JPS63147835U - - Google Patents
Info
- Publication number
- JPS63147835U JPS63147835U JP3929787U JP3929787U JPS63147835U JP S63147835 U JPS63147835 U JP S63147835U JP 3929787 U JP3929787 U JP 3929787U JP 3929787 U JP3929787 U JP 3929787U JP S63147835 U JPS63147835 U JP S63147835U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- conductor
- package
- lead pins
- circuit package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3929787U JPS63147835U (id) | 1987-03-18 | 1987-03-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3929787U JPS63147835U (id) | 1987-03-18 | 1987-03-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63147835U true JPS63147835U (id) | 1988-09-29 |
Family
ID=30852323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3929787U Pending JPS63147835U (id) | 1987-03-18 | 1987-03-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63147835U (id) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08139265A (ja) * | 1994-11-11 | 1996-05-31 | Nec Corp | 半導体装置用モールドパッケージ |
-
1987
- 1987-03-18 JP JP3929787U patent/JPS63147835U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08139265A (ja) * | 1994-11-11 | 1996-05-31 | Nec Corp | 半導体装置用モールドパッケージ |