JPS63153534U - - Google Patents

Info

Publication number
JPS63153534U
JPS63153534U JP4627387U JP4627387U JPS63153534U JP S63153534 U JPS63153534 U JP S63153534U JP 4627387 U JP4627387 U JP 4627387U JP 4627387 U JP4627387 U JP 4627387U JP S63153534 U JPS63153534 U JP S63153534U
Authority
JP
Japan
Prior art keywords
chip
circuit board
printed circuit
connector
connection structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4627387U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4627387U priority Critical patent/JPS63153534U/ja
Publication of JPS63153534U publication Critical patent/JPS63153534U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83194Lateral distribution of the layer connectors

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP4627387U 1987-03-27 1987-03-27 Pending JPS63153534U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4627387U JPS63153534U (ko) 1987-03-27 1987-03-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4627387U JPS63153534U (ko) 1987-03-27 1987-03-27

Publications (1)

Publication Number Publication Date
JPS63153534U true JPS63153534U (ko) 1988-10-07

Family

ID=30865784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4627387U Pending JPS63153534U (ko) 1987-03-27 1987-03-27

Country Status (1)

Country Link
JP (1) JPS63153534U (ko)

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