JPS6315089A - Heat pipe of loop type - Google Patents

Abstract

PURPOSE:To transfer heat from the upper part of a loop-line to the lower part of it, by raising the discharge pipe of a heat pump connected to an evaporator higher than the upper heat pipe, by constituting a flow passage of loop structure as the whole of a heat pipe device, by providing check valves at the outlet of a cooler and at the rising part of a discharge pipe respectively, and by returning a heating medium in the cooler to the evaporator by a heat pump. CONSTITUTION:When a heat pump 1 is heated and is operated, part of a heating medium 11 is evaporated, and a bubble flow, a plug flow, or a slug flow is produced in the upper and the lower that pipes 2 and 3. At that time the pressure in a loop-line from check valves 5 to 6 including a heating part consisting of the upper and the lower heat pipes 2 and 3 is increased, the check valve 6 is opened, the produced bubbles disappear, and the pressure in the loop-line is reduced. Thereby a cold heating medium is fed into the heating part from a cooler 4. While a discharged heating medium is fed into an evaporator 12 via the check valve 6. The heating medium fed from the outside into the evaporator 12 is heated and generates steam. The generated steam is transmitted to the cooler 4 through a down-pipe 8.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention provides a method for removing a heat medium 11 from a cooler 4 by using a heat-driven pump l whose driving source is pressure fluctuations caused by a phase change in the heat medium. The heat medium 11 is returned to the evaporator 12 installed at a higher position, and the vapor generated by vaporizing the heat medium 11 is transported to the cooler 4 below, and by cooling, the heat is transported from above to below as latent heat. This relates to a loop-type heat vibrator that can do this.

[Conventional technology]

Conventionally, heat pipes, thermosiphons, and the like are known as heat transfer devices that do not require external mechanical driving force such as a power pump. All of these devices attempt to transport heat by utilizing phase changes caused by evaporation and condensation of the heat medium, but in these conventional heat transfer devices, heat transfer is performed from below to above. It is not suitable for transferring heat from above to below.

(Problems to be Solved by the Invention) Unlike the conventional methods, the present invention enables heat transfer from above to below, and does not use any external mechanical driving force for the heat transfer. In other words, according to the present invention, a heat-driven pump 1 consisting of a loop circuit formed using heat transfer tubes is provided, and the heat-driven pump 1 is provided with a heat-driven pump 1 formed of a loop circuit formed using heat transfer tubes, and a heat-driven pump 1 that is installed on the same plane or slightly above the heat-driven pump 1. It consists of an installed evaporator 12, a cooler 4 located below the evaporator, a descending passage 8 that connects the evaporator 12 and the cooler 4, and an ascending passage 7 that connects the heat-driven pump l and the cooler 4. The descending flow path 8 and the ascending flow path 7 are bent such that their intermediate portions are located at a higher position than the evaporator 12 and the upper heating pipe 2 of the heat-driven pump 1 to which they are connected. The discharge flow path 1b of the heat-driven pump 1 that communicates with the heat exchanger 12 rises higher than the upper heating tube 2.The heat medium 11 is located in a part of the cooler 4 within the communication tube circuit, which has a loop structure as a whole. A loop-type heat pipe is provided, which is present in the ascending flow path 7, the heat-driven pump 1, and the evaporator 12, and the vapor of the heat medium moves to the cooler 4 below through the lower flow path 8. be done.

Means for Solving Problem C] In order to achieve the above-mentioned object, the present invention provides two check valves in a system that is originally a closed system, so that the heating section is kept in an overlapping closed state. The steam bubbles generated by boiling the heat medium in the heating section and the pressure fluctuations caused by the disappearance of the vapor bubbles are used as the driving force to pump the liquid heat medium from the cooler 4 to the evaporator 12. However, the heating medium 11 is evaporated in the evaporator 12 located higher than the cooler 4, and the heat can be transferred downward as latent heat.

The loop heat pipe of the present invention includes an evaporator 12 and a cooler 4.
Enables heat transport even over large distances. Also,
Compared to conventional heat pipes or thermosyphons, it can be manufactured on-site and can increase the amount of heat medium transported.

〔Example〕

Next, the present invention will be explained in detail.

FIG. 1 is an explanatory cross-sectional view showing one embodiment B of the present invention, and the entire circuit is a communicating pipe circuit with a loop structure. 1 is an upper heating pipe 2, a lower heating pipe 3, a suction flow path 1a, and a discharge flow path 1.
12 is an evaporator that externally heats the liquid heat medium transported by the heat-driven pump 1 to generate steam, and 4 is a cooling heat exchanger tube located below the evaporator. This is a cooling unit containing 10. Reference numeral 7 designates an upward flow path that connects the heat-driven pump 1 and the cooler 4, and 8 represents a downward flow path that connects the evaporator 12 and the cooler 4.

