JPS63146939A - Stamping molding sheet - Google Patents
Stamping molding sheetInfo
- Publication number
- JPS63146939A JPS63146939A JP61293543A JP29354386A JPS63146939A JP S63146939 A JPS63146939 A JP S63146939A JP 61293543 A JP61293543 A JP 61293543A JP 29354386 A JP29354386 A JP 29354386A JP S63146939 A JPS63146939 A JP S63146939A
- Authority
- JP
- Japan
- Prior art keywords
- pref
- resin
- matrix resin
- fiber
- polyphenylene sulfide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 34
- 239000011159 matrix material Substances 0.000 claims abstract description 26
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- 239000004734 Polyphenylene sulfide Substances 0.000 claims abstract description 21
- 229920000069 polyphenylene sulfide Polymers 0.000 claims abstract description 21
- 239000004952 Polyamide Substances 0.000 claims abstract description 17
- 239000000835 fiber Substances 0.000 claims abstract description 15
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 9
- 230000002787 reinforcement Effects 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 abstract description 11
- 239000002131 composite material Substances 0.000 abstract description 10
- 229920000049 Carbon (fiber) Polymers 0.000 abstract description 8
- 239000004917 carbon fiber Substances 0.000 abstract description 8
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 7
- 229920003986 novolac Polymers 0.000 abstract description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 3
- 229920002292 Nylon 6 Polymers 0.000 abstract 1
- 239000004677 Nylon Substances 0.000 description 14
- 229920001778 nylon Polymers 0.000 description 14
- -1 polypropylene Polymers 0.000 description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 239000012779 reinforcing material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 229930185605 Bisphenol Natural products 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 229960003742 phenol Drugs 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 4
- 230000000379 polymerizing effect Effects 0.000 description 4
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 229910052979 sodium sulfide Inorganic materials 0.000 description 2
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- BZUILZIKDIMXBK-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxycarbonyl)benzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)OCC1OC1 BZUILZIKDIMXBK-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- MILSYCKGLDDVLM-UHFFFAOYSA-N 2-phenylpropan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)C1=CC=CC=C1 MILSYCKGLDDVLM-UHFFFAOYSA-N 0.000 description 1
- VZXOZSQDJJNBRC-UHFFFAOYSA-N 4-chlorobenzenethiol Chemical compound SC1=CC=C(Cl)C=C1 VZXOZSQDJJNBRC-UHFFFAOYSA-N 0.000 description 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 244000226021 Anacardium occidentale Species 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 101100087393 Caenorhabditis elegans ran-2 gene Proteins 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- CFZQXOAMRAWWCB-UHFFFAOYSA-N OC1(C(COCC2(C(O2)(O)O)O)(O1)O)O Chemical class OC1(C(COCC2(C(O2)(O)O)O)(O1)O)O CFZQXOAMRAWWCB-UHFFFAOYSA-N 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 241001365914 Taira Species 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 235000020226 cashew nut Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- BQQUFAMSJAKLNB-UHFFFAOYSA-N dicyclopentadiene diepoxide Chemical compound C12C(C3OC33)CC3C2CC2C1O2 BQQUFAMSJAKLNB-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 239000011968 lewis acid catalyst Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- IHYNKGRWCDKNEG-UHFFFAOYSA-N n-(4-bromophenyl)-2,6-dihydroxybenzamide Chemical compound OC1=CC=CC(O)=C1C(=O)NC1=CC=C(Br)C=C1 IHYNKGRWCDKNEG-UHFFFAOYSA-N 0.000 description 1
- VAUOPRZOGIRSMI-UHFFFAOYSA-N n-(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CNC1=CC=CC=C1 VAUOPRZOGIRSMI-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- CQRYARSYNCAZFO-UHFFFAOYSA-N salicyl alcohol Chemical compound OCC1=CC=CC=C1O CQRYARSYNCAZFO-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Reinforced Plastic Materials (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、機械的性質及び耐熱性のすぐれたスタンピン
グ成形品を与えることのできるスタンピング成形用シー
トに関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a sheet for stamping molding that can provide stamping molded products with excellent mechanical properties and heat resistance.
〈従来の技術とその問題点〉
樹脂シートを該樹脂の融点または軟化点以上の温度に予
備加熱し、これを所定形状の一対の金型間に供して急速
な圧力を加えることにより圧縮賦形、冷却することから
なるいわゆるスタンピング成形法は短時間で成形可能で
あシ、大型成形品をすぐれた生産性で製造できる方法と
して注目されている。特に、マトリックス樹脂として、
熱可塑性樹脂を用いる為、取金の成形と同様、成形サイ
クルが短かく、生産性に後れている。<Prior art and its problems> A resin sheet is preheated to a temperature higher than the melting point or softening point of the resin, and is compressed by applying rapid pressure between a pair of molds of a predetermined shape. The so-called stamping molding method, which involves cooling, can be molded in a short time and is attracting attention as a method that can produce large molded products with excellent productivity. In particular, as a matrix resin,
Because thermoplastic resin is used, the molding cycle is short, similar to the molding of metal fittings, and productivity lags behind.
