JPS63147868U - - Google Patents
Info
- Publication number
- JPS63147868U JPS63147868U JP3932987U JP3932987U JPS63147868U JP S63147868 U JPS63147868 U JP S63147868U JP 3932987 U JP3932987 U JP 3932987U JP 3932987 U JP3932987 U JP 3932987U JP S63147868 U JPS63147868 U JP S63147868U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- circuit board
- printed circuit
- flexible printed
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987039329U JPH0537496Y2 (US20020193084A1-20021219-M00002.png) | 1987-03-17 | 1987-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987039329U JPH0537496Y2 (US20020193084A1-20021219-M00002.png) | 1987-03-17 | 1987-03-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63147868U true JPS63147868U (US20020193084A1-20021219-M00002.png) | 1988-09-29 |
| JPH0537496Y2 JPH0537496Y2 (US20020193084A1-20021219-M00002.png) | 1993-09-22 |
Family
ID=30852387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987039329U Expired - Lifetime JPH0537496Y2 (US20020193084A1-20021219-M00002.png) | 1987-03-17 | 1987-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537496Y2 (US20020193084A1-20021219-M00002.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006196832A (ja) * | 2005-01-17 | 2006-07-27 | Kyocera Corp | 多層配線基板 |
| JP2010219262A (ja) * | 2009-03-17 | 2010-09-30 | Murata Mfg Co Ltd | 回路基板 |
| JP2022077489A (ja) * | 2020-11-11 | 2022-05-23 | 宸寰科技有限公司 | 放熱導電性フレキシブル基板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57104560U (US20020193084A1-20021219-M00002.png) * | 1980-12-17 | 1982-06-28 |
-
1987
- 1987-03-17 JP JP1987039329U patent/JPH0537496Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57104560U (US20020193084A1-20021219-M00002.png) * | 1980-12-17 | 1982-06-28 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006196832A (ja) * | 2005-01-17 | 2006-07-27 | Kyocera Corp | 多層配線基板 |
| JP4606181B2 (ja) * | 2005-01-17 | 2011-01-05 | 京セラ株式会社 | 多層配線基板 |
| JP2010219262A (ja) * | 2009-03-17 | 2010-09-30 | Murata Mfg Co Ltd | 回路基板 |
| JP2022077489A (ja) * | 2020-11-11 | 2022-05-23 | 宸寰科技有限公司 | 放熱導電性フレキシブル基板 |
| CN114554674A (zh) * | 2020-11-11 | 2022-05-27 | 宸寰科技有限公司 | 散热导电软板 |
| CN114554674B (zh) * | 2020-11-11 | 2024-05-28 | 宸寰科技有限公司 | 散热导电软板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0537496Y2 (US20020193084A1-20021219-M00002.png) | 1993-09-22 |
