JPS63149395A - Plating apparatus - Google Patents

Abstract

PURPOSE:To simplify the operation in the case of exchanging anodes by mounting elevating means to a member which supports soluble anodes settled opposite to a conductor roll conveying a strip metallic body to be plated and permitting said means to move slantingly. CONSTITUTION:The surface of a metallic plate 1 is subjected to a plating treatment by the titled plating apparatus by turning on electricity between the conductor roll 2 which conveys the strip metallic body 1 immersed in an electrolytic soln. and the soluble anodes 3 of plural blocks. Said anodes 3 are supported on the anode supporting member 4 which is settled opposite to said roll 2. The elevating means 10-12, 20-22 which elevate slantingly movably are mounted to the supporting member 4.

Description

Detailed Description of the Invention [Industrial Field of Application] The present invention provides a method for transporting the strip-shaped metal body by passing an electric current between a conductor roll that conveys the strip-shaped metal body and a plurality of soluble electrodes on an electrode support member. The present invention relates to a plating device that performs plating treatment on bodies.

[Conventional technology]

FIG. 7 is a perspective view showing a conventional plating apparatus. In the figure, numeral 1 denotes a strip-shaped metal body (hereinafter referred to as a strip) to be plated, which is inserted from the direction of arrow A to the direction of arrow B.
It is conveyed by the rotation of the conductor roll 2.

Reference numeral 3 indicates a plurality of dissolvable electrodes arranged in series, each consisting of an independent block mass. 4 is an electrode support member of the soluble electrode 3.

Moreover, each soluble electrode 3 has a half-moon shape as a whole,
There is a protrusion 3a on its back surface, and a part of this protrusion 3a can be placed on the electrode support member 4 and slid. Reference numeral 5 denotes a cylinder that supports a push rod 6, which is used to move each soluble electrode 3 in the direction of arrow P in the figure.

Next, in order to clarify the configuration in FIG. 7, FIG. 8 was prepared.

FIG. 8 is an explanatory window showing the arrangement of the various parts of the plating apparatus shown in FIG. The distance 11i1G from the conductor roll 2 is kept constant.

In addition, each of the town melting electrodes 3 is placed in the position shown in the figure depending on the degree of melting, and new ones are added by being pushed sequentially from right to left by the extension of the push rod 6 by the cylinder 5. go.

Next, the operation will be explained.

The strip 1 is continuously conveyed in the direction of the arrow entry and the direction of the arrow B by the rotation of the conductor roll 2. At this time,
A DC voltage is applied between the conductor roll 2 and each soluble electrode 3, and a plating current flows through the electrolyte in the tank in which the entire device is immersed, so that the strip 1 is plated. be done. 1. Due to the plating current,
Each meltable electrode 3 is melted in accordance with its plating current t, and adheres to the strip 1 for plating.

Here, the meltable electrodes 3 are sequentially inserted and melted as shown in FIG. 8, so that the one on the left side of the figure has a greater degree of melting and is therefore thinner.

Further, the slope provided on the electrode support member 4 is provided in order to maintain a constant distance G between the conductor roll 2 and the surface of each dissolvable electrode 3, which becomes thinner as described above.

[Problem that the invention seeks to solve]

Conventional plating equipment is configured as described above, so
When changing the type of plating, it is necessary to replace all of the fusible electrodes 3 with ones made of a different material. Therefore, as new fusible electrodes, the thinner electrodes are replaced in the order in which they become thinner. It is necessary to insert the electrodes into the electrodes, which poses problems such as the trouble of storing dissolvable electrodes of different shapes and managing the order of replacement and insertion, as well as making operational management inefficient.

This invention was made to solve the above-mentioned problems, and when replacing all the soluble electrodes, it is possible to always insert only new soluble electrodes that are not thinner, and Another object of the present invention is to provide a plating device that can uniformly use up all of the currently inserted soluble electrodes before replacing the soluble electrodes, which is scheduled in advance if necessary.

[Means for solving problems]

The plating apparatus according to the present invention is configured such that a lifting means is attached to an electrode support member of a soluble electrode placed opposite to a conductor roll, and the electrode support member is tiltably raised and lowered by the lifting means. be.

[For production]

Since the lifting means in this invention can raise and lower the electrode support member in a tiltable manner, it is possible to insert all soluble electrodes of the same shape when exchanging the electrodes, and furthermore, the above-mentioned tilt can be adjusted arbitrarily during operation. Since it is possible to perform operations such as attaching the dissolvable electrode, the work when replacing the dissolvable electrode is facilitated.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 4 denotes an electrode support member υ of the soluble electrode 3, and as shown in FIG. Arms 10.20 are provided 9, which are slidably held by arm supports 11.21 so as not to fall over.

As shown in FIG. 2, a worm gear 15.25 is provided vertically on the surface of the arm fO, 20, and a gear 16.26 meshed with the worm gear 16.26 is connected to an electric motor 12.22.
The structure is such that each arm 10.20 can be slid into the arm support base 11.21 by being driven by the above mechanism, and thereby both ends of the electrode support member 4 can be independently moved up and down. It becomes.

This allows the electrode support member 4 to be adjusted in height, including inclination, by adjusting each of the arms 10, 20.