質を強化し、特にガラス繊維や炭粱繊維の長繊維を編織
してなる布状物(以下炭素繊維布状物と略称する)によ
シ強化されたものから得られたスタンピング成形品はす
ぐれた機械的性質を有している。この際の熱可塑性のマ
) IJツクス稙脂としてはポリプロピレン樹脂やナイ
ロン樹脂がほとんどでアシ、ポリフェニレンスルフィド
樹脂などの使用も試みられている。Stamping molded products obtained from materials reinforced with a cloth-like material made by knitting and weaving long fibers of glass fiber or charcoal fiber (hereinafter referred to as carbon fiber cloth) are excellent. It has good mechanical properties. The thermoplastic resin used in this case is mostly polypropylene resin or nylon resin, but attempts have also been made to use reed, polyphenylene sulfide resin, etc.
近年、自動車や航空宇宙関係など構造材料としてより軽
量化の要望される分野では、さらに高度の機械的性質、
耐熱性が求められているが、従来のポリプロピレン樹脂
やナイロン樹脂をマトリックスとするスタンピング成形
品には限界があった。In recent years, in fields where there is a demand for lighter structural materials such as automobiles and aerospace, materials with even higher mechanical properties and
Heat resistance is required, but conventional stamping molded products with a matrix of polypropylene resin or nylon resin have limitations.
又、ポリフェニレンスルフィドは卓越した耐熱性を有し
ておシ、スタンピング成形用シートのマトリックス樹脂
として注目されている。しかしながら、ポリフェニレン
スルフィドは補強材との密着性、含浸性に課題があシ、
充分な性能が得られない。Furthermore, polyphenylene sulfide has excellent heat resistance and is attracting attention as a matrix resin for stamping molding sheets. However, polyphenylene sulfide has problems with adhesion and impregnation with reinforcing materials.
Sufficient performance cannot be obtained.
く問題点を解決するだめの手段〉
本発明者らは、上記の如き状況に鑑み、機械的性質及び
耐熱性を賦与しうるスタンピング成形用シートを得べく
鋭意検討した結果、マトリックス樹脂として、ポリフェ
ニレンスルフィド、ポリアミド及びエポキシ樹脂からな
る組成物を用いることが有効であることを見い出し、本
発明に到達したものである。In view of the above-mentioned situation, the inventors of the present invention conducted intensive studies to obtain a sheet for stamping molding that can impart mechanical properties and heat resistance, and found that polyphenylene was used as the matrix resin. The inventors have discovered that it is effective to use a composition consisting of sulfide, polyamide, and epoxy resin, and have arrived at the present invention.
即ち、本発明は、ポリフェニレンスルフィド、ポリアミ
ド及びエポキシ樹脂から彦るマトリックス樹脂(A)と
繊維補強材CB)とを複合一体化してなることを特徴と
するスタンピング成形用シートを提供するものである。That is, the present invention provides a sheet for stamping molding, which is characterized in that it is formed by compositely integrating a matrix resin (A) made of polyphenylene sulfide, polyamide, and epoxy resin and a fiber reinforcing material CB).
本発明では、ポリフェニレンスルフィド、ポリアミド及
びエポキシ樹脂から々る組成物をマトリックス樹脂とし
て用いるため、ポリフェニレンスルフィドに於いて問題
となは推測の域を出ないが、繊維補強材との密着性、マ
トリックス樹脂自体の靭性に起因するものと思われる。In the present invention, since a composition consisting of polyphenylene sulfide, polyamide, and epoxy resin is used as the matrix resin, the problems with polyphenylene sulfide can only be speculated, but the adhesion with the fiber reinforcement material and the matrix resin This seems to be due to its own toughness.
本発明に使用するポリフェニレンスルフィドとしては含
むものがすぐれた特性の組成物をもたらすので好ましい
。As the polyphenylene sulfide used in the present invention, it is preferable to use polyphenylene sulfide because it provides a composition with excellent properties.
