JPS6316233B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a charged particle beam, such as an electron beam,
The present invention relates to a method and apparatus for automatically tracing not only straight lines but also non-linear lines using an ion beam or the like to perform processes such as melting, cutting, and welding. When performing processing such as welding by irradiating the workpiece with a charged particle beam, the processing width and heat affected zone are narrow.
In addition, since the process is carried out in a vacuum, it is possible to obtain a machined part of excellent quality.However, due to this narrow processing width, slight misalignment of the beam irradiation position with respect to the processing line becomes a problem, which occurs during alignment before processing. must be carried out strictly.

As a method for tracing the machining line, a so-called playback method has been proposed in which the position of the machining line is detected and stored using a mechanical or electrical method and then read out during the actual machining.

However, there are few workpieces that can be processed under the same conditions over the entire length of the processing line, and some kind of condition change is required. In particular, items for which it is considered appropriate to process using a charged particle beam usually have almost no uniform thickness and often have three-dimensional processed surfaces.

The present invention not only detects and stores the position of the machining line, but also stores machining conditions corresponding to pre-selected points on each machining line when memorizing the position of the machining line. The present invention provides a charged particle beam processing method and apparatus using a complete playback system that simultaneously executes line tracing and processing condition presetting. Furthermore, when selecting arbitrary points on the machining line, the present invention detects only the changing points of the machining line, that is, the positions of both ends of the straight line, regardless of the length, instead of sampling at regular intervals as in the conventional method. During actual machining, linear interpolation is used between each detected position, and in curved parts, parts with approximately the same curvature are treated as one circular arc, and the three points at both ends and the middle position are The detection is memorized, and during actual machining, machining is performed using circular interpolation based on these memorized signals.Also, changes in the thickness and material of the workpiece are detected and memorized in straight slope parts, flat parts, and curved parts under machining conditions. This is intended to reduce the capacity of the storage device and simplify the operation by dividing the data into two parts and storing only the changing points, similar to the machining line positions.

FIG. 1 is a connection diagram showing an embodiment of the present invention.
In order to simplify the explanation, the figure shows an embodiment in which a workpiece is placed on a processing table that moves along both orthogonal X and Y axes. In the figure, 1 is a charged particle beam generator, 2 is a processing table on which a workpiece is placed, 3 is a workpiece, 4 is an X-axis drive motor for moving the processing table 2 in the X-axis direction, and 5 is an X-axis drive motor. a Y-axis drive motor for moving the processing table 2 in the Y-axis direction;
6 is an X-axis processing table position detector that detects the position of the processing table 2 in the X-axis direction using a pulse signal, 7 is a Y-axis processing table position detector, and 8 is the output of the charged particle beam generator 1. This is a charged particle beam control circuit. 401 and 501 are X-axis and Y-axis drive motor control circuits, 402 and 502 are manual switches for moving the processing table in the X- and Y-axis directions, and 403 and 503 are processing table position detectors 6.
and an X-axis position counter and a Y-axis position counter that count the outputs of 7. 9 is a reset switch for returning everything to 0, 11 is a processing speed setting circuit, and 12 is a charged particle beam intensity setting circuit, which is manually set by a digital switch or the like together with the processing speed setting circuit. Reference numeral 13 denotes a charged particle beam intensity change state selection switch, which selects, for example, continuous change or stepwise change. 14 is a load switch that gives a command when storing data, 15 is a pulse oscillator, and 16 is a counter. In this case, since there are 5 series of storage elements, a 6-stage counter is used. 17 is a memory address counter, 18 is a memory circuit,
A mode changeover switch 19 selects between data loading and execution. Also, 404 is the X-axis buffer,
504 is a Y-axis buffer, 111 is a processing speed buffer, 121 and 122 are beam intensity buffers,
131 is a beam intensity change state command signal buffer, 405 and 505 are X-axis and Y-axis interpolation circuits, 123 is a beam intensity interpolation circuit, and 40
Reference numeral 6,506 is an X-axis and Y-axis digital servo circuit, and 20 is a flip-flop circuit that is set at the end of execution of the unit machining length and reset at the completion of the next data reading. Furthermore, OR1, OR2,
OR3 is an OR gate, and AND1 to AND9 are AND gates. Next, the operation of this device will be explained. When loading data, the mode changeover switch 19 is set to the load side.

