relates to an optical recording medium, particularly a heat mode optical recording medium, and a method for manufacturing the same.

Prior art and its problems Optical recording media, especially optical recording disks, have the characteristic that the recording medium does not deteriorate due to wear and tear because there is no contact between the medium and the writing or reading head.For this reason, research and development of various optical recording disks has been carried out. is being carried out.

Among such optical recording disks, heat mode optical recording disks are being actively developed because they do not require development in a dark room.

This heat mode optical recording disk is an optical recording disk that uses recording light as heat. For example, a part of the medium is melted or removed using recording light such as a laser, and a part of the medium is melted or removed to create a pit. There is a pit-forming type in which a small hole is formed to perform an i-input, information is recorded using the pit, and the pit is detected with a readout light to continue reading.

Among such bit-forming type disks, particularly those using a semiconductor laser as a light source, which allows for miniaturization of the device, the recording layer has so far been made of a material mainly composed of Te.

In addition, in recent years, since Te-based materials are harmful, and there is a need for higher sensitivity and lower manufacturing costs, organic materials have been replaced with Te-based materials, using the dye L. An increasing number of proposals and reports have been made regarding media using recording layers of this type (Japanese Patent Laid-Open No. 60-203488, etc.)
.

In a bit-forming type optical recording medium having such a recording layer made of a dye or the like, a so-called air sandwich structure is preferably used in order to prevent deterioration of sensitivity and S/N ratio.

Further, when a recording layer containing these dyes is formed on a substrate and recording/reproduction is performed, recording/reproduction is normally performed by irradiating aging light and readout light from the back side of the substrate.

However, when using a substrate made of transparent resin such as polycarbonate or acrylic resin, the surface of the resin substrate is damaged by the coating solvent used when coating the recording layer, reducing the reflectance of the recording layer and reducing the readout S. There is a drawback that the /N ratio cannot be kept high enough.

Furthermore, during long-term storage, there is a risk that dyes and other additives may dissolve and diffuse into the substrate resin, resulting in a decrease in reflectance.

Furthermore, writing causes damage such as denting of the substrate due to heat, which also reduces the S/N ratio. Moreover, the noise after erasing increases.

In contrast, the present inventors have proposed the use of a coating film of a colloidal particle dispersion of a silicon-based condensate as the underlayer (Japanese Patent Laid-Open No. 60-203489).

This eliminates the above-mentioned disadvantages in the case of acrylic resins.

However, when the substrate is made of polycarbonate resin, there is a drawback that the adhesion between the base layer and the substrate is insufficient.

■ Purpose of the Invention The purpose of the present invention is to ensure that the adhesion between the underlayer and the substrate is strong, that there is no deterioration even after recording, that is, there is little variation in reflectance, that the error rate is low, and that the reading sensitivity is high. An object of the present invention is to provide an optical recording medium with stable and good readout S/N ratio and tracking control, and a method for manufacturing the same.

■Disclosure of the invention Such objects are achieved by the invention described below.

That is, the present invention provides an optical recording medium having a recording layer of a dye or a dye composition on a substrate made of polycarbonate resin.
The present invention is an optical recording medium characterized by having a base layer of a coating film containing a hydrolyzate of a silicon compound having silicon to which an H-group and a hydrolyzable group are bonded.

Further, a second invention provides an optical recording medium having an underlayer on a substrate made of polycarbonate resin, and a recording layer of a dye or a dye composition on the underlayer, in which at least one compound is hydrolyzed. At least one type of silicon compound having at least one epoxy group and at least one compound having at least one amino group are used, and these are reacted to form at least one -NH in the molecule. - Obtain a silicon compound having silicon to which a hydrolyzable group is bonded, hydrolyze this compound and coat it on a substrate to form an underlayer, and apply a recording layer on this underlayer. This is a method of manufacturing an optical recording medium characterized by the following.

■　Specific structure of the invention Hereinafter, a specific configuration of the present invention will be explained in detail.

As an example of the optical recording medium of the present invention, FIG. 1 shows a single-sided recording type optical recording disc.

In the case of single-sided recording, the optical recording disc 1 includes an optical recording portion 2 having a base layer 5 and a recording layer 6 on a disc-shaped substrate 31'', and a protection plate 35, as shown in FIG. have

In this case, the substrate 31 used is made of polycarbonate resin and has a disk shape with a hole in the center into which the rotating shaft is inserted.