ポリフェニレンスルフィドの重合方法としては、p−ジ
クロルベンゼンを硫黄と炭酸ソーダの存在下で重合させ
る方法、極性溶媒中で硫化ナトリウムあるいは水硫化ナ
トリウムと水酸化ナトリウム又は硫化水素と水酸化ナト
リウムあるいはす) IJウムアミノアルカノエートの
存在下で重合させる方法、p−クロルチオフェノールの
自己縮合などがあげられるが、N−メチルピロリドン、
ジメチルアセトアミドなどのアミド系溶媒やスルホラン
等のスルホン系溶媒中で硫化ナトリウムとp−ジクロル
ベンゼンを反応させる方法が一般的である。この際に重
合度を調節するためにカルボン酸やスルホン酸のアルカ
リ金属塩を添加したり、水酸化アルカリを添加してもよ
い。共重合成分として、30モフェニル基、アルコキシ
基、カルボン酸基またはカルボンを含有していても、ポ
リマーの結晶性に大きく影響しない範囲でかまわないが
、好ましくは共重合成分は10モル%以下がよい。特に
3官能性以上のフェニル、ビフェニル、ナフチルスルフ
ィド結合などを共重合に選ぶ場合は6モル%以下、さら
に好ましくは1モル%以下がよい。Polyphenylene sulfide can be polymerized by polymerizing p-dichlorobenzene in the presence of sulfur and sodium carbonate, or by polymerizing p-dichlorobenzene in the presence of sulfur and sodium carbonate, or by polymerizing sodium sulfide or sodium bisulfide and sodium hydroxide or hydrogen sulfide and sodium hydroxide in a polar solvent. Examples include polymerization in the presence of IJ-aminoalkanoate, self-condensation of p-chlorothiophenol, and N-methylpyrrolidone,
A common method is to react sodium sulfide and p-dichlorobenzene in an amide solvent such as dimethylacetamide or a sulfone solvent such as sulfolane. At this time, an alkali metal salt of carboxylic acid or sulfonic acid or an alkali hydroxide may be added to adjust the degree of polymerization. The copolymerization component may contain a 30mophenyl group, an alkoxy group, a carboxylic acid group, or a carboxyl group as long as it does not significantly affect the crystallinity of the polymer, but preferably the copolymerization component should be 10 mol% or less. . In particular, when trifunctional or more functional phenyl, biphenyl, naphthyl sulfide bonds, etc. are selected for copolymerization, the amount is preferably 6 mol% or less, more preferably 1 mol% or less.
かかるPPSの具体的な製造法としては、例えば(1)
ハロゲン置換芳香族化合物と硫化アルカリとの反応(米
国特許第2513188号、特公昭44−27671号
および特公昭45−3368号参照)、(2) チオ
フェノール類のアルカリ触媒又は銅塩等の共存下におけ
る縮合反応(米国特許第3274165号および英国特
許第1160660号参照)、
(3)芳香族化合物を塩化硫貢とのルイス酸触媒共存下
に於ける縮合反応(特公昭46−27255号およびベ
ルギー特許第29437号参照)、
(4)高分子量ppsの製造方法(特公昭52−12,
240、特公昭54−8719、特公昭55−25,5
88、特公昭57−334、特開昭55−43,139
、 USP4.350,810、USP4,324,8
86)等が挙げられる。As a specific method for producing such PPS, for example, (1)
Reaction of a halogen-substituted aromatic compound with an alkali sulfide (see U.S. Patent No. 2,513,188, Japanese Patent Publication No. 44-27671 and Japanese Patent Publication No. 45-3368), (2) In the coexistence of an alkali catalyst or copper salt of thiophenols, etc. (3) condensation reaction of an aromatic compound with sulfuric acid chloride in the presence of a Lewis acid catalyst (see Japanese Patent Publication No. 46-27255 and Belgian Patent No. No. 29437), (4) Process for producing high molecular weight pps (Special Publication No. 52-12,
240, Special Publication No. 54-8719, Special Publication No. 55-25.5
88, JP 57-334, JP 55-43, 139
, USP4.350,810, USP4,324,8
86) etc.
本発明に於いては、前記ポリフェニレンスルフィドのい
ずれを使用してもかまわないが、成形の容易さ及び機械
的性能の観点からは、A8TM D−1238−74
(315,6℃ 5kl?荷重)で測定されたメルトフ
ローレートで一般には1α000〜100の範囲が、好
ましくは、5.000〜500の範囲で使用される。In the present invention, any of the above polyphenylene sulfides may be used, but from the viewpoint of ease of molding and mechanical performance, A8TM D-1238-74 is preferred.
Generally, a range of 1α000 to 100, preferably a range of 5.000 to 500, is used as a melt flow rate measured at 315.6° C. and 5 kl?load.