First, the set switch 9 is pressed to reset the X-axis position counter 403, Y-axis position counter 503, and memory address counter 17 so that the memory address counter 17 indicates the beginning of the memory circuit 18. When the processing table 2 is set at the original position and the load switch 14 is pressed, the counter 16 is triggered and the output scans from 1t to 2t, 3t, . . . 6t every oscillation cycle of the pulse oscillator 15. When the output 1t of the counter 16 is ON, the memory circuit 18 specified by the memory address counter 17
The contents of the X-axis position counter 403 (O in this case) are entered at the beginning of the field. Output 2t of counter 16 is ON
Then, the memory address 17 indicates the next memory address, and the contents of the Y-axis position counter 503 are stored in the memory circuit 18. As the output of the counter 16 is scanned in this manner, the processing speed, beam intensity, and beam intensity change state are sequentially stored, and the first data loading is completed. counter 1
When the output 6t of 6 is turned on, the X and Y position counters are cleared. Next, manual switch 402,
502 is pressed to move the processing table 2 to the first changing point of the processing line of the workpiece 3, each axis position counter 403, 503 counts and indicates the distance from the position where the load switch 14 was pressed last time. .
Here, the machining speed, beam intensity, and beam intensity change state are set by the respective setting circuits 11, 12, and 13, and when the load switch 14 is pressed again, each value is stored in the memory 18 as described above. Thereafter, this process is repeated to cause the memory circuit 18 to memorize each change point of the processed line over the entire length of the processed line. When the memorization of all machining lines is completed, the machining table 2 is returned to the machining start point (original position) of the machining lines, and after pressing the reset switch 9 and clearing all counters, the mode changeover switch 19 is switched to the execution side. When the mode changeover switch 19 is switched to the execution side
AND6 closes, AND7 opens. counter 16
In response to the output, the memory contents stored in the memory circuit 18 are sequentially output from the first address and loaded into each buffer 404, 504, 111, 121, 131. Since the positions of both the X-axis and Y-axis are O at the original position, that is, the machining start point, the interpolation circuits 405 and 505 immediately send the interpolation operation end signal.
It outputs to AND8, sets the flip-flop circuit 20, opens OR3, and drives the counter 16 again. As a result, the memory circuit 18 again outputs the data of the next memory point, and each data is transferred to the buffer 40.
4,504,111,121,131,. In this second loading, the initial beam intensity data stored in the buffer 121 is transferred to the buffer 122. The data read out from the memory circuit 18 in the first time is all O, and the data in the second time is set as x ₁ , y 1 , S ₁ , I ₁ in the order of X-axis position, Y-axis position, processing speed, and beam _intensity. Then, the digital servo circuit 406 causes the processing table 2 to move from coordinates (O, O) to (x ₁ , y ₁ ) in a movement pattern (linearly or arcuately) determined by the interpolation circuits 405 and 505. , 506 are output and moved along the planned trajectory. At this time, the processing speed buffer 1
11 generates a clock pulse at a predetermined period,
Determine the moving speed of the axis and Y axis to _S1 . On the other hand, the beam intensity is determined by the difference (I ₁ - O) between the data stored in the buffers 121 and 122 from O in a predetermined variation form determined by the output of the beam intensity change state command signal buffer 131 using the interpolation circuit 123. A signal is supplied to the charged particle beam control circuit 8 so as to vary up to _I1 . At this time, the rate of change of the beam intensity is determined by the period of the output pulse of the machining speed buffer 111, except when the beam intensity is changed stepwise. When the processing table moves and reaches the position read out by the buffers 404 and 504, the interpolation circuit 40
5 and 505 both output "1", open AND8, and set the flip-flop circuit 20. As a result, the counter 16 and memory address counter 17 are driven, the next data is read into each buffer, and the machining table is moved in accordance with the new data to continue machining as in the previous time. By repeating such operations, processing is executed up to the final storage stage of the memory 18, and after completion of the processing, the processing is stopped at that position.

