JPS63157936U - - Google Patents

Info

Publication number
JPS63157936U
JPS63157936U JP1987050643U JP5064387U JPS63157936U JP S63157936 U JPS63157936 U JP S63157936U JP 1987050643 U JP1987050643 U JP 1987050643U JP 5064387 U JP5064387 U JP 5064387U JP S63157936 U JPS63157936 U JP S63157936U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit element
resin
sealed
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987050643U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987050643U priority Critical patent/JPS63157936U/ja
Publication of JPS63157936U publication Critical patent/JPS63157936U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1987050643U 1987-04-02 1987-04-02 Pending JPS63157936U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987050643U JPS63157936U (zh) 1987-04-02 1987-04-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987050643U JPS63157936U (zh) 1987-04-02 1987-04-02

Publications (1)

Publication Number Publication Date
JPS63157936U true JPS63157936U (zh) 1988-10-17

Family

ID=30874188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987050643U Pending JPS63157936U (zh) 1987-04-02 1987-04-02

Country Status (1)

Country Link
JP (1) JPS63157936U (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168245A (ja) * 1982-03-29 1983-10-04 Toshiba Corp 半導体装置の製造方法
JPS5933866A (ja) * 1982-08-19 1984-02-23 Mitsubishi Electric Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168245A (ja) * 1982-03-29 1983-10-04 Toshiba Corp 半導体装置の製造方法
JPS5933866A (ja) * 1982-08-19 1984-02-23 Mitsubishi Electric Corp 半導体装置

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