本発明で用いるポリアミドとしては、周知の種々のもの
を挙げることができる。例えば、硫酸、アジピン酸、ス
ペリン酸、セバシン酸、テレフタル酸、イソフタル酸、
1゜4−シクロヘキシルジカルボン酸のようなジカルボ
ン酸とエチレンジアミン、ペンタメチレンジアミン、ヘ
キサメチレンジアミン、デカメチレンジアミン、1,4
−シクロヘキグルジアミン、m−キシリレンジアミンの
ようなジアミンとを重縮合して得られるポリアミド:カ
プロラクタム、ラウリンラクタムのような環状ラクタム
を重合して得られるポリアミド;あるいは環状ラクタム
と、ジカルボン酸とジアミンとの塩を共重合して得られ
るポリアミド等を挙げることができる。これらのポリア
ミドのうち、好ましくは6−ナイロン、66ナイロン、
6・10ナイロン、66/6・10ナイロン、6/66
ナイロン、12ナイロン、11ナイロン、6/6ナイロ
ン(カプロラクタムとテレフタル酸とへキサメチレンジ
アミンとの塩の共重合体)等が挙げられ、とくに好適な
ものとしては6ナイロン及び66ナイロンである。Various well-known polyamides can be used as the polyamide used in the present invention. For example, sulfuric acid, adipic acid, superric acid, sebacic acid, terephthalic acid, isophthalic acid,
1゜Dicarboxylic acids such as 4-cyclohexyldicarboxylic acid and ethylenediamine, pentamethylenediamine, hexamethylenediamine, decamethylenediamine, 1,4
- Polyamides obtained by polycondensing diamines such as cyclohexigludiamine and m-xylylene diamine; Polyamides obtained by polymerizing cyclic lactams such as caprolactam and laurinlactam; or cyclic lactams, dicarboxylic acids, and diamines. Examples include polyamides obtained by copolymerizing salts with. Among these polyamides, 6-nylon, 66 nylon,
6/10 nylon, 66/6/10 nylon, 6/66
Nylon, 12 nylon, 11 nylon, 6/6 nylon (a copolymer of a salt of caprolactam, terephthalic acid, and hexamethylene diamine), etc., and particularly preferred are 6 nylon and 66 nylon.
又、本発明に使用するエポキシ樹脂としてはエポキシ基
を1個あるいは2個以上含むものであシ、液体または固
体状のものが使用できる。たとえばビスフェノールAル
ゾルシノール、ハイドロキノン、ピロカテコール、ビス
フェノールF1サリゲニン、11315−ト’Jヒドロ
キシベンゼン、ビスフェノールS1 トリヒドロキシ−
ジフェニルジメチルメタン、4.4’−ジヒドロキシビ
フェニル、1゜5−ジヒドロキシナフタレン、カシュー
フェノール、21215.5−テトラキス(4−ヒドロ
キシフェニル)ヘキサンなどのビスフェノールのグリシ
ジルエーテル、ビスフェノールの代りにノ・ロゲン化ビ
スフェノール、ブタンジオールのジグリシジルエーテル
などのグリシジルエーテル糸、フタル酸グリシジルエス
テル等のグリシジルエステル糸、N−グリシジルアニリ
ン等のグリシジルアミン糸等々のグリシジルエポキシ樹
脂2エポキシ化ポリオレフィン、エホキシ化大豆油等の
勝状系及びビニルシクロヘキセンジオキサイド、ジシク
ロペンタジェンジオキサイド等の環状糸の非グリシジル
エポキシ樹脂が例示される。The epoxy resin used in the present invention may contain one or more epoxy groups, and may be liquid or solid. For example, bisphenol A rsorcinol, hydroquinone, pyrocatechol, bisphenol F1 saligenin, 11315-to'J hydroxybenzene, bisphenol S1 trihydroxy-
Glycidyl ethers of bisphenols such as diphenyldimethylmethane, 4,4'-dihydroxybiphenyl, 15-dihydroxynaphthalene, cashew phenol, 21215.5-tetrakis(4-hydroxyphenyl)hexane, and non-loginated bisphenols in place of bisphenol. , glycidyl ether threads such as diglycidyl ether of butanediol, glycidyl ester threads such as phthalic acid glycidyl ester, glycidyl amine threads such as N-glycidylaniline, etc. Glycidyl epoxy resin 2 epoxidized polyolefin, epoxidized soybean oil, etc. Examples include non-glycidyl epoxy resins with cyclic threads such as vinyl cyclohexene dioxide, dicyclopentadiene dioxide, and the like.
本発明において特に好ましいエポキシ樹脂はノボラック
型エポキシ@脂である。ノボラック型エポキシ樹脂は、
エポキシ基を2個以上含有し、通常ノボラック型フェノ
ールm8kにエピクロルヒドリンを反応させて得られる
ものである、又、ノボラック型フェノール樹脂はフェノ
ール類トホルムアルデヒドとの縮合反応によシ得られる
。この原料のフェノール類としては特に制限はないがフ
ェノール、0−クレゾール、m−クレゾール、p−クレ
ゾール、ビスフェノールAルゾルシノール、p−ターシ
ャリ−ブチルフェノール、ビスフェノールF1 ビスフ
ェノールSおよびこれらの混合物が特に好適に用いられ
る。更に、ポリ−p−ビニルフェノールのエポキシ化物
もノボラック型エポキシ樹脂と同様に用いることができ
る。尚、これらノボラック型エポキシ樹脂はハロゲン、
水酸基等を有していてもよく、単独又は2種以上の混合
物として使用してもよい。A particularly preferred epoxy resin in the present invention is a novolac type epoxy resin. Novolac type epoxy resin is
It contains two or more epoxy groups and is usually obtained by reacting novolac-type phenol m8k with epichlorohydrin.Novolac-type phenol resin can also be obtained by a condensation reaction with phenols and toformaldehyde. There are no particular restrictions on the phenols used as this raw material, but phenol, 0-cresol, m-cresol, p-cresol, bisphenol A rsorcinol, p-tert-butylphenol, bisphenol F1, bisphenol S, and mixtures thereof are particularly preferably used. . Furthermore, an epoxidized product of poly-p-vinylphenol can also be used in the same manner as the novolac type epoxy resin. In addition, these novolac type epoxy resins contain halogen,
It may have a hydroxyl group, etc., and may be used alone or as a mixture of two or more.