Here, the interpolation circuits 405 and 505 for each axis and the beam intensity interpolation circuit 123 use a known DDA.
(Digital Differential Analyzer) method, algebraic calculation method, etc. can be used. Here as an example
This shows what uses the DDA method. FIG. 2 is a connection diagram showing an example of the X-axis interpolation circuit 405 when performing linear interpolation. In the same figure, terminals a, b, c, d
correspond to terminals a, b, c, and d in the connection diagram shown in FIG. 21 is an adder, 22 is an auxiliary buffer,
23 is an auxiliary counter, and 24 is a comparator. In the interpolation circuit shown in the figure, the output of the X-axis buffer 404 and the output of the auxiliary buffer 22 are added by an adder 21, and the added output is connected to the auxiliary buffer 22. Now, when a clock pulse corresponding to the machining speed is inputted to the c terminal from the buffer 111 shown in FIG.
1 is loaded, and its contents and the contents of the X-axis buffer 404 are added. The overflow pulse of the adder 21 is sent to the X-axis digital servo circuit 406 that controls the X-axis drive motor 4 through terminal b, and is also sent to the auxiliary counter 23.
It will also be sent to and counted. In the comparator 24, the X-axis buffer 40 input from the terminal a
4 and the count value of the auxiliary counter 23,
When the two match, an execution completion signal is output to terminal d. During this time, the adder 21 and the auxiliary buffer 22 repeat addition and loading operations, and during this time, the drive motor 4 rotates in response to the overflow pulse of the adder 21.

This auxiliary counter 23 then reads the data from the memory circuit 18 and then the counter 16
When the output terminal 6t of the circuit turns ON, a reset signal is obtained from the terminal R and the circuit is reset. If a similar circuit is used for the Y-axis interpolation circuit 505, the processing table 2 will move to the previously memorized position. At this time, since the addition speed of the adder 21 is determined by the frequency of the input pulse to the terminal c, the moving speed of the processing table is also determined by this.

A similar circuit can be used for the beam intensity interpolation circuit, but in this case, the buffers are 121 and 1.
22 to calculate the difference between the previously read beam intensity set value and the current set value, and gradually increase (decrease) the value corresponding to this difference using the output of the buffer 131 that specifies the beam intensity change state. A gate circuit may be provided to select whether or not to perform interpolation similar to that shown in FIG. 2 depending on whether the interpolation is performed in a stepwise manner or in a stepwise manner. FIG. 3 is a connection diagram showing this embodiment. In Figure 3, terminals c, e,
f, g, h, j are the terminals c, e, f, g,
Corresponds to h and j. In the same figure, 121, 12
2 and 131 are a beam intensity buffer and a beam intensity change state command signal buffer in the connection diagram shown in FIG. The beam intensity data is initially stored in the buffer 121, and when the next data is read, the previous data is transferred to the buffer 122 and new data is stored in the buffer 121. The difference between the contents of the buffers 121 and 122 is calculated by a subtracter 25, the result is derived from an adder 26, and the sign of the subtraction result is sent to an auxiliary counter 28.
be guided by The output of the adder 26 is input to the auxiliary buffer 27, and is stored for each clock pulse corresponding to the machining speed input from the terminal c. The adder 26 adds the output of the subtracter 25 and the contents of the auxiliary buffer 27, and outputs the overflow pulse.
It is input to the auxiliary counter 28 via AND21.
When the content of buffer 131 shows a linear change and the output sign of subtractor 25 is positive, AND
21 opens and the auxiliary counter 28 increments on every overflow pulse of the adder 26. If subtractor 2
When the sign of the output of 5 is negative, it becomes a subtraction counter and the output gradually decreases. The output of the auxiliary counter 28 is converted into an analog signal by a D/A converter 29 and supplied to the beam control circuit 8 of FIG. 1 as a beam intensity indicating signal. On the other hand, when the output of buffer 131 indicates a step change, AND21
is closed, AND22 is opened and the contents of buffer 121 are instantaneously transmitted to auxiliary counter 28.

In this way, the auxiliary counter 28 generates an output signal such that the beam intensity changes in accordance with the stored data.

