JPS63144511A - Electronic component molder - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

[Industrial Application Field 1] The present invention relates to a molding device for electronic parts manufactured by attaching wires to powder that hardens under pressure.

[Conventional technology] As an electronic component, for example, a tantalum codenser is formed by connecting a wire to an element part, but this element part uses dielectric powder that hardens when pressurized, and this dielectric powder Conventionally, it has been known to fill a die with powder, and pressurize the powder with a punch with a wire inserted into the powder in the die to form the powder. In the conventional forming method described above, the die is filled with dielectric powder, the wire is inserted into a punch so that it protrudes to the required length, and the powder is pressurized by the punch, thereby inserting the wire into the die. It is inserted into the dielectric powder and the powder is press-molded. [Problem to be solved by the invention] By the way, since the wire is made of a soft thin wire material, if the length of the wire embedded in the dielectric powder is short, it should be made to protrude from the punch in advance as in the prior art described above. However, if the length of the wire needs to be increased, for example when the size of the element part is large, it is necessary to insert the wire into the dielectric powder without any particular problem. There is a disadvantage that the wire may bend due to the resistance of the dielectric powder, making it difficult to insert it properly. The present invention has been made in view of the above points, and its purpose is to enable the wire to be smoothly inserted into the powder without bending, regardless of the length of the wire to be inserted. An object of the present invention is to provide a molding device for electronic parts. Measures to solve problem E]

