JPS63153531U - - Google Patents
Info
- Publication number
- JPS63153531U JPS63153531U JP1987046043U JP4604387U JPS63153531U JP S63153531 U JPS63153531 U JP S63153531U JP 1987046043 U JP1987046043 U JP 1987046043U JP 4604387 U JP4604387 U JP 4604387U JP S63153531 U JPS63153531 U JP S63153531U
- Authority
- JP
- Japan
- Prior art keywords
- bent piece
- semiconductor device
- clamped
- substrate
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987046043U JPS63153531U (enExample) | 1987-03-27 | 1987-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987046043U JPS63153531U (enExample) | 1987-03-27 | 1987-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63153531U true JPS63153531U (enExample) | 1988-10-07 |
Family
ID=30865339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987046043U Pending JPS63153531U (enExample) | 1987-03-27 | 1987-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63153531U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104294A (ja) * | 1992-09-17 | 1994-04-15 | Nec Corp | リードフレーム |
| WO2025164168A1 (ja) * | 2024-01-30 | 2025-08-07 | ミネベアパワーデバイス株式会社 | 半導体装置および半導体装置の製造方法 |
-
1987
- 1987-03-27 JP JP1987046043U patent/JPS63153531U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104294A (ja) * | 1992-09-17 | 1994-04-15 | Nec Corp | リードフレーム |
| WO2025164168A1 (ja) * | 2024-01-30 | 2025-08-07 | ミネベアパワーデバイス株式会社 | 半導体装置および半導体装置の製造方法 |