JPS63164154A - Tungsten wire for bulb filament - Google Patents
Tungsten wire for bulb filamentInfo
- Publication number
- JPS63164154A JPS63164154A JP30880086A JP30880086A JPS63164154A JP S63164154 A JPS63164154 A JP S63164154A JP 30880086 A JP30880086 A JP 30880086A JP 30880086 A JP30880086 A JP 30880086A JP S63164154 A JPS63164154 A JP S63164154A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- tungsten wire
- doped
- filament
- light bulb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 title claims 7
- 229910052736 halogen Inorganic materials 0.000 claims description 9
- 150000002367 halogens Chemical class 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000002019 doping agent Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Resistance Heating (AREA)
- Vessels And Coating Films For Discharge Lamps (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
本発明は電球のフィラメントに用いて有効なW線に関し
、更に詳しくは、高温点灯時の耐振性が優れフィラメン
トの変形を起こすことのないハロゲン電球フィラメント
用W線に関する。[Detailed Description of the Invention] [Objective of the Invention] (Industrial Field of Application) The present invention relates to a W wire that is effective for use in the filament of a light bulb, and more specifically to a W wire that has excellent vibration resistance during high-temperature lighting and prevents deformation of the filament. This invention relates to a W wire for halogen light bulb filaments that does not cause any damage.
(従来の技術)
電球のフィラメント例えばハロゲン電球用のフィラメン
トはドープW線で構成されているのが通例である。この
ドープW線は、に、Si 、AMなどの元素(ドープ剤
)が所定量添加されているものであって、純W線に比べ
て再結晶温度が高く、また高温で線輪方向に長大な再結
晶粒を成長せしめ、このことにより粒界すベリに基づく
高温変形を防Iヒする。(Prior Art) A filament for a light bulb, for example a filament for a halogen light bulb, is usually composed of doped W wire. This doped W wire has a predetermined amount of elements (dopants) such as Si and AM added to it, and has a higher recrystallization temperature than pure W wire, and is elongated in the wire direction at high temperatures. This causes the growth of recrystallized grains, thereby preventing high-temperature deformation due to grain boundary burrs.
すなわち、ハロゲン電球の点灯時に、WI!lが高温加
熱され再結晶組織を形成する際に、W線中に微量に存在
する上記ドープ剤が蒸発して軸線方向に並ぶ微細な空孔
の列(整列ドープ孔)を形成し、この整列ドープ孔が線
軸に対して垂直方向への再結晶粒の成長を抑制して、再
結晶温度を高めるとともに線軸方向へ成長した長大再結
晶粒を形成する。このため、ドープW線の高温変形に対
する耐性が大となるのである。In other words, when the halogen bulb is turned on, WI! When L is heated to a high temperature to form a recrystallized structure, the dopant present in a small amount in the W line evaporates and forms a row of fine holes (aligned dope holes) aligned in the axial direction. The doped holes suppress the growth of recrystallized grains in the direction perpendicular to the line axis, increase the recrystallization temperature, and form long recrystallized grains that grow in the line axis direction. Therefore, the resistance of the doped W wire to high temperature deformation is increased.
ところで、このようなドープW線を製造する際には、ま
ずW粉末に所定量のドープ剤を添加したのち、これを常
法により、成形、焼結、転打、伸線工程に通す、この各
工程における条件、例えばドープ剤の添加量、焼結条件
、転打・伸線などの加工昨の加工率の大小などにより、
上記した整列ドープ孔の分散状態が変化する。By the way, when manufacturing such a doped W wire, first a predetermined amount of dopant is added to the W powder, and then this is passed through the forming, sintering, rolling, and wire drawing processes using conventional methods. Depending on the conditions in each process, such as the amount of dopant added, sintering conditions, and the processing rate before processing such as rolling and wire drawing, etc.
The dispersion state of the above-mentioned aligned doped holes changes.