In order to achieve the above-mentioned objects, the present invention provides a die filled with powder that hardens under pressure, a punch for pressurizing the powder, and a wire guided through the punch to the powder. The wire feeding means is composed of a wire feeding means that feeds the wire so as to be inserted, and an insertion actuation means that causes the tip of the wire to be inserted into the powder when the punch comes into contact with or comes close to the powder in the die. This is its characteristic. [Function] Fill a die with a predetermined amount of powder, and move the punch toward the die. When the punch contacts the die or approaches the die to the point where it faces the die with a slight gap, the wire feeding means is actuated by the insertion actuating means to cause the wire to protrude from the tip end surface of the punch. . As a result, the wire is regulated by the punch and can be smoothly inserted into the powder without bending in the middle. After that, when the powder is pressurized with a punch, the powder in the die is pressurized and hardened, thereby forming the powder. [Embodiment 1] Hereinafter, embodiments of the present invention will be described in detail based on the drawings. First, FIG. 1 shows the overall structure of the molding apparatus. In the figure, reference numerals 1 and 1 indicate guide rods erected on the bases 2, 2, 2, 1, 2, 2, 2, 2, 2, 2, 2, 2, 2, 2, 2, 2, 2, 1, 2, 2, 1, 2, 1, 2, 1, 2, 2, and 1 are erected guide rods are installed. A table 4 supporting the lower punch unit 3 is attached to the guide rod 1, and an upper punch plate 5 is attached to the guide rod 1. is mounted so that it can be raised and lowered by means of a raising and lowering drive means such as a cam mechanism. An upper punch unit 7 and a feeding means 9 for the wire 8 are attached to the upper bunch plate 5. As shown in FIG. 2, the lower punch unit 3 has a die 10 having a filling part 10a filled with dielectric powder P, and the die 10 is fixed to the table 4 with screws 11. And below the die 10 is a lower punch 12.
is provided so as to be movable up and down along the lower punch guide 13, and when the lower punch 12 is raised, its tip can face into the filling part 10a of the die 10. In order to move the lower punch 12 up and down, a push-up rod 14 is provided at the bottom of the lower punch 12 and is driven up and down by a lifting drive means (not shown) such as a cam mechanism. Return springs 15 and 16 act on the lower punch 12 and the push-up rod 14, respectively. Next, the upper punch unit 7, as shown in FIG.
It is constructed by attaching a punch holder 22 with an upper punch 21 attached to its tip to a support block 20 vertically installed on the upper punch plate 5. A guide 23 is attached to the support block 20 in its axial direction. A pipe 24 through which the wire 8 is inserted is attached to the guide 23. A lower blade 25 is attached to the lower blade 21, and an upper blade 26 for cutting the wire 8 by sliding horizontally on the lower blade 25 is attached to an upper blade holder 27. An operating rod 28 is provided to operate the upper blade holder 27. The actuating rod 28 is held in a state where the wire 8 is not cut by a spring 28, and when the actuating member 30 (see FIG. 1) is actuated to push the actuating rod 28, the upper blade 26 moves in the horizontal direction. This allows the wire 8 to be cut. In order to protect the wire 8 from damage when cutting the wire, the wire insertion portion 27a of the upper blade holder 27 is funnel-shaped. Further, the wire feeding means θ is a chuck member 34.3 attached to first and second chuck bases 32.33 which are attached to a rod 31 erected on the upper punch plate 5 so as to be movable up and down.
It is equipped with 5. Among these chuck members 34 and 35, the first chuck member 34 is for pulling down the wire 8, and the second chuck member 35 is for pulling down the wire 8 by a predetermined amount when the upper punch plate 5 is raised. It is designed to raise only. Each of these chuck members 34 and 35 has a structure as shown in FIG. That is, each chuck member 34, 35 is a solenoid 3B, 3?, respectively. A movable chuck piece 40, 41 is connected to the tip of the solenoid pin 38, 39 in each solenoid 38, 37. Each movable chuck piece 40,41 is normally connected to a fixed chuck piece 42.
, 43 and the diameter of the wire 8, and when the solenoids 313, 37 are actuated, the movable chuck pieces 40, 41 move away from the fixed chuck piece 4.
2 and 43, and the wire 8 can be held between them. Springs 44 and 45 are compressed between the chuck base 32 and the upper punch plate 5 and between the chuck bases 32 and 33, respectively, so that the chuck bases 32 and 33 It moves up and down following the plate 5, and also moves down in a direction approaching the upper punch plate 5 against the chuck base 32, and the movement of the chuck base 32 causes the wire 8 to move inside the die 10. It can be inserted into the dielectric powder P. Also, chuck base 3
3, when the upper punch plate 5 is raised, it is lowered by a predetermined amount against the spring 45, so that when the upper bunch 21 is in the raised position, the tip of the wire 8 is slightly protruded from the upper punch 21. It has a structure that allows it to be pulled out. In order to lower the chuck base 32 against the spring 44 in this manner, an insertion actuating means 46 is provided. The insertion actuating means 48 has a lever 48 that swings about a fulcrum 47, one end of which is connected to the chuck base 32, and the other end of which can move toward and away from the reciprocating shaft 43. It looks like this. An adjustment port 50 is connected to the reciprocating shaft 49, and by screwing in and out the adjustment port 50, the movement stroke of the chuck base 32 can be adjusted. In addition, in order to lower the chuck base 33 against the spring 45, a top plate portion 5 is attached to the upper end of the guide rod 1.
1 has stopper poles 52 and 52 screwed into it. The stopper port 52 passes through an end plate 53 attached to the upper end of the rod 31 so that its tip can come into contact with the chuck base 33, and when the upper punch plate 5 rises in this state, the end plate 53 is attached to the upper end of the rod 31. The chuck base 33 is configured to move relatively in a direction approaching the upper punch plate 5. The amount of movement of the chuck base 33 can also be controlled by screwing in and out the stopper port 52 as appropriate. This embodiment has the above-mentioned configuration, and its operation will be explained next with reference to FIG. First, hold the upper punch plate 5 in the raised position,
The wire 8 is held in a state in which it slightly protrudes from the upper bunch 21, and the filling part in the die 1O mounted on the table 4! A predetermined amount of dielectric powder P is supplied into Oa. Therefore, the wire 8 is chucked by the first chuck member 34, the second chuck member 35 is left in an open state, and the lifting drive means 6 is operated to move the upper punch plate 5 as shown in FIG. As shown in a), the upper punch 21 of the upper punch unit 7 attached to the upper bunch plate 5 is lowered until it faces the dielectric powder P in the die 10 with a slight gap. At this time, the chuck member 34 descends following the descent of the upper punch plate 5, so that the tip of the wire 8 is attached to the dielectric powder P.
Maintain a small gap with the surface or descend to a position where it touches it. In the above-mentioned state, when the reciprocating shaft 49 in the insertion actuating means 46 is raised, the lever 48 swings about the fulcrum 47, and the chuck base 32 attached to the other end of the lever 48 resists the spring 44. It descends along the rod 31. As a result, the chuck member 34 attached to the chuck base 32 is lowered and the wire 8 chucked to the chunk member 34 is pulled down, and the fifth
As shown in Figure (b), the tip of the wire 8 is embedded in the dielectric powder P. Here, there is resistance when inserting the wire 8 into the dielectric powder P, but
Most of the wire 8 is guided by the upper bunch 21, so that the disadvantage of bending due to resistance when the wire 8 is inserted is reliably prevented. When the insertion of the wire 8 is completed in this way, the lifting drive means 6 is operated to lower the upper punch plate 5 slightly, and as shown in FIG. Make sure to cover it. Therefore, as shown in FIG. 5(d), the lower punch 12 is raised by the push-up rod 14, and together with this,
As shown in ff15r (e), by further lowering the upper punch 21, the dielectric powder P in the die 10 is pressurized and molded. When the lower punch 12 is raised, the wire 8 tends to be pushed upward, but since the chuck members 34 and 35 are both released, it is possible to prevent excessive force from being applied to the wire 8. I can do it. After the molding of the dielectric powder P is completed, as shown in FIG. 5(f), the wire 8 is cut by activating the actuating rod 28 and moving the upper blade 26 in the horizontal direction. After the above-mentioned work is completed, as shown in FIG. 5(g), when the upper punch unit 7 is raised and the lower punch 12 is further raised, the molded workpiece W with the wire inserted is removed. It will be possible to take it out. After the dielectric powder is molded in this way, preparations for the first molding operation are performed. That is, when the above-described cutting is performed, the wire 8 is chucked by the second chuck member 35. Further, the first chuck member 34 has already been opened, and the upper punch plate 5 is raised in this state. As a result, the tip of the wire 8 is held at the previous cutting position. However, when the upper punch plate 5 approaches the stroke end, the second chuck member 35 comes into contact with the stopper port 52, and the chuck member 35 no longer moves northward, and the wire chucked by it stops moving upward. 8 also stops at that position. On the other hand, the upper punch plate 5 further rises to its stroke end, so that the tip of the wire 8 slightly protrudes from the upper punch 21 of the upper punch unit 7 attached to the upper punch plate 5. It will return to its original state, which was extended until then. As described above, the wire 8 is sequentially inserted into the dielectric powder P and the dielectric powder P is press-molded. Therefore, the length of insertion of the wire 8 into the dielectric powder P is:
This can be done by appropriately screwing in and out an adjustment port 50 connected to the reciprocating shaft 48 that rotates the lever 48. Also, depending on the size of the workpiece W, it is necessary to change the insertion length of the wire 8. By changing the amount of protrusion of the adjustment port 50 when replacing the upper and lower punches, it becomes possible to change the insertion length of the wire to be optimal according to the size of the workpiece. This makes it possible to have versatility as a molding device for electronic parts such as. In the above-mentioned embodiment, the wire 8 was inserted with the upper punch 21 close to the dielectric powder P. However, in this case, when the wire 8 is inserted, the wire 8 is inserted. Although resistance can be reduced and smooth insertion is possible, the wire 8 may be inserted with the upper punch 21 in contact with the dielectric powder P; This is to allow the wire 8 to be forcibly pulled down when the wire 8 is caught in the middle, and its protruding length is The wire 8 may be in a non-protruding state.Furthermore, although the wire 8 is shown as being inserted in one piece,
A configuration in which a plurality of wires are attached can also be used. - [Effects of the Invention 1] As detailed above, in the present invention, the wire feeding means is configured so that the tip of the wire is inserted into the powder when the punch comes close to the powder in the die. It becomes possible to reliably prevent the inconvenience of the wire being bent due to the resistance when it is inserted into the powder.

