JPS63144862A - Soldering device - Google Patents

Abstract

PURPOSE:To prevent generation of defective soldering by providing an IR detector for a specific wavelength region to measure the temp. of a solder-joined part and controlling the heating of soldering in accordance with the temp. change thereof. CONSTITUTION:A reflecting mirror 8 which reflects only the characteristic wavelength region of IR rays is provided to an optical system 1. A condenser lens 9 and the IR detector 10 are disposed thereto. The light emitted from a thermal light source 2 is passed through the reflecting mirror 3, a parallel correcting lens 4 and the reflecting mirror 8 and is thereby condensed to execute soldering of electronic parts. The IR rays of the intensity proportional to the temp. radiated from the solder-joined part are reflected only in the specific wavelength region by the reflecting mirror 8 and are detected by the IR detector 10. A thermometer control part 13 shields the light by a light shielding device 6 via a controller 12 to lower the output of the light source 2 according to the result of the detection. Since the heating control of the soldering is exactly executed, the generation of the defective soldering is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to soldering in electronic component board mounting, and particularly to a soldering device for surface mounting using thermal light as a heating source.

[Conventional technology]

3 shows a conventional soldering device, FIG. 3 shows an optical system, and FIG. 5 shows a signal control system.

The light emitted from the heat ray (C) is reflected and focused by an elliptical reflecting mirror (,?), and then converted into parallel light by a parallel correction lens (R), which is then passed through the optical system holder (//) Y←) direction K
At the same time, the light is condensed and focused by a condensing lens (S), and the condensed light serves as a heating source at the focal point to solder electronic components to a printed circuit board (not shown). When soldering,
The heating time for irradiating light is set by the timer (aZ)&C, and the signal from the timer (-7) is sent to the control device (-
〇) takes the receiver, operates the light shielding device (7), and heats the light 6.
The light from 11 (g) is blocked by the light shielding plate (6) to stop the irradiation of the 8 elements to the solder joint. At the same time, the output of the heat ray (,2) is lowered by the light source output variable device (Ha0),
Waiting letter! IK to complete soldering.

[Problem that the invention seeks to solve]

Conventional soldering equipment such as the one described above cannot recognize that the temperature rise at the joint is not constant due to changes in the heat input state, heating source output, etc. There is a problem in that soldering defects are likely to occur. Furthermore, when the heat capacity differs depending on the type and shape of electronic components to be soldered, there is also a problem in that it is necessary to set soldering conditions for each component during teaching.

This invention was made to solve the above-mentioned problems, and it is possible to flexibly respond to changes in heat capacity, heat input status, heating source output, etc., and is highly reliable. An object of the present invention is to obtain a soldering device capable of performing soldering.

[Failure to solve the problem]

The soldering device according to the present invention has a temperature measurement function that directly measures the temperature of the solder joint in a non-contact manner, including an optical system for irradiating light for heating the solder joint, an optical system for temperature detection, and an infrared detector. and a control device that performs soldering heating control based on temperature changes measured by calculation.

[Effect]

In this invention, the temperature of the solder joint is measured by the temperature measurement function, and the soldering heating is controlled by calculations of the control device.

〔Example〕

FIGS. 1 to 3 show an embodiment of the present invention. In FIG. Cg> is a heat ray (
2) It transmits light from 2) and reflects only a specific wavelength range in the infrared region. The condensing lens (TE) condenses the infrared rays reflected by the reflecting mirror (TE).

The infrared detector (10) detects infrared rays in a specific wavelength range, and the detected infrared rays are sent to the thermometer control unit (10).
3) is converted into temperature information.

In addition, the same reference numerals as in FIG.

In FIG. 1, a soldering unit (/S) including an optical system holder (//) is attached to a pedestal (/A) K.

Printed circuit board (/ri) for soldering electronic components (/9)
is placed on the XY table Ctt) and positioned.

, A control device (/λ) is provided which receives and calculates temperature information from the needle control section (13) and performs soldering heating control.

Next, the operation will be explained. The light emitted from the heat ray (2) is reflected and focused by the reflecting mirror (, 7), and then first converted into parallel light by the parallel correction lens (2), and then passed through the optical system holder Cti.
) in the Y (+) direction, pass through the anti-J11 za,
The light is condensed and focused by a condensing lens Cs), and at this focus, the condensed light serves as a heating source to solder the printed circuit board (/) and the electronic component (19). During this soldering, infrared rays are emitted from the solder joint with an intensity proportional to the temperature. The emitted infrared rays are converted into parallel light by the condensing lens (3) K, and the optical system holder (//) is turned into parallel light by Y (-1
The light travels in the X direction, and only a certain wavelength range is reflected by the reflecting mirror (r) and travels in the X direction, where it is focused by the condenser lens (9) and detected by the infrared detector Cto'). The detected infrared rays are converted into temperature information kf by the thermometer control section (/3), and then inputted to the control device (12) by VC, and calculated as the measured temperature of the solder joint. When this measured temperature matches the preset temperature, the control device (12) controls the light shielding device 11.
(W) is operated to emit light from heat rays (2).
6) Block light with K to stop irradiation to the solder joint,
Kofuchi output variable device #, (c0) lowers the output of the thermal light fs (c), puts it in standby mode, and completes the soldering.

In the above embodiment, a heat beam is used as the heating source, but a laser may also be used as the heating source. [Effects of the Invention] As described above, according to the present invention, We have installed a temperature measurement function that directly measures the temperature of the joint without contact, and we have made it possible to control the soldering heat using calculations from the control device.
Recognizes the temperature of the solder joint 2, can respond flexibly, and achieves the effect of highly reliable soldering.

[Brief explanation of the drawing]

Figures 1 to 3 show Kazuo's embodiment of the present invention, with Figure 1 being a schematic plan cross-sectional view of the optical system, Figure 1 being a perspective view of the main parts of the solder joint, and Figure 3 being the control signal. It is a block diagram showing a flow. FIG. 9 is a schematic pressure 'sfT' plane view of the optical system of a conventional soldering apparatus, and FIG. 5 is a block diagram showing the flow of control signals in the conventional soldering apparatus. (λ)...heat ray, (3)...reflector, (su...parallel correction lens, (ri)...(objective) condensing lens, (ri)...shading device, (su)...(red (Outside light) Reflector, (9)...Condensing lens, Cto)...Infrared detector, (/C)...Control device, (13)...Thermometer control unit. Note that the same reference numerals are used in each figure. indicates the same or equivalent part.

Claims (1)

[Claims] A reflecting mirror that reflects and focuses the light emitted from the heat beam, a parallelism correcting lens that converts the light focused by the reflecting mirror into parallel light, and a solder joint that focuses the parallel light into a predetermined light diameter. a light shielding device that opens and closes light irradiation, and an optical path that is provided between the parallel correction lens and the objective condenser lens to transmit the light from the thermal rays and irradiate only a specific wavelength range of infrared rays. an infrared light reflecting mirror that reflects the infrared light in a direction perpendicular to the infrared light reflecting mirror, a condensing lens that condenses the infrared light reflected by the infrared light reflecting mirror, and the solder joint at the condensing point of the condensing lens. An infrared detector that detects only a specific wavelength range of infrared radiation emitted from the infrared rays, a thermometer control unit that measures temperature using the signal from this infrared detector, and a signal from this thermometer control unit that is added and measured by calculation. A soldering device comprising a control device that controls heating of soldering based on temperature changes.