In addition, when the machining line or beam intensity is traced in an arc shape rather than a straight line, circular interpolation can be performed using the same DDA method. In this case, in order to know the center position and rotation direction of the arc, It is necessary to store data at three points: both ends and the middle of the line change.

It goes without saying that both linear interpolation and circular interpolation are not limited to the DDA method, and other known interpolation methods may be used.Furthermore, a microcomputer may be built in, and both storage and execution may be performed by software. .

In the embodiment shown in Fig. 1, the processing table on which the workpiece is placed is driven in both the X and Y axes, but there is a method for moving the irradiation position of the charged particle beam with respect to the processing line. The first step is to move the workpiece and the charged particle beam generator relative to each other.
In addition to the embodiment shown in the figure, the workpiece is moved in a direction that approximately corresponds to the longitudinal direction of the machining line (for example, the X-axis direction).
Alternatively, the charged particle beam generator may be moved in the Y-axis direction. Alternatively, the workpiece may be stationary and the charged particle beam generator may be moved in both the X and Y axis directions.

Furthermore, in addition to detecting the relative position of the processing line of the workpiece and the charged particle beam, in addition to detecting the position of the processing table and the position of the charged particle beam generator, a separately installed processing line detector is used to detect the relative position of the processing line of the workpiece and the charged particle beam. The workpiece and the charged particle beam generator may be moved in advance so as to match the detected value (absolute position of the processing line) at this time. Various application examples are shown below. Figure 4 shows the drive shaft as the processing table for the workpiece,
It is divided into a charged particle beam generator and a charged particle beam generator.
In the figure, 1 is a charged particle beam generator, 31 is a processing vacuum chamber for storing a workpiece, and 32 is a moving airtight seal mechanism provided between the charged particle beam generator 1 and the vacuum chamber 31. , a sealing plate 321 that covers the opening 311 of the vacuum chamber 31, and a sealing O-ring 322. Reference numeral 33 denotes a drive mechanism for moving the charged particle beam generator 1 in the Y direction in the figure, and is attached to the vacuum chamber 31.
34 is a Y direction position detector of the charged particle beam generator 1, 35 is a detector for detecting the X direction position of the processing line of the workpiece 3, which is attached to the charged particle beam generator 1, When the machining line is memorized, the contact 351 of the detector 35 moves together with the charged particle beam generator while contacting the groove provided in the machining line of the workpiece, and during machining, the contact 351 of the detector 35 is moved to a position where machining is not hindered by an evacuation mechanism (not shown). It is something to evacuate. Reference numeral 2 denotes a processing table on which the workpiece 3 is placed, and in the figure, it moves in the X-axis direction perpendicular to the plane of the paper, that is, in a direction that substantially coincides with the processing line. When the machining line is not a straight line but a curve, the machining table 2 is moved in the average direction, and when the machining line is circular, a rotary table may be used. 36 is an X-axis processing table position detector that detects the position (X coordinate) of the processing table. 37
is a tracing control circuit for operating the drive mechanism 33 when storing machining lines; in the embodiment shown in the figure, a potentiometer is used as the detector 35, and the reference signal is
A comparator 371 and a comparator 3 which input E _r and the output signal of the detector 35 and output a difference signal between the two signals.
Amplifier 3 that amplifies the output signal of 71 as necessary.
It consists of 72.

In the apparatus shown in the figure, first, with the beam stopped, the contact 351 of the detector 35 is brought into contact with the processing line, and the processing table 2 is moved in the X-axis direction at a predetermined speed. At this time, the output of the detector 35 is compared with the reference signal E _r , and the drive mechanism 33 of the charged particle beam generator 1 is operated so that the difference between the two signals becomes zero. As a result, the output beam of the charged particle beam generator 1 is controlled to a position that always irradiates the processing line. During this movement, the detector 3
By pressing the load switch and storing the output signals 6 and 34 and the machining condition signals, respectively, as in the example shown in FIG. 1, the positions of all machining lines and machining conditions are memorized. When performing machining, the detector 35 is retracted as described above, and after returning the machining table 2 and charged particle beam generator 1 to their original positions, the machining is performed. Note that when processing is performed, the drive mechanism of the charged particle beam generator 1 is separated from the scanning control circuit 37 and is operated in accordance with a readout signal from a storage circuit (not shown).

