JPS63163247A - Pressure sensor - Google Patents
Pressure sensorInfo
- Publication number
- JPS63163247A JPS63163247A JP31030286A JP31030286A JPS63163247A JP S63163247 A JPS63163247 A JP S63163247A JP 31030286 A JP31030286 A JP 31030286A JP 31030286 A JP31030286 A JP 31030286A JP S63163247 A JPS63163247 A JP S63163247A
- Authority
- JP
- Japan
- Prior art keywords
- pedestal
- sensor element
- molding
- top surface
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- 239000011521 glass Substances 0.000 abstract description 8
- 238000000465 moulding Methods 0.000 abstract description 7
- 239000003960 organic solvent Substances 0.000 abstract description 5
- 230000006866 deterioration Effects 0.000 abstract description 4
- 239000004840 adhesive resin Substances 0.000 abstract description 3
- 229920006223 adhesive resin Polymers 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 abstract description 3
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 229920001296 polysiloxane Polymers 0.000 abstract description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 2
- 206010011224 Cough Diseases 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000005297 pyrex Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、ピエゾ抵抗効果を利用する圧力センサのう
ち、特に樹脂モールド液体を使用するもので、かつ耐溶
剤性、＃腐食性、耐圧性を同時に満足させることのでき
るセンサに関するものであこのセンサは、空・油圧制御
、自動車エンジン制御、ブレーキ関連の圧力スイッチな
どに使用可能である。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a pressure sensor that uses a piezoresistance effect, especially one that uses a resin molded liquid, and that has solvent resistance, #corrosion resistance, and pressure resistance. This sensor can be used for air/hydraulic control, automobile engine control, brake-related pressure switches, etc.
［従来の技術］ 第３図に、従来の圧力センサの一例を示す。[Conventional technology] FIG. 3 shows an example of a conventional pressure sensor.
１０はセンサ素子である。これは、シリコーン単結晶板
に、拡散歪ケージを形成した公知のもので、ピエゾ抵抗
効果により５圧力の変化を電気抵抗の変化に変換する。10 is a sensor element. This is a known device in which a diffusion strain cage is formed on a silicone single crystal plate, and changes in pressure are converted into changes in electrical resistance by piezoresistance effects.
センサ素子ｌＯを台座１２に接合して、チップを構成す
る。The sensor element IO is bonded to the pedestal 12 to form a chip.
センサ素子１０と台座１２との間には、隙間１４が形成
される。A gap 14 is formed between the sensor element 10 and the pedestal 12.
１６は筐体で、たとえば樹脂のモールド品からなる。Reference numeral 16 denotes a housing, which is made of, for example, a resin molded product.
液体１６の表面の中央に四部１８を設け、そこに上記の
台座１２をマウントする。A four part 18 is provided in the center of the surface of the liquid 16, and the above-mentioned pedestal 12 is mounted there.
筐体１６および台座１２を通って、隙ｒｌｒＩ１４に連
通する圧力導入孔２０を設ける。A pressure introduction hole 20 is provided that passes through the housing 16 and the pedestal 12 and communicates with the gap rlrI14.
センサ素子１０から見て′、隙間１４とは反対側にふた
２２をして、センサ素子１０との間に室２４を形成する
。絶対圧型センサの場合、室２４は真空である。A lid 22 is placed on the opposite side of the gap 14 when viewed from the sensor element 10, and a chamber 24 is formed between the sensor element 10 and the lid 22. In the case of an absolute pressure type sensor, chamber 24 is a vacuum.
２６はリードフレームである。26 is a lead frame.
［発明が解決しようとする問題点］
上記の構造の圧力センサの場合、隙間１４と圧力導入孔
２０の形成する空間と、室２４の空間との間にガス漏れ
があってはならない。[Problems to be Solved by the Invention] In the case of the pressure sensor having the above structure, there must be no gas leakage between the space formed by the gap 14 and the pressure introduction hole 20, and the space of the chamber 24.
具体的には、センサ素子１０〜台座１２問および台座１
２〜咳体１６間の２密が、厳密に保持されなければなら
ない。Specifically, sensor element 10 to pedestal 12 questions and pedestal 1
The two Cs between the cough body 16 and the cough body 16 must be strictly maintained.
筐体１６を樹脂モールド品とすると、コスト的に有利で
あるが、特に次の点が問題となる。If the housing 16 is made of a resin molded product, it is advantageous in terms of cost, but the following problems arise in particular.
樹脂製の筐体１６に台座１２をマウントするとき、無機
系接着剤（金属ソルダ、ガラスなど）は、温度や接合性
の問題で、使用できない。When mounting the base 12 on the resin housing 16, inorganic adhesives (metal solder, glass, etc.) cannot be used due to temperature and bonding problems.
そのため、有機系接着剤（エボキン樹脂系、シリコン樹
脂系、フェノール樹脂系など）を使用しなければならな
い。Therefore, it is necessary to use an organic adhesive (evokin resin, silicone resin, phenol resin, etc.).