一般にエポキシ樹脂はアミン類、酸無水物、多硫化物、
フェノール樹脂などの硬化剤を配合して成形されるが、
本発明においては硬化剤を全く使用しないか、あるいは
使用するにしてもその活性水素基がエポキシ基成分の半
分以下のモル比であることが望ましい。通常量の硬化剤
を併用した場合には、エポキシ樹脂とPP8との反応が
阻害されるばかシか、エポキシ樹脂と硬化剤との反応に
よる架橋網目の生成など溶融粘度の安定的な増加が望め
なくなるからである。硬化剤併用の効果としてはエポキ
シ樹脂添加によるブリード性や熱的性質の低下を防止す
ること等が期待できる。Generally, epoxy resins contain amines, acid anhydrides, polysulfides,
It is molded by adding a hardening agent such as phenolic resin,
In the present invention, it is desirable that no curing agent be used at all, or even if it is used, the molar ratio of the active hydrogen groups to the epoxy group component is less than half. If a normal amount of a curing agent is used together, the reaction between the epoxy resin and PP8 will be inhibited, or the reaction between the epoxy resin and the curing agent will produce a crosslinked network, resulting in a stable increase in melt viscosity. Because it will disappear. The effect of the combined use of a curing agent is expected to be to prevent deterioration of bleeding properties and thermal properties due to the addition of an epoxy resin.
本発明のスタンピング成形用シートを構成するマトリッ
クス樹脂ハ、上記ポリフェニレンスルフィド、ポリアミ
ド及びエポキシ樹脂の3成分よシなる組成物である。各
成分の混合割合は特に限定されないが、一般にはポリフ
ェニレンスルフィド99〜20重量部、ポリアミド1〜
80重量部、ポリフェニレンスルフィドとポリアミドと
の合計100重量部に対してエポキシ樹脂0.1〜20
重量部が、適当である。尚、ポリアミドが少なすぎると
サーマルクラックが生じ易くガリ、逆に多すき゛ると耐
熱性が低下する。エポキシ樹脂は、比較的少量でも効果
が発揮されるが、α1重量部未満になると効果が認めら
れなくなる。また多すぎる場合は機械的性能が低下した
シ、添加するエポキシ樹脂の種類によっては成形品表面
へのブリードや、成形用シートの溶銚度の安定性を損ね
る。The matrix resin constituting the stamping molding sheet of the present invention is a composition consisting of three components: the above-mentioned polyphenylene sulfide, polyamide, and epoxy resin. The mixing ratio of each component is not particularly limited, but generally 99 to 20 parts by weight of polyphenylene sulfide and 1 to 1 part by weight of polyamide.
80 parts by weight, 0.1 to 20 parts by weight of epoxy resin for a total of 100 parts by weight of polyphenylene sulfide and polyamide.
Parts by weight are appropriate. Incidentally, if the polyamide content is too small, thermal cracks are likely to occur, causing gullies, whereas if the polyamide content is too large, the heat resistance will decrease. Epoxy resin can be effective even in a relatively small amount, but if it is less than α1 part by weight, the effect will not be recognized. If the amount is too high, the mechanical performance may deteriorate, and depending on the type of epoxy resin added, it may bleed onto the surface of the molded product or the stability of the meltability of the molding sheet may be impaired.
本発明に於ける*m′#強彷は例えば、炭素繊維、ガラ
ス繊維、セラミック繊細、金属繊維、アスベスト繊維な
どのの優れた成形品を得るには、炭素#維やガラス繊維
などの無機繊維、特に好ましくは炭素繊維が使用される
。炭素繊維としてはレーヨン系、ポリアクリロニトリル
系、ピッチ糸などいかなる種類のものでも良い。又これ
ら繊維補強材はヤーン、ロービング、カットファイバー
、織物、編物、組物などいずれの形態でも使用可能であ
るが、機械的特性の面からは、繊維布状物が好ましい。In the present invention, for example, in order to obtain an excellent molded product of carbon fiber, glass fiber, ceramic fiber, metal fiber, asbestos fiber, etc., inorganic fiber such as carbon fiber or glass fiber is used. , particularly preferably carbon fibers are used. The carbon fiber may be of any type, such as rayon, polyacrylonitrile, or pitch yarn. These fiber reinforcing materials can be used in any form such as yarns, rovings, cut fibers, woven fabrics, knitted fabrics, or braided fabrics, but from the viewpoint of mechanical properties, fibrous fabrics are preferable.
