JPS63149524U - - Google Patents
Info
- Publication number
- JPS63149524U JPS63149524U JP4102287U JP4102287U JPS63149524U JP S63149524 U JPS63149524 U JP S63149524U JP 4102287 U JP4102287 U JP 4102287U JP 4102287 U JP4102287 U JP 4102287U JP S63149524 U JPS63149524 U JP S63149524U
- Authority
- JP
- Japan
- Prior art keywords
- infrared
- heating means
- infrared heating
- semiconductor substrate
- power source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000006096 absorbing agent Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Radiation Pyrometers (AREA)
Description
第１図は本考案装置の一実施例の概略構成図、
第２図は従来装置の概略構成図、第３図は被加熱
体の構成図である。
１……赤外線加熱手段、２，３……第１、第２
温度計、４……電源、５……制御手段。
FIG. 1 is a schematic configuration diagram of an embodiment of the device of the present invention;
FIG. 2 is a schematic configuration diagram of a conventional device, and FIG. 3 is a configuration diagram of a heated object. 1... Infrared heating means, 2, 3... First, second
Thermometer, 4...Power supply, 5...Control means.
Claims (1)
加熱される半導体基板とこの半導体基板の周囲に
配設されている赤外線吸収体とを備える被加熱体
の異なる２位置、すなわち前記半導体基板上及び
前記赤外線吸収体上の２位置の温度をそれぞれ個
別に測定しうるように配設されている第１、第２
温度計と、前記赤外線加熱手段を駆動する電源と
、前記第１、第２温度計の各温度出力を受けその
入力状態に応じて前記電源を制御する制御手段と
を備えてなる赤外線熱処理装置。 An object to be heated is provided with an infrared heating means, a semiconductor substrate heated by the infrared heating means, and an infrared absorber disposed around the semiconductor substrate. The first and second parts are arranged so that the temperature at two positions on the infrared absorber can be measured individually.
An infrared heat treatment apparatus comprising a thermometer, a power source for driving the infrared heating means, and a control means for receiving each temperature output from the first and second thermometers and controlling the power source according to the input state thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4102287U JPS63149524U (en) | 1987-03-20 | 1987-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4102287U JPS63149524U (en) | 1987-03-20 | 1987-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63149524U true JPS63149524U (en) | 1988-10-03 |
Family
ID=30855637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4102287U Pending JPS63149524U (en) | 1987-03-20 | 1987-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63149524U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09237764A (en) * | 1996-02-28 | 1997-09-09 | Shin Etsu Handotai Co Ltd | Radiation heating apparatus and method |
| JP2006100549A (en) * | 2004-09-29 | 2006-04-13 | Fujitsu Ltd | Rapid thermal processing device |
-
1987
- 1987-03-20 JP JP4102287U patent/JPS63149524U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09237764A (en) * | 1996-02-28 | 1997-09-09 | Shin Etsu Handotai Co Ltd | Radiation heating apparatus and method |
| JP2006100549A (en) * | 2004-09-29 | 2006-04-13 | Fujitsu Ltd | Rapid thermal processing device |