JPS63153586U - - Google Patents
Info
- Publication number
- JPS63153586U JPS63153586U JP4622587U JP4622587U JPS63153586U JP S63153586 U JPS63153586 U JP S63153586U JP 4622587 U JP4622587 U JP 4622587U JP 4622587 U JP4622587 U JP 4622587U JP S63153586 U JPS63153586 U JP S63153586U
- Authority
- JP
- Japan
- Prior art keywords
- groups
- housing plate
- cuts
- passed
- held
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000010365 information processing Effects 0.000 claims 2
- 238000005452 bending Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Description
第１図ａ，ｂはそれぞれ本考案構造の一実施例
を示す斜視図及びその断面図、第２図ａ〜ｃは本
考案構造によりケーブル群を保持する場合の手順
の一例を示す説明図、第３図ａ，ｂはそれぞれ従
来構造の第１例を示す斜視図及びその断面図、第
４図ａ，ｂはそれぞれ従来構造の第２例を示す斜
視図及びその断面図である。
１……筐体板、２……通線孔、３……ケーブル
、４……切り目。
FIGS. 1a and 1b are perspective views and cross-sectional views respectively showing an embodiment of the structure of the present invention, and FIGS. 2a to 2c are explanatory diagrams showing an example of the procedure for holding a group of cables with the structure of the present invention, 3A and 3B are a perspective view and a sectional view thereof, respectively, showing a first example of a conventional structure, and FIGS. 4A and 4B are a perspective view and a sectional view, respectively, showing a second example of a conventional structure. 1... Housing plate, 2... Wiring hole, 3... Cable, 4... Cut.
Claims (1)
種ケーブル３群を貫通して保持する構造において
、筐体板１に縦横に複数の切り目４を断続して配
設し、各種ケーブル３群の大きさに応じて上記切
り目４の位置で筐体板１を折り曲げて通線孔２を
形成し、当該各通線孔２に各種ケーブル３群を貫
通して保持せしめてなる情報処理装置の通線保持
構造。 In a structure in which three groups of various cables of an information processing device are passed through and held through a wiring hole 2 provided in a housing plate 1, a plurality of cuts 4 are disposed intermittently in the vertical and horizontal directions in the housing plate 1, and various cables are Information processing in which wire passage holes 2 are formed by bending the housing plate 1 at the positions of the cuts 4 according to the sizes of the three groups, and each of the three groups of cables is passed through and held in each wire passage hole 2. Device wire holding structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4622587U JPS63153586U (en) | 1987-03-27 | 1987-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4622587U JPS63153586U (en) | 1987-03-27 | 1987-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63153586U true JPS63153586U (en) | 1988-10-07 |
Family
ID=30865693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4622587U Pending JPS63153586U (en) | 1987-03-27 | 1987-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63153586U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014004767A (en) * | 2012-06-25 | 2014-01-16 | Kyocera Corp | Cover member for liquid discharge head, and liquid discharge head with cover and recording apparatus using the same |
| JP2014192515A (en) * | 2013-03-28 | 2014-10-06 | Aisin Aw Co Ltd | Substrate wiring structure |
| JP2015021839A (en) * | 2013-07-18 | 2015-02-02 | 三菱電機株式会社 | Energy measurement device |
-
1987
- 1987-03-27 JP JP4622587U patent/JPS63153586U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014004767A (en) * | 2012-06-25 | 2014-01-16 | Kyocera Corp | Cover member for liquid discharge head, and liquid discharge head with cover and recording apparatus using the same |
| JP2014192515A (en) * | 2013-03-28 | 2014-10-06 | Aisin Aw Co Ltd | Substrate wiring structure |
| JP2015021839A (en) * | 2013-07-18 | 2015-02-02 | 三菱電機株式会社 | Energy measurement device |
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