JPS63142849U - - Google Patents

Info

Publication number
JPS63142849U
JPS63142849U JP1987036049U JP3604987U JPS63142849U JP S63142849 U JPS63142849 U JP S63142849U JP 1987036049 U JP1987036049 U JP 1987036049U JP 3604987 U JP3604987 U JP 3604987U JP S63142849 U JPS63142849 U JP S63142849U
Authority
JP
Japan
Prior art keywords
heat sink
heat
lead terminals
semiconductor chip
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987036049U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987036049U priority Critical patent/JPS63142849U/ja
Publication of JPS63142849U publication Critical patent/JPS63142849U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1987036049U 1987-03-12 1987-03-12 Pending JPS63142849U (US20100012521A1-20100121-C00001.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987036049U JPS63142849U (US20100012521A1-20100121-C00001.png) 1987-03-12 1987-03-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987036049U JPS63142849U (US20100012521A1-20100121-C00001.png) 1987-03-12 1987-03-12

Publications (1)

Publication Number Publication Date
JPS63142849U true JPS63142849U (US20100012521A1-20100121-C00001.png) 1988-09-20

Family

ID=30846099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987036049U Pending JPS63142849U (US20100012521A1-20100121-C00001.png) 1987-03-12 1987-03-12

Country Status (1)

Country Link
JP (1) JPS63142849U (US20100012521A1-20100121-C00001.png)

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