Then, the substrate 31 responds to write and read light.
Since it is substantially transparent, writing and reading can be performed from the back side of the board, which is advantageous in terms of sensitivity, S/N ratio, etc., and is also advantageous in terms of mounting, such as preventing flaking. .

The polycarbonate resin may be any of aliphatic polycarbonate, aromatic-aliphatic polycarbonate, and aromatic polycarbonate, but aromatic polycarbonate resin is particularly preferred. Among these, polycarbonate resins made from bisphenol are preferred in terms of melting point, crystallinity, handling, etc. Among them, bisphenol A type polycarbonate resin is most preferably used.

Moreover, the polycarbonate resin may be a modified product thereof or a blended product with other resins.

In addition, the number average molecular weight of the polycarbonate resin is 10,
It is preferable that it is about 000 to 15,000.

It is preferable that tracking grooves be formed on the recording layer forming surface of such a substrate.

The depth of the groove is about λ/8n, especially λ/7n~λ
/ 12 n (where n is the refractive index of the substrate). Further, the width of the groove is approximately the width of a track.

Formation of such grooves on the substrate may be performed by a resin injection molding method.

It is preferable that writing light and reading light are irradiated from the back side of the substrate, using the recording layer located in the concave or convex portions of the groove as a recording track section.

With this configuration, the writing sensitivity and the reading S/N ratio are improved, and the tracking control signal is also increased.

Further, the protection plate 35 may be made of the same material as the substrate 31. Moreover, the protection plate 35 may be opaque.

A plurality of protrusions for integrating the substrate may be provided on the outer circumferential portion and/or the inner circumferential portion of at least one of the substrate and the protection plate. Further, integration may be performed using a connecting member as a spacer.

In FIG. 1, a plurality of protrusions 71, 75 are provided on the outer and inner circumferences of the protection plate 35, and the protection plate 35 is integrated via these protrusions.

On such a substrate 31, a base layer 5 and a recording layer 6 are formed.

The upper layer 5 is a coating film of a hydrolyzate of a silicon compound having silicon to which an -NH- group and a hydrolyzable group are bonded in the molecule.

Such silicon compounds contain at least one epoxy group.
and at least one compound having an amino group.
A reaction product obtained by reacting an epoxy group with an amino group using at least one compound having a hydrolyzable group, at least one of which is a silicon compound having a hydrolyzable group. It is.

Examples of reactions for obtaining such reaction products include the following.

(1) Reaction between a silicon compound having an epoxy group and a hydrolyzable group and a silicon compound having an amino group and a hydrolyzable group.

(2) Reaction between a silicon compound having an epoxy group and a hydrolyzable group and a compound having an amino group, particularly a polyamino compound.

(3) Reaction of a silicon compound having an amino group and a hydrolyzable group with a compound having an epoxy group, especially a polyepoxy compound; (4) A composite reaction of the above (1) to (3).

In such a case, the hydrolyzable group possessed by the silicon compound is preferably -〇R1, (where R1 is a substituted or unsubstituted aliphatic hydrocarbon residue, aromatic hydrocarbon residue, or acyl group). , this -0R1 is directly bonded to Si.

Among these, R1 is particularly carbon L9. f
Preferred are alkyl groups, alkenyl groups, phenyl groups, naphthyl groups, alkylcarbonyl groups, and phenyl to naphthylcarbonyl groups having numbers 1 to 5. Further, when the silicon compound has an amino group or an epoxy group, it is preferable that these groups are bonded to a suitable group and indirectly bonded to silicon. Suitable groups in this case are preferably substituted or unsubstituted aliphatic or aromatic hydrocarbon residues, especially alkyl groups. As for these substituents, in particular, a plurality of these alkyl groups can be replaced by -NH-1
Examples include groups linked by -〇-1-5- and the like.

Furthermore, as the compound other than the silicon compound having an amino group or an epoxy group, various known polyamino compounds and polyepoxide compounds are suitable.

In addition, although the amino group in the above may be a substituted amino group, it is preferable that it is -NH2.

Next, each of these raw material compounds will be explained in more detail.

(A) Silicon compound having an epoxy group and a hydrolyzable group Those represented by the following formula are preferred.

Formula % Formula % In the above formula, m is an integer of 1 to 3, preferably 3, and n is 1 or 2, preferably l.