FIG. 5 shows another embodiment, in which a charged particle beam generator is provided outside the processing vacuum chamber in a state that can be moved in an airtight manner with respect to the vacuum chamber, and this generator is mutually connected to the processing vacuum chamber. Two sets of moving airtight seal mechanisms are provided so as to be movable in two directions substantially orthogonal to the , and a first airtight seal mechanism of the two sets of moving airtight seal mechanisms is attached to the charged particle beam generator, The second hermetic seal mechanism hermetically couples the first hermetic seal mechanism to the vacuum chamber, and combines two drive mechanisms for moving the charged particle beam generator in substantially orthogonal directions. The drive mechanism is configured to move in a direction substantially perpendicular to the processing line, and the other drive mechanism is configured to move in a direction that substantially coincides with the processing line. In the figure, 1 is a charged particle beam generator, 31 is a processing vacuum chamber that houses the workpiece 3, and 38 is a first moving airtight seal mechanism to which the charged particle beam generator 1 is attached, and a seal plate 381 and It is composed of a sealing O-ring 382. 39 is a first driving mechanism for moving the charged particle beam generator 1 in the Y-axis direction in the figure, and 41 is a second moving airtight sealing mechanism, which has a seal plate similar to the first airtight sealing mechanism. 411 and a sealing O-ring 412. Further, a first airtight seal mechanism 38 and a first drive mechanism 39 are mounted on the seal plate 411. Reference numeral 42 denotes a second drive mechanism attached to the vacuum processing chamber 31, which moves the charged particle beam generator 1 in a direction perpendicular to the Y-axis direction that substantially coincides with the processing line, for example, when the processing line is a straight line, as shown in the figure. If the processing line is a curve, move it in the direction perpendicular to the paper surface, or in the average direction if the processing line is a curve. A detector 35 detects the machining line of the workpiece 3, and is attached to the charged particle beam generator 1 as in the embodiment shown in FIG. The contactor 351 of the detector 35 moves together with the charged particle beam generator 1 while contacting a groove provided in the processing line of the workpiece. Reference numeral 43 denotes a workpiece mounting table, which includes a workpiece clamping jig if necessary. 37 is a tracing control circuit for operating the first drive mechanism 39 to cause the charged particle beam to trace the machining line when memorizing the machining line, and as in _FIG . Vessel 37
Consists of 2.

In the apparatus shown in FIG. 5, first, when storing the processing line, the contact 351 of the detector 35 is brought into contact with the processing line, and the second drive mechanism 42 is operated to move the charged particle beam generator 1 in the direction of the processing line. Detector 35
generates a signal corresponding to the relative position between the processing line and the charged particle beam generator 1, and this output signal is compared with the reference signal E _r by a comparator 371, and the first drive mechanism is operated so that the difference becomes zero. 39 is operated so that the output beam of the charged particle beam generator 1 always coincides with the processing line. During this movement, the 4th
As in the embodiment shown in the figure, the load switch is pressed at each predetermined position to sequentially store the machining line position and the machining conditions at that position.

FIGS. 6 and 7 are cross-sectional views showing essential parts of still another embodiment, with FIG. 6 showing a side surface in a direction substantially parallel to the processing line, and FIG. 7 showing a side surface perpendicular thereto. In FIGS. 6 and 7, parts having the same functions as those in the embodiment shown in FIGS. 4 and 5 are given the same reference numerals. The first airtight seal mechanism 38 is similar to that shown in FIG. 1, but the second airtight seal mechanism has a frame 413 having a space for storing a tape-shaped sealing material. , which covers a part of the upper opening of the vacuum chamber 31 and is assembled so as to be movable in the X direction in the figure.
Tape-shaped sealing materials 414 and 415 are arranged with one end fixed to the vacuum chamber so as to cover the remaining openings of the tape-shaped sealing materials 414 and 415.
Peeling tools 416 and 417 that peel off the other end inside the movable frame 413, and winding up the peeled tape-shaped sealing materials 414 and 415,
It is composed of take-up rolls 418 and 419 for taking back. In addition, 420 is a movable frame body 4
A movable sealing material, such as an O-ring, provided at the lower end of frame 413 slides on the upper surface of vacuum chamber 31 and the surfaces of tape-shaped seals 414 and 415 while maintaining airtightness inside frame 413. It is something. In the apparatuses shown in FIGS. 6 and 7, the frame body 413 is moved to
The processing line position and processing conditions are stored while moving in the direction, and at this time, the charged particle beam generator 1 is processed by another drive mechanism 39 fixed on the frame 413 based on the output signal of the processing line detector 35. The irradiation position of the charged particle beam is made to coincide with the processing line by moving in the Y direction perpendicular to the line, as in FIG. 4.