As shown in the figure, these ascending and descending channels each have a bent shape so as to be located above the upper heating pipe 2 of the heat-driven pump 1. In addition, the discharge flow path 1b is also higher than the upper heating pipe 2 (standing up).The upper heating pipe 2 and the lower heating pipe 3 are entirely loop-shaped,
．． 3 communicate with each other through a suction passage la and a discharge passage 1b. In the drawing, two loop-shaped heating tubes are shown, but it may be one, or 2t[li
1 or more may be polymerized in the same manner, or may be slightly inclined toward the exit direction. Reference numerals 5 and 6 are check valves that allow the heat medium to flow in the direction of the arrow shown in the drawing.

In the present invention, the heat medium 11 is sealed from the cooler 4 to the evaporator 12 in the communication pipe line formed as described above, which has a loop structure as a whole. At this time, no heat medium is sealed in the descending flow path 8.

Examples of the heat medium include liquid metals such as sodium, Dowsome A, Freon, and water. These heat media are appropriately selected depending on the temperature of the heat source, the purpose of use, etc.

In the above loop type heat pipe, the heat medium is cooled 2
There is no need to apply external power to pump water from S4 to the evaporator 12 (a part of the available heat is used to operate the heat-driven pump 14, so the size of the heat-driven pump l is extremely large). becomes smaller.

The heat of the heat medium vaporized in the evaporator 12 moves down the downward flow path 8 to the cooler 4 . Further, the cooling fluid can be transferred from the cooler 4 to the cooling fluid flowing through the cooling heat transfer tube 10 built into the cooler.

Next, a description will be given of the flow of the heat medium when the heat medium sealed in the loop-structured communication pipe is heated and cooled as described above.

When the heat-driven pump 1 is heated and operated, a part of the heat medium 11 is vaporized, and a bubble flow, a plug flow, or a slug flow is generated in the upper heating tube 2 and the lower heating tube 3. At this time, the pressure in the system surrounded by the check valves 5 and 6 including the heating section consisting of the upper heating pipe 2 and the lower heating pipe 3 increases, and as the check valve 6 opens, the generated air bubbles disappear. , the system becomes negative pressure. As a result, the heat medium that is colder than the cooler 4 is fed into the heating section system. On the other hand, the discharged heat medium is transferred to the check valve 6
The heat medium is fed into the evaporator 12, where it is heated from the outside to generate steam. The generated steam moves to the cooler 4 via the downward flow path 8.

In order to promote the flow in the loop-shaped heating tube composed of the upper heating tube 2 and lower heating tube 3 of the heat-driven pump 1, the upper heating tube 2 and the lower heating tube 3 are slightly inclined with respect to the horizontal plane. It is also a good idea to place it in

The cooler 4 in the loop heat pipe of the present invention does not necessarily have to have the structure shown in FIG.
It may be constructed of an ornate metal tube.

Various modifications are possible to the loop heat pipe of the present invention. For example, the entire heat-driven pump 1 may be arranged at a certain inclination with respect to the horizontal. Various arrangements can be considered for the arrangement of the evaporator 12 and the heat-driven pump 1 as long as the functions of the present invention are not impaired.

〔Effect of the invention〕

The loop heat pipe of the present invention uses a heat-driven pump with a simple structure without applying external mechanical driving force.
Since the heat medium can be pumped up to the evaporator 12 installed above and the latent heat of the heat medium is utilized, a large amount of heat can be transported per volume. Therefore, the loop type heat pipe of the present invention can be used as a solar water heater.
Alternatively, it can be used in places where heat needs to be transferred from above to below, such as in chemical factories. Furthermore, the amount of heat used to drive the heat-driven pump is stored in the heat medium and transported to the evaporator, so there is no thermal loss.

[Brief explanation of the drawing]

FIG. 1 is a simple explanatory diagram of an embodiment of the present invention. FIG. 2 shows another embodiment of the present invention, in which the heat-driven pump 1 is attached below the evaporator 12. 1...:'Thermal drive pump 1a...Suction channel 1b...Discharge channel 2...Upper heating pipe 3...Lower heating pipe 4...Cooler 5...Check valve 6 ... Check valve 7 ... Upward flow path 8 ... Downward flow path 9 ... Fin 10 ... Cooling heat transfer tube 11 ... Heat medium 12 ... Evaporator Fig. 1

Claims (1)

[Claims] (1) Heat medium transport heat configured by connecting one end and the other end of the upper heating pipe 2 and lower heating pipe 3, which are installed horizontally or inclined, to the suction channel 1a and the discharge channel 1b, respectively. A drive pump 1, an evaporator 12 for heating and vaporizing the heat medium transported by the heat drive pump 1, a cooler 4 located below the drive pump 1, a suction channel 1a that connects the heat drive pump 1 and the cooler 4. an ascending channel 7 that connects the evaporator 12 and the cooler 4, and a descending channel 8 that connects the evaporator 12 and the cooler 4;
is bent so that it is located at a higher position than the upper heating pipe 2 of the heat-driven pump 1 at the connection part of the heat-driven pump 1, and the discharge flow path 1b of the heat-driven pump 1 that communicates with the evaporator 12 is connected to the upper heating pipe 2 of the heat-driven pump 1. A check valve 5 is provided at the outlet of the cooler, and a check valve 6 is provided at the rising part of the discharge flow path 1b. return the heat medium 11 to the evaporator 12;
A loop-type heat pipe that transports heat from above to below.