しかし、有機系接着剤は、被測定流体が、有機溶剤、ガ
ソリンなどの場合、接着強度の劣化を招き、台座１２が
筐体１６から、ｉｆ！離し、センサの破壊に至る。However, when the fluid to be measured is an organic solvent, gasoline, etc., the organic adhesive deteriorates the adhesive strength, and if the pedestal 12 is separated from the housing 16! separation, leading to the destruction of the sensor.
また、接着剤が接合部で均一に塗布されていない場合に
は、圧力漏れが生ずるという問題もあった。There is also the problem that pressure leaks occur if the adhesive is not evenly applied at the joint.
［問題点を解決するための手段］
この発明は、第１図のように、
台座１２の周囲を一体的に樹脂モールド接合することに
よって台座１２と筐体１６を一体化し、上記の問題の解
決を図ったものである。[Means for Solving the Problems] As shown in FIG. 1, the present invention solves the above problems by integrating the pedestal 12 and the casing 16 by integrally joining the periphery of the pedestal 12 with a resin mold. The aim is to
［その説明］
ｆ：ｆＳ１図に、縦断面を示し、そのＩＩ −ＩＩ断面
を第２図に示した。[Explanation] f: fS A vertical cross section is shown in Figure 1, and a cross section taken along II-II is shown in Figure 2.
台座１２は、従来のものは厚板状のものであったが、こ
の場合は、長いパイプ（円筒）状にしている。すなわち
、圧力導入孔２０の方向の長さＡが、それと直角方向の
＠Ｂに比べて、はるかに長くなっている。材質は、パイ
レックスガラス、セラミックスなどのシリコンと物理的
定数が相似のものである。Conventionally, the pedestal 12 has a thick plate shape, but in this case, it has a long pipe (cylindrical) shape. That is, the length A in the direction of the pressure introduction hole 20 is much longer than the length @B in the direction perpendicular thereto. The material is similar in physical constant to silicon, such as Pyrex glass or ceramics.
２８は雄ネジ、３０は０リング溝、３２は０リングであ
って、この部分が測定対象に形成された測定孔の酸ネジ
と螺合する。28 is a male thread, 30 is an O-ring groove, and 32 is an O-ring, and this portion is screwed into the acid thread of the measurement hole formed in the measurement object.
一方、筐体１６の断面は、第２図のごとく六角形状をな
し、ネジ締めに適した形状をなしている。On the other hand, the cross section of the housing 16 has a hexagonal shape as shown in FIG. 2, and has a shape suitable for screw tightening.
この場合、台座１２は、筺体１６のモールド成形時に核
となり、廚体１６と一体的にモールド接合される（ただ
し、このときは台座１２だけで、センサ素子１０は後記
のように、その後接合する）。In this case, the pedestal 12 becomes the nucleus when molding the housing 16 and is integrally molded with the mounting body 16 (however, in this case, only the pedestal 12 is used, and the sensor element 10 is bonded afterwards as described later). ).
したがって、接着剤によらなくても、台座１２〜慎体１
６間は、強固に接合する。Therefore, even without using adhesive, the pedestal 12 to the body 1 can be
Between 6 and 6 are firmly joined.
なお、上記のように台座１２が縦長になっているので、
筺体１６との接合面が長いから、気密の保持に有利にな
る。In addition, since the pedestal 12 is vertically long as described above,
Since the joint surface with the housing 16 is long, it is advantageous for maintaining airtightness.
本実施例では１台座１２の周囲全長にわたってモールド
され、モールド筐体の上面はセンサ素子の上面（拡ｎ！
！、抵抗が形成された面）と高さがほぼ等しくなってい
るため、モールド上面に載置されるＴＩ！極リードフレ
ーム２６と拡散抵抗面とのポンディングワイヤの渡しが
やり易くなっている。In this embodiment, the entire circumference of one pedestal 12 is molded, and the upper surface of the molded housing is the upper surface of the sensor element (enlarged n!
! , the surface on which the resistor is formed) and the height of the TI! placed on the upper surface of the mold. The bonding wire can be easily passed between the polar lead frame 26 and the diffusion resistance surface.
モールドに際し、ネジ２８．０リングｉＭ ３０、リー
ドフレーム２６も同時に形成、またはインサートされる
。During molding, the screw 28.0 ring iM 30 and the lead frame 26 are also formed or inserted at the same time.
筐体１６および台座１２などのモールド終了後、センサ
素子１０を台座１２に接合する。After molding the housing 16, the pedestal 12, etc., the sensor element 10 is joined to the pedestal 12.
接合は、シリコン単結晶とガラス間の接合に通常用いら
れている通電（あるいは静電）接合とし、当然に有機系
接着剤は使用しない。The bonding is carried out by electrically conductive (or electrostatic) bonding, which is commonly used for bonding silicon single crystals and glass, and naturally, no organic adhesive is used.