Further, a pulse generator 13.23 for detecting the position of the arm 10.20 is connected to the shafts 17, 27 of the motor 12.22, respectively.

FIG. 3 is a block connection diagram showing a system for vertically moving both ends of the electrode support member 4 and a system for applying DC voltage for plating. In the figure, numeral 31 is a high-voltage power supply that applies a high DC voltage between the conductor roll 2 and the electrode support member 4, and uses, for example, an I/Putter device. 32 is a current sensor that detects the current flowing through the conductor roll 2 and the electrode support member 4, and inputs this detected current together with a set reference current to an automatic current controller 33. Maintain the current at a predetermined specified value.

On the other hand, 34 is a voltage sensor of the high voltage power supply 31, and the output of this voltage sensor 34 is inputted to a proportional integrator 35 together with a set reference voltage inputted from the outside.
A signal corresponding to the change in the output of the electrode support member 4
Calculate the tilt correction data. 36 is a proportional integrator 35
The output circuit 37 is a position control circuit that generates a drive current for the motor 12.22 according to the output signal of the output circuit 36, and this is the output of the pulse generator 13.23 which is the arm position detection output. While maintaining the relationship with the output signal of the output circuit 36 at a predetermined value, the electric motors 12 and 22 are driven and controlled to raise and lower the electrode support member 4 at an angle that does not cause uneven plating.

Next, the operation will be explained. First, the state in which the electrode support member 4 is at the lowest position and horizontal is the first state.
This is the initial state of plating as shown in the figure. In this state, if the dissolvable electrodes 3 are inserted sequentially starting from the cloth in the figure, the distance G between the conductor roll 2 and the dissolvable electrodes 3 will be kept constant as shown in the figure. When energization is started, each soluble electrode 3 begins to uniformly dissolve.

Therefore, when the electric motor 12 is driven to raise only the arm 10 a little, the distance G becomes smaller on the left side in FIG. 1, as shown in FIG.

In this case, depending on the nature of the current, the current at the smaller distance G will be larger, and therefore the solubility of the soluble electrode 3 at the smaller distance will be larger. Therefore, if this state continues for a while, the distance G will shift to a uniform state as shown in FIG.

The state shown in FIG. 5 is exactly the same as the conventional electrode support device shown in FIG. 8.

Normal plating energization operation continues in this state.

Next, when electrode replacement is scheduled, it is necessary to use up all of the soluble electrode 3, which is currently in the state shown in FIG. In this case, as shown in FIG. 6, the arm 20 is raised and the distance G
The solubility of the soluble electrode 3 is increased in the portion where the soluble electrode 3 has become small, thereby making it possible to uniformly wear out the entire electrode.

In this way, there is no need to store the remaining thin dissolvable electrodes 3, and they can all be picked up for next replacement.

Further, since sudden changes in the elevation of the arm 10 or 20 cause uneven plating, the voltage applied between the conductor roll 2 and the soluble electrode 3 is monitored by a voltage sensor 34 shown in FIG. Then, using the proportional integrator 35 and the position control circuit 37, the voltage is adjusted to an appropriate level.
It is desirable to limit the amount of elevation of each arm 10.20.

In the above embodiment, the motors 12 and 22 are used to raise and lower the arm 10.20, but the same effect can be obtained even if a lifting means such as a hydraulic cylinder is used.

Further, the system for correcting the inclination of the electrode support member 4 toward the target value can also be realized by a microcomputer.

〔Effect of the invention〕

As described above, according to the present invention, since the inclination and height of the electrode support member can be adjusted according to the degree of wear of the soluble electrode, electrode conversion can be performed smoothly when changing the plating type. Moreover, unlike conventional devices, the dissolvable electrode is processed into a predetermined shape for initial insertion during replacement.
Benefits include eliminating the need to store previously used items.

[Brief explanation of the drawing]

FIG. 1 is a front view of a plating apparatus according to an embodiment of the present invention, FIG. 2 is a partially cutaway front view showing details of the elevating means, and FIG. 3 is a circuit diagram showing the elevating system of the electrode support member. , FIG. 4, FIG. 5, and FIG. 6 are front views of the plating apparatus showing the situation before and after the tilting operation of the electrode support member, FIG. 7 is a perspective view of the conventional plating apparatus, and FIG. FIG. 8 is an explanatory diagram showing the arrangement relationship of each part of the plating apparatus shown in FIG. 7; Reference numeral 1 denotes a band-shaped metal body, 2 a conductor roll, and 3 the same reference numerals in the drawings indicate the same or corresponding parts.

Claims (3)

[Claims] (1) A current is passed between a conductor roll that is immersed in an electrolytic solution and conveys a band-shaped metal body, and a plurality of blocks of soluble electrodes supported on an electrode support member installed opposite to this conductor roll, and the above-mentioned In a plating device that performs plating treatment on the surface of a band-shaped metal body, the electrode supporting member is
A plating device characterized by being equipped with a lifting means for tilting the device up and down. (2) The plating apparatus according to claim 1, wherein the elevating means comprises a motor, a gear driven by the motor, and an arm equipped with a worm gear meshing with the gear. (3) The tilting of the electrode support member by the lifting means is automatically adjusted based on the voltage between the conductor roll and the soluble electrode detected by a voltage sensor. The plating equipment described.