JPS6314723U - - Google Patents

Info

Publication number
JPS6314723U
JPS6314723U JP10820586U JP10820586U JPS6314723U JP S6314723 U JPS6314723 U JP S6314723U JP 10820586 U JP10820586 U JP 10820586U JP 10820586 U JP10820586 U JP 10820586U JP S6314723 U JPS6314723 U JP S6314723U
Authority
JP
Japan
Prior art keywords
split ring
locking
ring body
locking hole
small
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10820586U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0431391Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10820586U priority Critical patent/JPH0431391Y2/ja
Publication of JPS6314723U publication Critical patent/JPS6314723U/ja
Application granted granted Critical
Publication of JPH0431391Y2 publication Critical patent/JPH0431391Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Supports For Pipes And Cables (AREA)
  • Mutual Connection Of Rods And Tubes (AREA)
JP10820586U 1986-07-15 1986-07-15 Expired JPH0431391Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10820586U JPH0431391Y2 (enrdf_load_stackoverflow) 1986-07-15 1986-07-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10820586U JPH0431391Y2 (enrdf_load_stackoverflow) 1986-07-15 1986-07-15

Publications (2)

Publication Number Publication Date
JPS6314723U true JPS6314723U (enrdf_load_stackoverflow) 1988-01-30
JPH0431391Y2 JPH0431391Y2 (enrdf_load_stackoverflow) 1992-07-28

Family

ID=30985184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10820586U Expired JPH0431391Y2 (enrdf_load_stackoverflow) 1986-07-15 1986-07-15

Country Status (1)

Country Link
JP (1) JPH0431391Y2 (enrdf_load_stackoverflow)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6620723B1 (en) 2000-06-27 2003-09-16 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US6551929B1 (en) 2000-06-28 2003-04-22 Applied Materials, Inc. Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US7101795B1 (en) 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US6765178B2 (en) 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6734020B2 (en) 2001-03-07 2004-05-11 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6833161B2 (en) 2002-02-26 2004-12-21 Applied Materials, Inc. Cyclical deposition of tungsten nitride for metal oxide gate electrode
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
KR20060079144A (ko) 2003-06-18 2006-07-05 어플라이드 머티어리얼스, 인코포레이티드 배리어 물질의 원자층 증착

Also Published As

Publication number Publication date
JPH0431391Y2 (enrdf_load_stackoverflow) 1992-07-28

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