なお、通電接合時の条件は、台座１２にパイレックス、
テンパックスなどのガラスを使用するトキ、２６ｏ °
Ｃ、１００ＯＶ 、 １０分テアリ、コノ条件に耐える
樹脂としては、ＰＰＳ （ポリフェニレンサルファイド
）、ＰＥＥＫ（ポリエーテル・エーテルケトン）などが
ある。The conditions for electrical bonding are Pyrex on the pedestal 12,
Toki using glass such as Tempax, 26o °
Examples of resins that can withstand C, 100 OV, 10 minute tear, and heat conditions include PPS (polyphenylene sulfide) and PEEK (polyether ether ketone).
なお１本発明の要旨は、センサ素子の支持体を筐体とモ
ールド接合したことにあり、種々の変形実施例が存在す
る。Note that the gist of the present invention is that the supporting body of the sensor element is joined to the housing by molding, and there are various modified embodiments.
たとえば、特に図示はしないが、台座１２は金属その他
の材質のパイプとし、その上に載置するセンサ素子との
面に物理定数の相似したガラス台座を介挿するという構
成をとることもできる。For example, although not particularly shown, the pedestal 12 may be a pipe made of metal or other material, and a glass pedestal having similar physical constants may be inserted on the surface of the pedestal 12 that faces the sensor element placed thereon.
もっとも、ガラスのパイプ台座１２上にガラス台座を載
置するセンサ設置構成とすれば、全体の熱膨張係数が極
めてバランスするから、出力の温度特性が最良のものと
なる。However, if the sensor is installed in a configuration in which a glass pedestal is placed on the glass pipe pedestal 12, the overall coefficient of thermal expansion will be extremely balanced, and the temperature characteristics of the output will be the best.
［発明の効果１
（１）台座１２と筺体１６とを同時に成形するので、そ
れらの間の接着剤が不要であり、有機溶剤、ガソリン、
腐食性流体などによる接着樹脂の劣化が皆無である。[Advantageous Effects of the Invention 1 (1) Since the pedestal 12 and the housing 16 are molded at the same time, there is no need for an adhesive between them, and organic solvents, gasoline,
There is no deterioration of the adhesive resin due to corrosive fluids, etc.
（２）センサ素子１０〜台座１２間は、通電接合が利用
でき、そのため、結合部分の有機溶剤などによる劣化が
皆無である。(2) Electrical bonding can be used between the sensor element 10 and the pedestal 12, so there is no deterioration of the bonded portion due to organic solvents or the like.
（３）筐体１６が樹脂のモールド品だから、ネジ。(3) Screws because the housing 16 is a resin molded product.
Ｏリング溝などを自由に、かつ容易に筐体に設けること
ができ、高圧用にも、安価な筐体として使用することが
できる。O-ring grooves and the like can be freely and easily provided in the casing, and the casing can be used as an inexpensive casing even for high pressure applications.
第１図は本発明の詳細な説明図、
ｆｆ５２図は第１図のＴＩ −ＩＩの断面図、第３図は
従来技術の説明図。
１０：センサ素子 １２：台座
１４：隙間 １６：ｆＲ体
１８：四部 ２０：圧力導入孔２２：ふた
２４：室
２６：リードフレーム
２８：ネジ ３０：ｏリング溝３２：０リン
グFIG. 1 is a detailed explanatory diagram of the present invention, FIG. 10: Sensor element 12: Pedestal 14: Gap 16: fR body 18: Four parts 20: Pressure introduction hole 22: Lid
24: Chamber 26: Lead frame 28: Screw 30: O-ring groove 32: O-ring
Claims (1)
接合してあり、台座１２が樹脂製の筐体１６にマウント
してあり、筐体１６、台座１２を通ってセンサ素子１０
、台座１２間の隙間１４に連通する圧力導入孔２０が形
成してあり、センサ素子１０の隙間１４と反対側には室
２４が形成してある圧力センサにおいて、 前記台座１２の周囲を一体的に樹脂モールド接合したこ
とを特徴とする、圧力センサ。[Claims] A sensor element 10 that utilizes a piezoresistance effect is bonded to a pedestal 12, and the pedestal 12 is mounted on a resin housing 16. 10
, a pressure sensor in which a pressure introduction hole 20 communicating with the gap 14 between the pedestals 12 is formed, and a chamber 24 is formed on the opposite side of the sensor element 10 from the gap 14, the periphery of the pedestal 12 is integrally formed. A pressure sensor characterized by resin molded bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31030286A JPS63163247A (en) | 1986-12-26 | 1986-12-26 | Pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31030286A JPS63163247A (en) | 1986-12-26 | 1986-12-26 | Pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63163247A true JPS63163247A (en) | 1988-07-06 |
Family
ID=18003587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31030286A Pending JPS63163247A (en) | 1986-12-26 | 1986-12-26 | Pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63163247A (en) |
-
1986
- 1986-12-26 JP JP31030286A patent/JPS63163247A/en active Pending
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