JPS63157992U - - Google Patents
Info
- Publication number
- JPS63157992U JPS63157992U JP5063287U JP5063287U JPS63157992U JP S63157992 U JPS63157992 U JP S63157992U JP 5063287 U JP5063287 U JP 5063287U JP 5063287 U JP5063287 U JP 5063287U JP S63157992 U JPS63157992 U JP S63157992U
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- heating element
- utility
- attached
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000001012 protector Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Telephone Set Structure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5063287U JPS63157992U (US07652168-20100126-C00068.png) | 1987-04-02 | 1987-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5063287U JPS63157992U (US07652168-20100126-C00068.png) | 1987-04-02 | 1987-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63157992U true JPS63157992U (US07652168-20100126-C00068.png) | 1988-10-17 |
Family
ID=30874166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5063287U Pending JPS63157992U (US07652168-20100126-C00068.png) | 1987-04-02 | 1987-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63157992U (US07652168-20100126-C00068.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02110947U (US07652168-20100126-C00068.png) * | 1989-02-16 | 1990-09-05 | ||
| JPH0638254U (ja) * | 1992-10-22 | 1994-05-20 | ダイヤモンド電機株式会社 | 携帯用電子機器の放熱装置 |
| WO2015050048A1 (ja) * | 2013-10-01 | 2015-04-09 | 古河電気工業株式会社 | モバイル電子機器ケース |
| KR101991621B1 (ko) * | 2018-02-22 | 2019-06-20 | 주식회사 선익시스템 | 열확산 구조를 가지는 증착막 두께 측정 모듈 |
-
1987
- 1987-04-02 JP JP5063287U patent/JPS63157992U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02110947U (US07652168-20100126-C00068.png) * | 1989-02-16 | 1990-09-05 | ||
| JPH0638254U (ja) * | 1992-10-22 | 1994-05-20 | ダイヤモンド電機株式会社 | 携帯用電子機器の放熱装置 |
| WO2015050048A1 (ja) * | 2013-10-01 | 2015-04-09 | 古河電気工業株式会社 | モバイル電子機器ケース |
| JP2016201580A (ja) * | 2013-10-01 | 2016-12-01 | 古河電気工業株式会社 | モバイル電子機器ケース |
| KR101991621B1 (ko) * | 2018-02-22 | 2019-06-20 | 주식회사 선익시스템 | 열확산 구조를 가지는 증착막 두께 측정 모듈 |