又、本発明で用いられるマトリックス樹脂には必要に応
じて、マイカ、タルク、炭酸カルシウム、炭酸マグネシ
ウム、硅酸カルシウム、ドロマイト、チタン酸カリウム
、炭化ケイ素、窒化ケイ素、硫酸バリウム、硫酸カルシ
ウム、カオリン、クレー、パイロフィライト、ベントナ
イト、セリサイト、ゼオライト、ネフエリンシナイト、
アタルパルジャイト、ウオラストナイト、PMF、フェ
ライト、三酸化アンチモン、酸化亜鉛、酸化チタン、酸
化マグネシウム、酸化鉄、二硫化モリブデン、黒鉛、ガ
ラスピーズ、ガラスバルーン、石英粉などの無機充填剤
、公知のシランカップリング剤、離型剤、着色剤、耐熱
安定剤、紫外線安定剤、難燃剤、防錆剤等の各種添加剤
を、本発明の目的を逸脱しない範囲で併用することがで
きる。Further, the matrix resin used in the present invention may optionally contain mica, talc, calcium carbonate, magnesium carbonate, calcium silicate, dolomite, potassium titanate, silicon carbide, silicon nitride, barium sulfate, calcium sulfate, kaolin, Clay, pyrophyllite, bentonite, sericite, zeolite, nephelinsinite,
Inorganic fillers such as atalpulgite, wollastonite, PMF, ferrite, antimony trioxide, zinc oxide, titanium oxide, magnesium oxide, iron oxide, molybdenum disulfide, graphite, glass beads, glass balloons, quartz powder, etc. Various additives such as a silane coupling agent, a mold release agent, a coloring agent, a heat stabilizer, an ultraviolet stabilizer, a flame retardant, and a rust preventive can be used in combination without departing from the purpose of the present invention.
本発明に於いては、マトリックス樹脂と補強材とを複合
一体化せしめるが、マトリックス樹脂に対する補強材の
割合が少尉ぎると補強効果が不足して機械的性能が低下
し、逆に多すぎると成形性が悪くなる傾向にある。使用
する補強材の割合は、スタンピング成形品の形状、大き
さ、成形条件等によシ異なるが、一般には、マトリック
ス樹脂に対し、20〜200重量%、好ましくは25〜
100重量%である。In the present invention, the matrix resin and the reinforcing material are integrated into a composite, but if the ratio of the reinforcing material to the matrix resin is too small, the reinforcing effect will be insufficient and the mechanical performance will deteriorate, while if it is too large, the moldability will deteriorate. tends to get worse. The proportion of the reinforcing material used varies depending on the shape, size, molding conditions, etc. of the stamping molded product, but generally it is 20 to 200% by weight, preferably 25 to 200% by weight, based on the matrix resin.
It is 100% by weight.
本発明のスタンピング成形用シートの製法は特に限定さ
れるものではなく、各種の方法がある。例えば(11糟
維布状物、補強繊維マットおよびマトリックス樹脂シー
トとを所定の配置で積層し、マトリックス樹脂の融点ま
たは軟化点以上に加熱し、加圧下に一体化せしめる方法
、
(2)マ) IJラックス脂を予じめ加熱溶融しておき
、これに繊維補強材を含浸する方法、
(3) 該樹脂の粉末を繊維補強材にできるだけ均一
に散布した後、加熱する方法などがある。The method for producing the stamping molding sheet of the present invention is not particularly limited, and there are various methods. For example, (11) a method in which a woven fiber material, a reinforcing fiber mat, and a matrix resin sheet are laminated in a predetermined arrangement, heated to a temperature higher than the melting point or softening point of the matrix resin, and integrated under pressure; (2) There are two methods: (1) heating and melting IJ Lux resin in advance and impregnating it with the fiber reinforcing material, and (3) spreading the resin powder as uniformly as possible on the fiber reinforcing material and then heating it.
本発明のスタンピングシート製造に於ける加熱温度は一
般には270〜650℃の範囲で実施される。The heating temperature in producing the stamping sheet of the present invention is generally in the range of 270 to 650°C.
マ) IJツクス衝脂の含浸に際して、マトリックス樹
脂の各成分、及び必要に応じて併用する各種添加剤をト
ライブレンドのみで含浸に供することも可能であるが、
組成の均質性の観点から、あらかじめエクストルーダー
等で溶融混練した後に含浸することが好ましい。M) When impregnating with IJ Tux oil, it is also possible to impregnate each component of the matrix resin and various additives used in combination as necessary with only tri-blend.
From the viewpoint of homogeneity of the composition, it is preferable to melt and knead in advance using an extruder or the like and then impregnate.
〈発明の効果〉
上記の如き構成からなる本発明のスタンピング成形用シ
ートは、成形が容易で、且つ機械的性能及び耐熱性に優
れたスタンピング成形品を提供することができるため、
自動車や航空宇宙関係などの構造材料に好適であり、こ
の外にも、耐熱性の要求される装置、機械の部材として
利用できる。<Effects of the Invention> The stamping molding sheet of the present invention having the above-mentioned configuration can provide a stamping molded product that is easy to mold and has excellent mechanical performance and heat resistance.
