JPS63162560U - - Google Patents
Info
- Publication number
- JPS63162560U JPS63162560U JP5562387U JP5562387U JPS63162560U JP S63162560 U JPS63162560 U JP S63162560U JP 5562387 U JP5562387 U JP 5562387U JP 5562387 U JP5562387 U JP 5562387U JP S63162560 U JPS63162560 U JP S63162560U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- printed wiring
- wiring board
- surface periphery
- solder dip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5562387U JPS63162560U (enExample) | 1987-04-13 | 1987-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5562387U JPS63162560U (enExample) | 1987-04-13 | 1987-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63162560U true JPS63162560U (enExample) | 1988-10-24 |
Family
ID=30883689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5562387U Pending JPS63162560U (enExample) | 1987-04-13 | 1987-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63162560U (enExample) |
-
1987
- 1987-04-13 JP JP5562387U patent/JPS63162560U/ja active Pending