JPS63143869U - - Google Patents
Info
- Publication number
- JPS63143869U JPS63143869U JP3604687U JP3604687U JPS63143869U JP S63143869 U JPS63143869 U JP S63143869U JP 3604687 U JP3604687 U JP 3604687U JP 3604687 U JP3604687 U JP 3604687U JP S63143869 U JPS63143869 U JP S63143869U
- Authority
- JP
- Japan
- Prior art keywords
- flat package
- lead
- forming
- wound
- stand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3604687U JPS63143869U (sv) | 1987-03-12 | 1987-03-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3604687U JPS63143869U (sv) | 1987-03-12 | 1987-03-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63143869U true JPS63143869U (sv) | 1988-09-21 |
Family
ID=30846093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3604687U Pending JPS63143869U (sv) | 1987-03-12 | 1987-03-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63143869U (sv) |
-
1987
- 1987-03-12 JP JP3604687U patent/JPS63143869U/ja active Pending