(発明が解決しようとする問題点)
最近、ハロゲン電球は種々の照明分野で使用されている
が、それに伴ない使用環境は過酷になっている。このよ
うな条件の中で従来から南限されているドープW線のフ
ィラメントでは、点灯時の耐振性が不充分で、点灯での
フィラメントの変形、更には配光の不均一などの問題が
指摘され、より点灯時の耐振性に優れたW線への開発要
求が強まっている。(Problems to be Solved by the Invention) Recently, halogen light bulbs have been used in various lighting fields, but the environment in which they are used has become harsher. Doped W-line filaments, which have traditionally been limited to the south under these conditions, have insufficient vibration resistance when lit, causing problems such as deformation of the filament and uneven light distribution when lit. , there is an increasing demand for the development of W wires that have better vibration resistance when lit.
本発明は上記要求に応えるべく開発されたハロゲン電球
のフィラメント用W線の提供を目的とするものである。The object of the present invention is to provide a W wire for a filament of a halogen light bulb, which has been developed to meet the above requirements.
[発明の構成]
(問題点を解決するための手段・作用)本発明者らは、
上記目的を達成すべく、フィラメントにコイリングする
直前の従来W線の整列ドープ孔の形態につき詳細に観察
したところ、その整列ドープ孔においては、それを構成
する微細空孔の径は概ね0.1〜0.5−程度であり、
これら微細空孔の配列する長さは概ね30−程度である
との事実を見出した。[Structure of the invention] (Means/effects for solving the problem) The present inventors,
In order to achieve the above objective, we closely observed the morphology of the aligned doped holes in the conventional W wire just before coiling into a filament, and found that the diameter of the fine holes constituting the aligned doped holes was approximately 0.1. It is about 0.5-
It has been found that the length of these micropores is approximately 30 mm.
そこで、本発明者らは、ある温度条件下で形成されるこ
の整列ドープ孔の長さを更に長くすれば、ドープ孔の分
散強化に加え、さらにこの列による繊維強化によってよ
り高温変形に対する耐性、ひいては高温点灯時の耐振性
に優れたW線を得るこができるとの着想を抱き、種々の
検討の結果、本発明のW線を開発するに到った。Therefore, the present inventors believe that if the length of the aligned dope holes formed under a certain temperature condition is further increased, in addition to dispersion strengthening of the dope holes, fiber reinforcement by the rows will increase the resistance to high temperature deformation. With the idea that it would be possible to obtain a W wire with excellent vibration resistance during high-temperature lighting, and as a result of various studies, the W wire of the present invention was developed.
すなわち、本発明の電球フィラメント用のW@は、W線
の直径を0.39mmとし、90%溶断電流値の温度に
おける5分間の加熱処理を施した場合に、微細空孔から
成る長さ40−以上で整列分散されていることを特徴と
する。That is, when the W wire for the light bulb filament of the present invention has a diameter of 0.39 mm and is subjected to heat treatment for 5 minutes at a temperature of 90% fusing current value, it has a length of 40 mm consisting of micropores. - It is characterized by being arranged and distributed in the above order.
7に発明のW線は形成される整列ドープ孔の長さに最大
の特徴を有する。7, the W line of the invention has the greatest feature in the length of the aligned doped holes formed.
この整列ドープ孔は、線径が0.39mmのW線を90
%溶断電流値に相当する温度で5分間加熱したときに形
成されるものである。このときの温度は概ね3100℃
である。This aligned dope hole allows the W wire with a wire diameter of 0.39 mm to be
It is formed when heated for 5 minutes at a temperature corresponding to the % fusing current value. The temperature at this time is approximately 3100℃
It is.
整列ドープ孔を構成する個々の微細空孔はその径が0
、5.以下とする。好ましくは062−以下である。こ
の空孔径が大きくなりすぎると、W線中にはいわば“°
ボイド′”が形成された状態となり、高温強度に限らず
常温下にあってもその機械的強度が低下するからである
。The diameter of each micropore constituting the aligned doped hole is 0.
,5. The following shall apply. Preferably it is 062- or less. If this pore diameter becomes too large, there will be a so-called "°" in the W line.
This is because voids ''' are formed and the mechanical strength is reduced not only at high temperatures but also at room temperature.