As described above, the present invention stores the machining conditions in parallel with memorizing the position of the machining line, and performs machining by sequentially reading out these stored signals during actual machining. It is possible to accurately match the conditions and perform processing under optimal processing conditions according to changes in the dimensions and material of the workpiece. In addition, for straight parts on the processing line, only the positions of both ends are detected and memorized, regardless of the length.
During the main machining, the machining is performed by linear interpolation between each detected position. In addition, in curved parts, parts with approximately the same curvature are treated as one circular arc, and three points at both ends and an intermediate position are detected and memorized, and during main machining, machining is performed using the circular interpolation method using these memorized signals. Let them do it.

Furthermore, with regard to machining conditions, by dividing changes in machining conditions into straight slope parts, flat parts, and curved parts and storing only the changing points in the same way as machining lines, the capacity of the storage device can be reduced, and operations can be made easier. It's convenient. Furthermore, when storing the machining line, when detecting the position of the machining line using a machining line detector and automatically tracing the irradiation position of the charged particle beam to match the machining line using this output signal, Unlike when a worker traces a processed line using an optical system observation device, accuracy is improved and individual differences are eliminated.

[Brief explanation of the drawing]

FIG. 1 is a connection diagram showing an embodiment of the device of the present invention;
2 and 3 are connection diagrams showing an embodiment of the interpolation circuit, and FIGS. 4 to 7 are structural diagrams showing the main parts of the embodiment of the apparatus of the present invention. 1...Charged particle beam generator, 2...Processing table,
3...Workpiece, 4...X-axis drive motor, 5...
Y-axis drive motor, 6... X-axis processing table position detector, 7... Y-axis processing table position detector, 8... Charged particle beam control circuit, 11... Processing speed setting circuit, 12... Beam Intensity setting circuit, 13...Beam intensity change state selection switch, 14...Load switch, 16...Counter, 17...Memory address counter, 18...Memory circuit, 31
...Vacuum chamber, 32...Movable airtight seal mechanism, 3
3... Beam generator drive mechanism, 35... Machining line detector, 37... Beam generator tracing control circuit, 38
...First moving airtight seal mechanism, 39...First
drive mechanism, 41... second moving airtight seal mechanism, 42... second drive mechanism, 401... X-axis drive motor control circuit, 402... Y-axis drive motor control circuit, 403... X-axis Position counter, 404...
...X-axis buffer, 405...X-axis interpolation circuit, 40
6...X-axis digital servo circuit, 501...Y
Axis drive motor control circuit, 503...Y-axis position counter, 504...Y-axis buffer, 505...Y-axis interpolation circuit, 506...Y-axis digital servo circuit.

Claims (1)