In the above formula, R1 represents an aliphatic hydrocarbon residue, an aromatic hydrocarbon residue or an acyl group.

These may be substituted products.

Particularly preferred are alkyl groups, alkenyl groups, phenyl groups, naphthyl groups, alkylcarbonyl groups, and phenyl to naphthylcarbonyl groups having 1 to 5 carbon atoms.

R2 represents a substituted or unsubstituted hydrocarbon residue, in particular an alkylene group or an arylene group.

In this case, the substituted hydrocarbon residue is preferably one in which a plurality of alkylene groups and arylene groups are linked in a 10-1 chain. Moreover, a phenylene group is suitable as the arylene group.

Among these, particularly preferred are alkylene groups, alkyleneoxyalkylene groups, and the like. The carbon atom f number of each of these alkylene groups is preferably 1 to 5.

Note that R2 and the epoxy group may be bonded to each other to form a condensed ring of an epoxy ring and a cycloalkyl ring.

Preferred specific examples are listed below, but the invention is not limited to these.

(A-1) β-(3,4 epoxycyclohexylethyltrimethoxysilane (A-2) γ-glycidoxypropyltrimethoxysilane υ (A-3) γ-glycidoxypropylmethyljethoxysilane (B) Other compounds having epoxy groups, especially polyepoxide compounds, are preferred.

As the polyepoxide compound, the following are suitable.

i) Glycidyl ether of polyether (B-1) Polyethylene glycol diglycidyl ether (B-2
) Polypropylene glycol diglycidyl ether (
B-3) Neopentyl glycol diglycidyl ether (B-4) 1,6-hexanediol diglycidyl ether (B-5) Glycerol Polyglycidyl ether (B-6) Trimethylolpropane Polyglycidyl ether Tomoe / Self / 11 !5? ? + fi/- sharp (B-8) polyglycerol polyglycidyl ether (B-9) (B-10) (B-11) (B-12) (B-13) (B-14) (B-15) (B-16) Sorbitol polyglycitolether I (B-17) ii) Glycidyl ether of dibasic acid (B-18)
0-phthalic acid diglycidyl ester υ 1ii) Glycidylamine (B-19) (B-20) (B-21) υ (B-22) (B-23) (C) Epoxy group and hydrolyzable group have [expression]
Si (OR1) rn (84NHZ) n (R
3) In the 4-m-nL notation, m is an integer of 1 to 3, and n is 1 or 2, preferably 1.

R1 and R3 have the same meaning as above.

R4 represents a substituted or unsubstituted hydrocarbon residue, in particular an alkylene group or an arylene group.

In this case, as substituted hydrocarbon residues, a plurality of alkylene groups and arylene groups are -NH-1-N-1S, -NH
Those connected to each other by a suitable linking group such as CO- are preferred. Alternatively, substituted or unsubstituted amide groups, carbamoyl groups, etc. are also suitable. Further, as the arylene group, a phenylene group is suitable.

Among these, particularly preferred are alkylene groups, alkylenethioalkylene groups, alkyleneaminoalkylene groups, alkyleneaminoalkyleneaminoalkylene groups,
carbonylaminoalkylene group, etc. The carbon atom Y-number of each alkylene group in Kowara is preferably 1 to 5.

Specific examples are given below, but the invention is not limited to these.

(C-1) γ-Aminopropyltriethoxysilane 112 NC3If 6 Si (OC2t16
) 3(C-2)Aminoethylaminomethyltrimethoxysilane 112 FIC112(:II□N (:H□5i
(OCH3) 3■ (C-3) Allyloxy-2-aminoethylaminomethyldimethylsilane (C-4) 3- (2-aminoethylaminoprobyl)
Jetoxymethylsilane (C-5) 3- (2-aminoethylaminopropyl)
Trimethoxysilane 82 N((N2) 2 NH(C112):+5i
(0(:Ha)3(C-6)N-(3-triethoxy
silylpropyl) urea ((:2■sO) ssi ((:112) N -C
-Nl(2HI+ (C-7)3 [2-(2-aminoethylaminoethylamino)probylcotrimethoxysilane (11:112) 2 N(C1”2)2 NN2■ 1N \(C:H2) 35i (OClb)3(D) Other compounds having an amino group, particularly polyamino compounds, are preferred.

