JPS63162532U - - Google Patents
Info
- Publication number
- JPS63162532U JPS63162532U JP5502987U JP5502987U JPS63162532U JP S63162532 U JPS63162532 U JP S63162532U JP 5502987 U JP5502987 U JP 5502987U JP 5502987 U JP5502987 U JP 5502987U JP S63162532 U JPS63162532 U JP S63162532U
- Authority
- JP
- Japan
- Prior art keywords
- disengaging
- engaging
- semiconductor
- lead frame
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 235000014443 Pyrus communis Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987055029U JPH0517883Y2 (xx) | 1987-04-11 | 1987-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987055029U JPH0517883Y2 (xx) | 1987-04-11 | 1987-04-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63162532U true JPS63162532U (xx) | 1988-10-24 |
| JPH0517883Y2 JPH0517883Y2 (xx) | 1993-05-13 |
Family
ID=30882564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987055029U Expired - Lifetime JPH0517883Y2 (xx) | 1987-04-11 | 1987-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0517883Y2 (xx) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010036567A (ja) * | 2008-08-08 | 2010-02-18 | Sodick Plastech Co Ltd | 複合成形装置及びその複合成形装置の中間成形物の移載装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6016429A (ja) * | 1983-07-08 | 1985-01-28 | Matsushita Electronics Corp | 樹脂封止用ロ−デイング装置 |
-
1987
- 1987-04-11 JP JP1987055029U patent/JPH0517883Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6016429A (ja) * | 1983-07-08 | 1985-01-28 | Matsushita Electronics Corp | 樹脂封止用ロ−デイング装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010036567A (ja) * | 2008-08-08 | 2010-02-18 | Sodick Plastech Co Ltd | 複合成形装置及びその複合成形装置の中間成形物の移載装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0517883Y2 (xx) | 1993-05-13 |