JPS63162560U - - Google Patents

Info

Publication number
JPS63162560U
JPS63162560U JP5562387U JP5562387U JPS63162560U JP S63162560 U JPS63162560 U JP S63162560U JP 5562387 U JP5562387 U JP 5562387U JP 5562387 U JP5562387 U JP 5562387U JP S63162560 U JPS63162560 U JP S63162560U
Authority
JP
Japan
Prior art keywords
copper foil
printed wiring
wiring board
surface periphery
solder dip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5562387U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5562387U priority Critical patent/JPS63162560U/ja
Publication of JPS63162560U publication Critical patent/JPS63162560U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP5562387U 1987-04-13 1987-04-13 Pending JPS63162560U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5562387U JPS63162560U (enrdf_load_stackoverflow) 1987-04-13 1987-04-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5562387U JPS63162560U (enrdf_load_stackoverflow) 1987-04-13 1987-04-13

Publications (1)

Publication Number Publication Date
JPS63162560U true JPS63162560U (enrdf_load_stackoverflow) 1988-10-24

Family

ID=30883689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5562387U Pending JPS63162560U (enrdf_load_stackoverflow) 1987-04-13 1987-04-13

Country Status (1)

Country Link
JP (1) JPS63162560U (enrdf_load_stackoverflow)

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