JPS63159842U - - Google Patents
Info
- Publication number
- JPS63159842U JPS63159842U JP5283187U JP5283187U JPS63159842U JP S63159842 U JPS63159842 U JP S63159842U JP 5283187 U JP5283187 U JP 5283187U JP 5283187 U JP5283187 U JP 5283187U JP S63159842 U JPS63159842 U JP S63159842U
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- dielectric substrate
- base block
- groove
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5283187U JPS63159842U (sh) | 1987-04-06 | 1987-04-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5283187U JPS63159842U (sh) | 1987-04-06 | 1987-04-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63159842U true JPS63159842U (sh) | 1988-10-19 |
Family
ID=30878353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5283187U Pending JPS63159842U (sh) | 1987-04-06 | 1987-04-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63159842U (sh) |
-
1987
- 1987-04-06 JP JP5283187U patent/JPS63159842U/ja active Pending