As the polyamino compound, the following are suitable.

i) Aliphatic amine (D-1) ethylene amine group 82 N((:N2 (:N2 N1() nHn=
1-6 (D-2) N-aminoethylpiperazine (D
-3) Metaxylylene diamine (D-4) 1,3-bis(aminomethyl)cyclohexane (D-5) (D-6) Polyamide (leak) ii) Cycloaliphatic amine (D-7) Rose Methanediamine (D-8) Mesophorone diamine (D-10) P-phinyndiamine 82 N 6fl+2 (D-11) rn-phinyndiamine (D-12) 4
．． 4'-diaminodiphenylmethane (D-13) 4.4
'-Diamino diphenyl sulfone + 12 N 0 Moxibustion ρ1!2 (D-14) Dicyandiamide N112-(nee NlllCN I 1l (D-15) l12 Mu (D-16) Using these raw materials, epoxy group and amino group Perform the reaction.

During the reaction, at least one NR2 in the molecule -
It is preferable that 2 moles of epoxy groups per 821 moles of N do not react completely, so that -NH- groups remain in the reaction product. These --NH- groups react with the polycarbonate, resulting in very good adhesion.

The desired reaction products are as described above, and typical examples are listed below.

(I) Reaction product between the above (A) and (C), especially n=1
The following items can be changed.

(R3)3-- (ORt)Si-R2CH(OH)-
(:R2-NH-R4Si(ORt)a(R3)3-+
+5 (II) Reaction products of the above (A) and (D), especially n
With (A) where =1 and the diamino compound H2Nl2 NR2, the following can be obtained.

((R3)3-(ORt), Si-LCII(Ojl)
-C+Iz-Nll±2L2 (III) 1: Note (B)
The reaction product of (D), especially (B) with n=1, and a dieboxide compound t, t (CHCH20)2 can change the above.

((11+)3-(ORt), Si-R4NHCH2C
H(O)l) R2+ 212 In addition, depending on the raw materials of (A) to (D), predetermined reaction products may be changed according to the above. In this case, as is clear from the above, it is preferable that at least one -NH- group remains in the reaction product.

As a solvent for such a reaction, various alcoholic solvents such as n-propanol, isopropanol, butanol, or a mixture thereof are used, and the solution concentration is 5 to 3.
The reaction is carried out at about 0 wt % at room temperature to about 80° C. for 0.1 to 3 hours.

An equivalent to twice the amount of water is added to this reaction product solution, and water decomposition is carried out at room temperature to about 80° C. for about 1 to 15 hours. As a result, the OR1 group undergoes hydrolysis and 5t-0
-Si bond occurs.

The hydrolyzate thus obtained is colloidal.

Further, a stabilizer such as ethylene glycol, a surfactant, a reaction accelerator, etc. are added to the solution as necessary.

The hydrolyzate solution may be applied by a conventional method using a spin cord or the like.

Then, drying may be performed at 30 to 90°C for about 1 to 15 hours.

The base layer formed in this way is 15i-O-Si.
- The presence of a bond can be confirmed by Auger spectroscopy or the like.

Further, the presence of an NH group can be confirmed by FTIR or the like. This NH group reacts with polycarbonate.

The thickness of the stratum 5 is approximately 0.005 to 0.2 μm. Particularly preferably, the thickness is about 0.008 to 0.1 μm.

When the F layer exceeds 0.2 μm, the pre-group is buried and a tracking signal cannot be obtained, and o, oos μm
If it is less than that, the solvent resistance will be poor and the effects of the present invention will not be sufficiently exhibited.

The recording layer 6 may be of various types. just,
In the present invention, it is preferable to consist of a dye alone or a dye composition.

The dye to be used may be appropriately determined from among those that effectively absorb the wavelengths of the writing light and reading light. In this case, these light sources are
Since it is preferable to use a semiconductor laser because the device can be made smaller, the dyes may be cyanine-based, phthalocyanine-based, anthraquinone-based, azo-based, triphenylmethane-based,
Preferred are biryllium and thiapyrylium salts.

Further, when the five-dye composition is used as a recording layer, a self-oxidizing resin such as nitrocellulose, or a thermoplastic resin such as polystyrene or nylon can be contained. Furthermore, a quencher may be included in order to prevent oxidative deterioration of the dye. Furthermore, other additives may also be included.

In such a case, a mixture of an indolenine cyanine dye and a quencher such as bisphenyldithiol is particularly preferred.

