JPS6315045U - - Google Patents

Info

Publication number
JPS6315045U
JPS6315045U JP10680586U JP10680586U JPS6315045U JP S6315045 U JPS6315045 U JP S6315045U JP 10680586 U JP10680586 U JP 10680586U JP 10680586 U JP10680586 U JP 10680586U JP S6315045 U JPS6315045 U JP S6315045U
Authority
JP
Japan
Prior art keywords
bonding
wire
guide hole
led out
width direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10680586U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10680586U priority Critical patent/JPS6315045U/ja
Publication of JPS6315045U publication Critical patent/JPS6315045U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313Wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313Wedge
    • H01L2224/78314Shape
    • H01L2224/78317Shape of other portions
    • H01L2224/78318Shape of other portions inside the capillary

Landscapes

  • Wire Bonding (AREA)
JP10680586U 1986-07-14 1986-07-14 Pending JPS6315045U (US20030204162A1-20031030-M00001.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10680586U JPS6315045U (US20030204162A1-20031030-M00001.png) 1986-07-14 1986-07-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10680586U JPS6315045U (US20030204162A1-20031030-M00001.png) 1986-07-14 1986-07-14

Publications (1)

Publication Number Publication Date
JPS6315045U true JPS6315045U (US20030204162A1-20031030-M00001.png) 1988-02-01

Family

ID=30982506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10680586U Pending JPS6315045U (US20030204162A1-20031030-M00001.png) 1986-07-14 1986-07-14

Country Status (1)

Country Link
JP (1) JPS6315045U (US20030204162A1-20031030-M00001.png)

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