また、整列ドープ孔の長さは、40μm以上とする。こ
の長さが短すぎる場合は、前述した整列ドープ孔の機能
が低下して高温変形を招き易くなるからである。好まし
くは60戸以上である。Further, the length of the aligned doped holes is 40 μm or more. If this length is too short, the above-mentioned function of the aligned doped holes will deteriorate and high temperature deformation will easily occur. Preferably, the number is 60 or more.
本発明のW線からフィラメントを製作する際には、この
W線を更に伸線して所定線径とし、これを用いてコイリ
ングすればよい。When producing a filament from the W wire of the present invention, the W wire may be further drawn to a predetermined wire diameter, and this may be used for coiling.
(発明の実施例)
ドープ剤の添加量、焼結条件、及び加工率を変化させて
常法により線径0.39mmのドープW線を製造した。(Example of the Invention) A doped W wire with a wire diameter of 0.39 mm was manufactured by a conventional method by changing the amount of dopant added, sintering conditions, and processing rate.
このドープW線にH2気流中で溶断電流の90%に相当
する電流を5分間通電して加熱した。This doped W wire was heated by passing a current corresponding to 90% of the fusing current for 5 minutes in an H2 gas flow.
得られた各ドープW線につき、その単位長さく 1 c
m)を切り出しこの中に形成されている整列ドープ孔の
形状を顕微鏡観察し、微細空孔の径。For each doped W line obtained, its unit length 1 c
m) was cut out and the shape of the aligned doped holes formed therein was observed under a microscope to determine the diameter of the micropores.
整列ドープ孔の長さを測定しその平均値を表に示した。The lengths of the aligned doped holes were measured and the average values are shown in the table.
その後、このドープW線を更に伸線し、線径を20 g
7200 mにまで細径化し、これを用いて250W
用ハロゲン電球のフィラメントにした。After that, this doped W wire was further drawn to a wire diameter of 20 g.
The diameter was reduced to 7200 m, and this was used to generate 250 W.
Used as filament for halogen light bulbs.
ハロゲン電球を点灯した状態で複写機の実装試験を行い
、フィラメントの変形度合を観察した。A mounting test was conducted on the copying machine with the halogen bulb turned on, and the degree of deformation of the filament was observed.
その結果を表に示した。The results are shown in the table.
[発明の効果]
以上の説明で明らかなように、本発明の条件を有するW
線は高温点灯時のフィラメント変形を起こすことがなく
点灯時・非点灯時の耐振性に優れ、一般の白熱電球はも
ちろんハロゲン電球用フィラメントの素材として有用で
ある。[Effect of the invention] As is clear from the above explanation, W having the conditions of the present invention
The wire does not cause filament deformation when lit at high temperatures and has excellent vibration resistance when lit and not lit, making it useful as a material for filaments for general incandescent bulbs as well as halogen bulbs.
Claims (3)
%の溶断電流値の温度における5分間の加熱処理を施し
た場合に、微細空孔から成る長さ40μm以上で整列分
散し得ることを特徴とする電球フィラメント用タングス
テン線。(1) The diameter of the tungsten wire is 0.39 mm, and 90
A tungsten wire for a light bulb filament, characterized in that when subjected to a heat treatment for 5 minutes at a temperature with a fusing current value of %, the tungsten wire can be arranged and dispersed in a length of 40 μm or more consisting of micropores.
範囲第1項に記載の電球フィラメント用タングステン線
。(2) The tungsten wire for a light bulb filament according to claim 1, wherein the micropores have a diameter of 0.5 μm or less.
球用である特許請求の範囲第1項に記載の電球フィラメ
ント用タングステン線。(3) The tungsten wire for a light bulb filament according to claim 1, wherein the tungsten wire for a light bulb filament is for a halogen light bulb.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30880086A JPS63164154A (en) | 1986-12-26 | 1986-12-26 | Tungsten wire for bulb filament |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30880086A JPS63164154A (en) | 1986-12-26 | 1986-12-26 | Tungsten wire for bulb filament |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63164154A true JPS63164154A (en) | 1988-07-07 |
Family
ID=17985460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30880086A Pending JPS63164154A (en) | 1986-12-26 | 1986-12-26 | Tungsten wire for bulb filament |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63164154A (en) |
-
1986
- 1986-12-26 JP JP30880086A patent/JPS63164154A/en active Pending
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