It is also preferable to use these as an ionic bond between a dye cation and a quencher anion.

The recording layer can be made of ketone type, ester type, ether type,
A spinner coat or the like may be applied using an aromatic solvent, a halogenated alkyl solvent, an alcohol solvent, or the like.
In the present invention, solvent resistance is improved by providing the underlayer, and an optimal solvent can be selected from a wide range of solvent groups.

Such a recording layer 6 may have a thickness of 0.01 to 10 μm.

In addition, when coating the recording layer, the viscosity of the coating solution is 0.5~
10cp, spinner rotation speed 500-1,000r
Approximately pm.

In addition, when providing grooves for tracking control, the thickness of the recording layer is 0.2 μm or less, more preferably 0.05 to 0.0 μm.
- It is preferable to set it as 15 micrometers.

At this time, writing sensitivity is improved. Further, due to multiple reflections in the recording layer, the reflectance becomes extremely high, and the read S/N ratio becomes extremely high. Then, the difference in reflectance based on the difference in thickness between the recording track portion and other areas increases, making tracking control easier.

An upper layer of the recording layer can also be provided in such a recording portion.

A substrate 31 having an F formation layer 5 and a recording layer 6, and a protection plate 3
5 through the protrusion 71.75, usually,
Ultrasonic fusion may be used.

When applying the M1 sonic wave front, for example, a rod-shaped projection 71.
75 is heated effectively, the fusion efficiency is good, the workability is good, the adhesive strength is high, and the gap distance can be controlled with precision.

When the deformation is large and the protrusion density is high, an airtight outer peripheral wall may be formed over the entire surface.

Also, vents can be formed between the partition walls.

The vent is formed in the gap between the protrusions.

Fixation can also be achieved by injecting adhesive.

Alternatively, the two substrates may be integrated using a combination of adhesion and fusion, in which a hot melt resin is applied as an adhesive to the peripheral edge of the substrate, and then both substrates are combined and subjected to ultrasonic fusion.

In order to form such a plurality of rod-shaped protrusions, it is sufficient to process a master or a stand bar and integrally mold them at the time of molding the substrate.

Since then, we have explained the integration using rod-shaped protrusions, but
In addition, various known integrated structures are possible.

In addition, although we have discussed the case of single-sided recording, 1
In the present invention, a double-sided recording medium may be used in which recording layers are provided on both substrates. In this case, it is necessary that both substrates be made of substantially transparent resin, and that both substrates be provided with an underlayer.

(2) Specific Effects of the Invention The optical recording medium of the present invention is a normal disk, and a rotating disk is irradiated with writing light from the back side of the substrate. As a result, bits are preferably formed in a track shape in the recording track portion located in the groove recess.

The bits formed in this manner are detected by emitting readout light from the back side of the substrate while rotating and detecting the reflected light.

In order to control tracking, the reflected light is usually split while writing and reading.
Introduce it to a pair of sensors divided into two. At this time, when the beam spot begins to deviate from the recording track section, the primary light due to the interference effect due to the phase difference due to the step in the groove is biased toward one sensor, so the signals from both sensors are detected and a track error signal is detected. Ru.

Note that the bits once formed on the recording layer can be erased by light or heat and then written again.

In addition, as a light source used for reading and reading,
Although various lasers can be used, it is particularly preferable to use a t-conductor laser.

■Specific Effects of the Invention The optical recording medium of the present invention, particularly the optical recording disk, has a coating of a hydrolyzate of a reaction product resulting from a reaction between an epoxy group and an amino group on the side on which the recording layer is provided of a resin, especially a polycarbonate resin substrate. Remove the base layer of the membrane.

For this reason, the adhesion between the resin, especially the polycarbonate resin substrate, and the underlying layer becomes extremely strong, and peeling occurs between the resin substrate and the underlying layer even when kept at a high temperature of 7F! 1 yen error can be prevented.

Furthermore, there is no deterioration in adhesive strength even after recording.

Furthermore, even if bending stress is applied to the recording layer, cracks are extremely difficult to form.

Since the recording layer is formed from the top of this underlayer, the deterioration of the resin substrate due to the solvent for coating the recording layer is extremely small, so the low F of the reflectance of the recording layer is small, and the readout S/N ratio is is significantly improved.

Furthermore, there is no deterioration in reflectance over time due to storage.

