JPS63159849U - - Google Patents
Info
- Publication number
- JPS63159849U JPS63159849U JP5255487U JP5255487U JPS63159849U JP S63159849 U JPS63159849 U JP S63159849U JP 5255487 U JP5255487 U JP 5255487U JP 5255487 U JP5255487 U JP 5255487U JP S63159849 U JPS63159849 U JP S63159849U
- Authority
- JP
- Japan
- Prior art keywords
- light extraction
- semiconductor device
- optical semiconductor
- extraction window
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000605 extraction Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5255487U JPS63159849U (US20030199744A1-20031023-C00003.png) | 1987-04-06 | 1987-04-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5255487U JPS63159849U (US20030199744A1-20031023-C00003.png) | 1987-04-06 | 1987-04-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63159849U true JPS63159849U (US20030199744A1-20031023-C00003.png) | 1988-10-19 |
Family
ID=30877823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5255487U Pending JPS63159849U (US20030199744A1-20031023-C00003.png) | 1987-04-06 | 1987-04-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63159849U (US20030199744A1-20031023-C00003.png) |
-
1987
- 1987-04-06 JP JP5255487U patent/JPS63159849U/ja active Pending