[Claims] 1. In a charged particle beam processing method in which a workpiece is processed by irradiating a charged particle beam with high energy density, regarding a portion where the processing line or processing conditions change linearly prior to processing, For curved parts, the positions corresponding to both ends and the midpoint are selected in advance for each part of approximately the same curvature, and the position coordinates are detected for each selected point to generate a straight line or curved designation signal. and store all or part of the machining conditions such as machining speed, beam intensity, beam focal position, beam irradiation angle, beam swing width and period in accordance with each position coordinate of the machining line on a straight or curved line. Settings are stored together with designated signals, and during machining, the stored position coordinate signal of the machining line and machining condition signal are read out together with the straight or curved designated signal, and a charged particle beam is generated using both the linear interpolation method and the circular interpolation method. A charged particle beam processing method in which processing conditions are changed while continuously moving the generator and workpiece relative to each other. 2. A processing vacuum chamber, a charged particle beam generator,
A processing table on which a workpiece is placed, two sets of driving means for relatively moving the charged particle beam generator and the processing table in two directions of X and Y that are substantially orthogonal to each other, and The charged particle beam generator is moved along the line, and for a part where the processing line or processing conditions change in a straight line, the positions corresponding to both ends are measured, and for a curved part, at every part of approximately the same curvature. means for preselecting three positions, ie, both ends and an intermediate point, and detecting the relative position of the charged particle beam generator and the processing table for each point on the processing line and converting it into a coordinate signal; A machining line storage means that sequentially stores the straight line or curved line designation signal and sequentially reads it out during main machining, and sets part or all of the machining conditions in advance along with the straight line or curved designation signal in accordance with the position coordinates on the machining line. a machining condition setting storage circuit; a driving means control circuit for operating the driving means using a linear interpolation method and a circular interpolation method in response to a read signal from the machining line storage means; and a machining condition setting storage circuit. A charged particle beam processing apparatus comprising a charged particle beam control circuit that controls the output beam of the charged particle beam generator using a combination of linear interpolation method and circular interpolation method in response to a readout signal from the charged particle beam generator. 3. A processing vacuum chamber, a charged particle beam generator,
a processing table on which a workpiece is placed; two sets of driving means for relatively moving the charged particle beam generator and the processing table in two directions of X and Y that are substantially orthogonal to each other; and the workpiece. A machining line detector detects the machining line of the object in both the X and Y directions, and for parts where the machining line or machining conditions change prior to main machining is linear, the positions corresponding to both ends are also curved. As for the section, three positions of both ends and the middle point are selected in advance for each section of approximately the same curvature, and when the detector is moved along the processing line, the output signal of the detector is adjusted at each preselected point on the processing line. means for detecting and converting into a coordinate signal; processing line position storage means for sequentially storing the output signal of the converting means together with a straight line or curve designation signal and sequentially reading it during main processing;
a machining condition setting memory circuit that sets part or all of the machining conditions in advance along with a straight line or curve designation signal corresponding to the position coordinates on the machining line;
a drive means control circuit that operates the drive means using a linear interpolation method and a circular interpolation method in response to a read signal from the processing line position storage means; and a drive means control circuit that operates the drive means in response to a read signal from the processing condition setting storage circuit. A charged particle beam processing apparatus comprising: a charged particle beam control circuit that controls an output beam of the charged particle beam generator by using both a linear interpolation method and a circular interpolation method. 4. The two sets of drive means include a first drive mechanism that moves the charged particle beam generator in the X direction, and a second drive mechanism that moves the processing table in the Y direction that is substantially perpendicular to the X direction. A charged particle beam processing apparatus according to claim 3. 5. The charged particle beam generator is attached to a first movable base that moves in the X direction, and the first movable base is slidably placed on a second movable base that moves in the Y direction. Charged particle beam processing device according to scope 3. 6. Any one of claims 3 to 5, wherein the charged particle beam generator is provided outside the processing vacuum chamber and is movably attached via an airtight seal member. The charged particle beam processing device described in . 7 The charged particle beam generator is provided outside the processing vacuum chamber, and the first movable airtight seal member movable in the X direction and the first movable airtight seal member are connected to the processing 4. The charged particle beam processing apparatus according to claim 3, wherein the charged particle beam processing apparatus is attached to the processing vacuum chamber by a second sealing member movable in the Y direction that is coupled to the processing vacuum chamber in a sealed state. 8. The second movable sealing member is a tape-shaped sealing material that covers the opening of the vacuum chamber, and a portion where the beam from the charged particle beam generator passes, corresponding to the movement of the charged particle beam generator in the processing line direction. Claim 7 comprising a mechanism for temporarily retracting the tape-shaped sealing material from the opening of the vacuum chamber.
The charged particle beam processing device described in 2.