It is suitable as a structural material for automobiles, aerospace, etc., and can also be used as a member of devices and machines that require heat resistance.
〈実施例〉 以下、実施例によシ、本発明を具体的に説明する。<Example> Hereinafter, the present invention will be specifically explained with reference to Examples.
実施例1
メルトフローレート(ASTM D−1238−74
,315,6℃、5kl?荷重)が2800(g/10
分)のポリフェニレンスルフィド90重量部、分子量約
25,000の6.6ナイロン 10重量部、フェノー
ルノボラック型エポキシ樹脂6重量部を65覇−軸押出
機を用い、290℃で溶融混練し、マトリックス側ハ旨
のペレットを得た。Example 1 Melt flow rate (ASTM D-1238-74
,315,6℃,5kl? load) is 2800 (g/10
90 parts by weight of polyphenylene sulfide, 10 parts by weight of 6.6 nylon with a molecular weight of approximately 25,000, and 6 parts by weight of phenol novolak type epoxy resin were melt-kneaded at 290°C using a 65-mm-screw extruder, and the matrix side I got some nice pellets.
該ベレットを用い、プレス成形機で厚さQ、3ymnの
シート囚を作成した。Using the pellet, a sheet with a thickness Q of 3 ymn was produced using a press molding machine.
次いで炭素繊維載物(束し■製、トレカT−300のタ
テ/ヨコ 1:1のクロス)a3)を、横断面の構成が
、CB+−(5)−(8)となる様に交互積層したもの
を、290℃に設定したプレス成形機上の平致金型間に
供給し、60に+7/α〃2.3分間加熱加圧し、その
まま冷却プレスで室搗まで冷却し、厚さ約4露の複合シ
ートを得た。該シートのマトリックス樹脂に対する戻索
禮維は約50重量パーセントであった。Next, carbon fiber mounting materials (manufactured by Bundle ■, trading card T-300 vertical/horizontal 1:1 cross) a3) were laminated alternately so that the cross-sectional configuration was CB+-(5)-(8). The molded material was then fed between parallel molds on a press molding machine set at 290°C, heated and pressed at 60°C +7/α for 2.3 minutes, and then cooled to room temperature using a cooling press to form a mold with a thickness of approx. A composite sheet of 4 layers was obtained. The sheet had approximately 50 weight percent return fiber to matrix resin.
尚、シートの外観からはクラックは認められなかった。Note that no cracks were observed from the appearance of the sheet.
次いで、上記複合シートを280℃に設定した乾燥機で
6分間予備加熱後、150℃に設定した平数金型に投入
し、約60に+7/cIn2で20秒加圧し、厚さ6■
の平板を得た。Next, the above composite sheet was preheated for 6 minutes in a dryer set at 280°C, then put into a square mold set at 150°C, and pressed at approximately 60°C +7/cIn2 for 20 seconds to obtain a thickness of 6cm.
A flat plate was obtained.
この平板にはクラックが観察されなかった。No cracks were observed in this flat plate.
上記平板よシ切り出した試片の曲げ強度は、86に9/
wn2、熱変形温度は260℃以上であった。The bending strength of the specimen cut from the above flat plate was 86 to 9/
wn2, the heat distortion temperature was 260°C or higher.
比較例1
マトリックス樹脂として実施例1のポリフェニレンスル
フィドを単独で用いた以外は、実施例1と同様にして複
合シートを得た。該シートには、微少のクラックが発生
していた。尚、マトリックス樹脂に対する炭素繊維は約
50重量パーセントであった。Comparative Example 1 A composite sheet was obtained in the same manner as in Example 1, except that the polyphenylene sulfide of Example 1 was used alone as the matrix resin. There were slight cracks in the sheet. Note that the carbon fiber content relative to the matrix resin was approximately 50% by weight.
次いで実施例1と同様にして平叡を得た。この平板にも
微少クラックが認められた。曲は強度は18 kg /
rran”と低く、且つ強度のバラツキが犬であった。Then, in the same manner as in Example 1, Taira was obtained. Slight cracks were also observed in this flat plate. The strength of the song is 18 kg/
rran” and the strength was uneven.
熱変形温度は260℃以上であった。The heat distortion temperature was 260°C or higher.
実施例2
メルトフローレートが5000(g/10分)のポリフ
ェニレンスルフィド 60重量部、分子量約20,00
0の6.6ナイロン 40重量部、クレゾール・ノボラ
ック型エポキシ樹脂 1重量部を65mm−軸押出機を
用い、280℃で溶融混練してマ) IJラックス脂の
ベレットを得、更に粉砕して微粉末とした。Example 2 60 parts by weight of polyphenylene sulfide with a melt flow rate of 5000 (g/10 minutes), molecular weight approximately 20,00
40 parts by weight of 0.6.6 nylon and 1 part by weight of cresol novolac type epoxy resin were melt-kneaded at 280°C using a 65 mm-shaft extruder to obtain pellets of IJ lux resin, which were further crushed to finely powder. It was made into powder.