(2) Specific Examples Hereinafter, the present invention will be explained in more detail by giving specific examples of the present invention.

Examples Various types of media were obtained by providing base layers of different thicknesses on polycarbonate resin substrates having a diameter of 12 cm, and providing recording layers thereon.

The base layer was produced as described below.

A total of 10% of the above A-22 moles and D-111 moles were dissolved in isopropanol and reacted at 30°C for 5 hours. The presence of -NH- was confirmed in this reaction product.

Next, twice the amount of water was added to this, and the mixture was reacted at 30° C. for 10 hours to perform hydrolysis.

This material was coated with a spin cord and then dried at 80° C. for 10 hours.

The thickness of the base layer was 100 and 400 layers (sample No. 1.2).

The recording layer contains indolenine cyanine dyes, (1,3,
Cyclohexanone is used as a solvent for a dye conjugate of a 3,1', 3', 3'-hexatrimethylindotricarbocyanine cation) and a bisphenyldithiol quencher (his(trichlorophenyldithiol)Ni anion). A layer was applied to a thickness of 0.05 μm using a 2% solution.

In sample No. 1, the compounds used for the underlayer are A-1 and D-1 (n=1), C-1 and B-5, and A-2.
Sample Nos. 3 to 5) were obtained in the same manner as Sample No. 1.2, except that C-1 was replaced with C-1.

The thickness of the stratum was set at 400 people.

For comparison, sample No.
A sample similar to 2 was created.

For the base layer, mix ethyl acetate and ethyl alcohol in a ratio of 10:11.
S i (OC2
After adding H5)4 at a ratio of 2/25 to ethyl acetate,
The solution left for 3 to 4 days was treated with n-propatool for 1 more time.
After diluting 0 times, a layer was coated on a substrate and processed at 60° C. for 30 minutes to form a layer.

In this case, the particle size of the silicon oxide colloid was 50-80.

The thickness of the F layer was 400 people (sample No. 6)
.

In addition, a sample without a base layer was also created (sample No.
, 7).

The following measurements were performed using the following samples.

Adhesive strength between substrate and underlayer at initial stage, after recording, and at 60°C and 90%RH for each sample
The adhesive strength after being left in the atmosphere for 10 days was evaluated by the residual rate (%) on the substrate when each sample was cross-cut 11 times in the vertical and horizontal directions at 1 ++ m intervals and a peel test was performed using cellophane tape.

Note that recording was performed at a recording power of 3.8n+W and a linear velocity of 1.
The speed was 3 m/s. In addition, when the groove was tracked at 830 nm from the back side of the substrate using an optical disk drive device and the reflection level and C/N ratio were measured, the sample of the present invention had good characteristics and had good solvent resistance. gender has been confirmed.

The results are shown in Table 1.

Table 1 1 A-2+D-11100100100100
2A-2+D-114001001001004C-1
+B-54001001001005A-2+C-14
001001001007 (1 praise) - From the results shown in Table 1, the effects of the present invention are clear.

It was confirmed that samples Nos. 1 to 5 had -3i-0-Si= bonds by Auger spectroscopy and -NH- groups by FTIR.

[Brief explanation of the drawing]

FIG. 1 is a cut end view showing an example of the optical recording disk of the present invention. Explanation of symbols 1... Optical recording disk, 2... Optical recording portion, 31... Substrate, 35... Protective plate, 5...
... Base layer, 6... Recording layer, 71.75... Rod-shaped projection FIG, 1

Claims (2)

[Claims] (1) In an optical recording medium having a recording layer of a dye or a dye composition on a substrate made of polycarbonate resin, at least one -N in the molecule is disposed between the recording layer and the substrate.
An optical recording medium characterized in that it has an underlayer of a coating film containing a hydrolyzate of a silicon compound having silicon to which an H-group and a hydrolyzable group are bonded. (2) When producing an optical recording medium that has an underlayer on a polycarbonate resin substrate and a recording layer of a dye or a dye composition on this underlayer, at least one compound has a hydrolyzable group. using at least one silicon compound having at least one epoxy group and at least one compound having at least one amino group, and reacting them to form at least one -NH- group within minutes. The method is characterized by obtaining a silicon compound having silicon to which a hydrolyzable group is bonded, hydrolyzing this compound and coating it on a substrate to form an underlayer, and coating the recording layer on this underlayer. A method for manufacturing an optical recording medium.