JPS63164468U - - Google Patents
Info
- Publication number
- JPS63164468U JPS63164468U JP5580087U JP5580087U JPS63164468U JP S63164468 U JPS63164468 U JP S63164468U JP 5580087 U JP5580087 U JP 5580087U JP 5580087 U JP5580087 U JP 5580087U JP S63164468 U JPS63164468 U JP S63164468U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- mount
- adhesive tape
- taping
- creases
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000011295 pitch Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Packages (AREA)
Description
図面は本考案の一実施例を示し、第１図は折曲
げた後の状態を示す正面図、第２図は折曲げる前
の状態を示す平面図である。
１…電子部品、２…リード線、３…台紙、４…
粘着テープ、６…折目。
The drawings show an embodiment of the present invention, with FIG. 1 being a front view showing the state after being folded, and FIG. 2 being a plan view showing the state before being folded. 1...Electronic component, 2...Lead wire, 3...Mount, 4...
Adhesive tape, 6...folds.
Claims (1)
テープとにより保持するとともに、この電子部品
間の台紙と粘着テープに包装箱の長さに相当する
ピツチ毎に折目を入れたテーピング部品において
、この折目に隣接する電子部品が互いに接触しな
いようにしたことを特徴とするテーピング部品。 In the taping part, lead wires of electronic components are held at regular intervals by a mount and adhesive tape, and creases are made in the mount and adhesive tape between the electronic components at pitches corresponding to the length of the packaging box. A taping component characterized in that electronic components adjacent to this fold are prevented from coming into contact with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5580087U JPS63164468U (en) | 1987-04-13 | 1987-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5580087U JPS63164468U (en) | 1987-04-13 | 1987-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63164468U true JPS63164468U (en) | 1988-10-26 |
Family
ID=30884037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5580087U Pending JPS63164468U (en) | 1987-04-13 | 1987-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63164468U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5732620U (en) * | 1980-07-31 | 1982-02-20 |
-
1987
- 1987-04-13 JP JP5580087U patent/JPS63164468U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5732620U (en) * | 1980-07-31 | 1982-02-20 |
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