次いで、ガラス繊維のランダム配向マット(旭ファイバ
ーグラス■製、目付 300#/m”)に上記微粉末を
均一に散布し、280℃に設定したプレス成形機上の平
板金型間に供給し、50に9/cIn2.2分間加熱加
圧し、そのまま冷却プレスで室温まで冷却し、厚さ約2
trmの複合シートを得た。該シートのマトリックス樹
脂に対するガラス繊維は約70重量パーセントであシ、
シート外観にクラックは認められなかった。Next, the above-mentioned fine powder was uniformly sprinkled on a randomly oriented glass fiber mat (manufactured by Asahi Fiberglass ■, basis weight: 300#/m"), and fed between flat molds on a press molding machine set at 280 ° C. Heat and press for 2.2 minutes at 9/cIn.
A composite sheet of trm was obtained. The glass fiber to matrix resin of the sheet is about 70 weight percent;
No cracks were observed on the sheet appearance.
上記会合シートを275℃に設定した乾燥機で4分間予
備加熱後、140℃に設定した平板金型に複合シートを
2枚重ねて投入し、約50kl?/m2で15秒加圧し
、厚さ3簡の平板を得た。該平板にはクラックが観察さ
れなかった。After preheating the above composite sheet in a dryer set at 275°C for 4 minutes, two composite sheets were stacked and put into a flat mold set at 140°C, approximately 50kl? /m2 for 15 seconds to obtain a flat plate with a thickness of 3 strips. No cracks were observed on the flat plate.
上記平板より切り出した試片の曲げ強度は56 kg
/ran2、熱変形温度は260℃以上であった。The bending strength of the specimen cut from the above flat plate was 56 kg.
/ran2, the heat distortion temperature was 260°C or higher.
比較例2
マトリックス樹脂として実施例2のポリフェニレンスル
フィドを単独で用いた以外は、実施例2と同様にして複
合シートを得た。該シートのマトリックス樹脂に対する
ガラス繊維は約65重量パーセントであった。Comparative Example 2 A composite sheet was obtained in the same manner as in Example 2, except that the polyphenylene sulfide of Example 2 was used alone as the matrix resin. The sheet had about 65 weight percent glass fiber to matrix resin.
又、シートにはクラックが多数発生し、スタンピング成
形に供し難いものであった。Moreover, many cracks occurred in the sheet, making it difficult to use it for stamping molding.
Claims (1)
脂からなるマトリックス樹脂(A)と繊維補強材(B)
とを複合一体化してなることを特徴とするスタンピング
成形用シート。Matrix resin (A) consisting of polyphenylene sulfide, polyamide and epoxy resin and fiber reinforcement material (B)
A sheet for stamping molding characterized by being formed by integrating the above.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61293543A JPS63146939A (en) | 1986-12-11 | 1986-12-11 | Stamping molding sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61293543A JPS63146939A (en) | 1986-12-11 | 1986-12-11 | Stamping molding sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63146939A true JPS63146939A (en) | 1988-06-18 |
Family
ID=17796107
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61293543A Pending JPS63146939A (en) | 1986-12-11 | 1986-12-11 | Stamping molding sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63146939A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0362852A (en) * | 1989-07-31 | 1991-03-18 | Nippon G Ii Plast Kk | Polyphenylene sulfide-based resin composition |
EP0424939A2 (en) * | 1989-10-26 | 1991-05-02 | Idemitsu Petrochemical Company Limited | Polyarylene sulfide resin compositions |
JP2015193812A (en) * | 2014-03-27 | 2015-11-05 | 東レ株式会社 | Molding material, manufacturing method of molded article using the same, and molded article |
US9393919B2 (en) | 2012-10-15 | 2016-07-19 | Yazaki Corporation | Relay, relay module having the same, and electrical junction box |
-
1986
- 1986-12-11 JP JP61293543A patent/JPS63146939A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0362852A (en) * | 1989-07-31 | 1991-03-18 | Nippon G Ii Plast Kk | Polyphenylene sulfide-based resin composition |
EP0424939A2 (en) * | 1989-10-26 | 1991-05-02 | Idemitsu Petrochemical Company Limited | Polyarylene sulfide resin compositions |
US6037422A (en) * | 1989-10-26 | 2000-03-14 | Idemitsu Petrochemical Company Limited | Polyarylene sulfide resin compositions |
US6117950A (en) * | 1989-10-26 | 2000-09-12 | Idemitsu Petrochemical Company Limited | Polyarylene sulfide resin compositions |
US9393919B2 (en) | 2012-10-15 | 2016-07-19 | Yazaki Corporation | Relay, relay module having the same, and electrical junction box |
JP2015193812A (en) * | 2014-03-27 | 2015-11-05 | 東レ株式会社 | Molding material, manufacturing method of molded article using the same, and molded article |
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