JPS63158004U - - Google Patents
Info
- Publication number
- JPS63158004U JPS63158004U JP5006387U JP5006387U JPS63158004U JP S63158004 U JPS63158004 U JP S63158004U JP 5006387 U JP5006387 U JP 5006387U JP 5006387 U JP5006387 U JP 5006387U JP S63158004 U JPS63158004 U JP S63158004U
- Authority
- JP
- Japan
- Prior art keywords
- dielectric substrate
- ground conductor
- substrate
- dielectric
- stripline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
Landscapes
- Waveguides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5006387U JPS63158004U (US07943777-20110517-C00090.png) | 1987-04-02 | 1987-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5006387U JPS63158004U (US07943777-20110517-C00090.png) | 1987-04-02 | 1987-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63158004U true JPS63158004U (US07943777-20110517-C00090.png) | 1988-10-17 |
Family
ID=30873074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5006387U Pending JPS63158004U (US07943777-20110517-C00090.png) | 1987-04-02 | 1987-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63158004U (US07943777-20110517-C00090.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11018404B2 (en) | 2015-08-26 | 2021-05-25 | Nec Space Technologies, Ltd. | Circuit body structure, where planar conductors on different layers of a multilayer board are connected by an interlayers connection |
-
1987
- 1987-04-02 JP JP5006387U patent/JPS63158004U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11018404B2 (en) | 2015-08-26 | 2021-05-25 | Nec Space Technologies, Ltd. | Circuit body structure, where planar conductors on different layers of a multilayer board are connected by an interlayers connection |
