JPS63157443U - - Google Patents

Info

Publication number
JPS63157443U
JPS63157443U JP4580087U JP4580087U JPS63157443U JP S63157443 U JPS63157443 U JP S63157443U JP 4580087 U JP4580087 U JP 4580087U JP 4580087 U JP4580087 U JP 4580087U JP S63157443 U JPS63157443 U JP S63157443U
Authority
JP
Japan
Prior art keywords
reel
wire
plastic deformation
wound
upstream
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4580087U
Other languages
English (en)
Japanese (ja)
Other versions
JPH043699Y2 (en, 2012
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4580087U priority Critical patent/JPH043699Y2/ja
Publication of JPS63157443U publication Critical patent/JPS63157443U/ja
Application granted granted Critical
Publication of JPH043699Y2 publication Critical patent/JPH043699Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Wire Processing (AREA)
JP4580087U 1987-03-30 1987-03-30 Expired JPH043699Y2 (en, 2012)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4580087U JPH043699Y2 (en, 2012) 1987-03-30 1987-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4580087U JPH043699Y2 (en, 2012) 1987-03-30 1987-03-30

Publications (2)

Publication Number Publication Date
JPS63157443U true JPS63157443U (en, 2012) 1988-10-14
JPH043699Y2 JPH043699Y2 (en, 2012) 1992-02-05

Family

ID=30864867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4580087U Expired JPH043699Y2 (en, 2012) 1987-03-30 1987-03-30

Country Status (1)

Country Link
JP (1) JPH043699Y2 (en, 2012)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6858523B2 (en) 2000-01-18 2005-02-22 Micron Technology, Inc. Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride
US6878507B2 (en) 1998-02-25 2005-04-12 Micron Technology, Inc. Semiconductor processing methods
US7067415B2 (en) 1999-09-01 2006-06-27 Micron Technology, Inc. Low k interlevel dielectric layer fabrication methods
US7151054B2 (en) 1998-09-03 2006-12-19 Micron Technology, Inc. Semiconductor processing methods of forming and utilizing antireflective material layers, and methods of forming transistor gate stacks
US7279118B2 (en) 1998-12-23 2007-10-09 Micron Technology, Inc. Compositions of matter and barrier layer compositions
US7576400B1 (en) 1998-09-03 2009-08-18 Micron Technology, Inc. Circuitry and gate stacks

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6878507B2 (en) 1998-02-25 2005-04-12 Micron Technology, Inc. Semiconductor processing methods
US7626238B2 (en) 1998-02-25 2009-12-01 Micron Technology, Inc. Semiconductor devices having antireflective material
US7151054B2 (en) 1998-09-03 2006-12-19 Micron Technology, Inc. Semiconductor processing methods of forming and utilizing antireflective material layers, and methods of forming transistor gate stacks
US7576400B1 (en) 1998-09-03 2009-08-18 Micron Technology, Inc. Circuitry and gate stacks
US7279118B2 (en) 1998-12-23 2007-10-09 Micron Technology, Inc. Compositions of matter and barrier layer compositions
US7067415B2 (en) 1999-09-01 2006-06-27 Micron Technology, Inc. Low k interlevel dielectric layer fabrication methods
US7078356B2 (en) 1999-09-01 2006-07-18 Micron Technology, Inc. Low K interlevel dielectric layer fabrication methods
US7521354B2 (en) 1999-09-01 2009-04-21 Micron Technology, Inc. Low k interlevel dielectric layer fabrication methods
US7078328B2 (en) 2000-01-18 2006-07-18 Micron Technology, Inc. Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride
US7435688B2 (en) 2000-01-18 2008-10-14 Micron Technology, Inc. Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride
US6858523B2 (en) 2000-01-18 2005-02-22 Micron Technology, Inc. Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride
US7045277B2 (en) 2000-01-18 2006-05-16 Micron Technology, Inc. Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride
US7638436B2 (en) 2000-01-18 2009-12-29 Micron Technology, Inc. Semiconductor processing methods of transferring patterns from patterned photoresists to materials

Also Published As

Publication number Publication date
JPH043699Y2 (en, 2012) 1992-02-05

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