JPS6316456U - - Google Patents
Info
- Publication number
- JPS6316456U JPS6316456U JP10941986U JP10941986U JPS6316456U JP S6316456 U JPS6316456 U JP S6316456U JP 10941986 U JP10941986 U JP 10941986U JP 10941986 U JP10941986 U JP 10941986U JP S6316456 U JPS6316456 U JP S6316456U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- protrusion
- hybrid integrated
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000002788 crimping Methods 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10941986U JPS6316456U (en, 2012) | 1986-07-18 | 1986-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10941986U JPS6316456U (en, 2012) | 1986-07-18 | 1986-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6316456U true JPS6316456U (en, 2012) | 1988-02-03 |
Family
ID=30987500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10941986U Pending JPS6316456U (en, 2012) | 1986-07-18 | 1986-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6316456U (en, 2012) |
-
1986
- 1986-07-18 JP JP10941986U patent/JPS6316456U/ja active Pending