[Brief explanation of the drawing]

Fig. 1 is an overall configuration diagram of an electronic component molding apparatus showing one embodiment of the present invention, Fig. 2 is a sectional view of a lower punch unit, and Fig. 3 is a sectional view of a lower punch unit.
The figure is a cross-sectional view of the upper punch unit. Figure 4 is an explanatory diagram of the configuration of the chuck member, Figures 5 (a) and (
b), (C), (d), Ce'). (f), Cg) are explanatory diagrams showing a process of molding an electronic component. 3: lower punch unit, 4: table, 7: upper punch unit, 8: wire, 8: wire feeding means, 10: die, 12: lower punch, 13: lower punch guide, 21:
Upper punch, 22: Punch holder, 25: Lower blade, 26: Upper blade, 32, 33: Chuck base, 34, 35
: Chuck member, 46: Insertion operating means, 48: Adjustment port. Number 1! ! 1 Figure 2 Figure 3 Figure 5 (0) (b) (e) (f) (C) (d)

Claims (2)

[Claims] (1) A die filled with powder that hardens under pressure;
a punch for pressurizing the powder; a wire feeding means for sending a wire guided through the punch so as to be inserted into the powder; 1. A molding apparatus for electronic parts, characterized in that the device comprises an insertion actuation means for inserting a tip of a wire into the powder when the powder is in a state of (2) Claim No. 1 (1) characterized in that the wire feeding stroke is adjustable by the wire feeding means.
) The electronic component molding device described in item 2.