JPS63142006A - Photocurable resin composition - Google Patents
Photocurable resin compositionInfo
- Publication number
- JPS63142006A JPS63142006A JP29013386A JP29013386A JPS63142006A JP S63142006 A JPS63142006 A JP S63142006A JP 29013386 A JP29013386 A JP 29013386A JP 29013386 A JP29013386 A JP 29013386A JP S63142006 A JPS63142006 A JP S63142006A
- Authority
- JP
- Japan
- Prior art keywords
- meth
- ester
- photocurable resin
- resin composition
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 20
- 150000002148 esters Chemical class 0.000 claims abstract description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 10
- 150000002009 diols Chemical class 0.000 claims abstract description 9
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229940091173 hydantoin Drugs 0.000 claims abstract description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000003999 initiator Substances 0.000 claims abstract description 8
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 abstract description 26
- 239000011248 coating agent Substances 0.000 abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 15
- 239000011521 glass Substances 0.000 abstract description 11
- 239000000203 mixture Substances 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 8
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 abstract description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 abstract description 4
- 125000000217 alkyl group Chemical group 0.000 abstract description 3
- 244000028419 Styrax benzoin Species 0.000 abstract description 2
- 235000000126 Styrax benzoin Nutrition 0.000 abstract description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 abstract description 2
- 229960002130 benzoin Drugs 0.000 abstract description 2
- FPODCVUTIPDRTE-UHFFFAOYSA-N bis(prop-2-enyl) hexanedioate Chemical compound C=CCOC(=O)CCCCC(=O)OCC=C FPODCVUTIPDRTE-UHFFFAOYSA-N 0.000 abstract description 2
- 235000019382 gum benzoic Nutrition 0.000 abstract description 2
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 16
- -1 methacryloyl group Chemical group 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 4
- ATIAIEWDRRJGSL-UHFFFAOYSA-N 1,3-bis(2-hydroxyethyl)-5,5-dimethylimidazolidine-2,4-dione Chemical compound CC1(C)N(CCO)C(=O)N(CCO)C1=O ATIAIEWDRRJGSL-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- LEZIGLRXICVDNS-UHFFFAOYSA-N 1,3-dihydroxyimidazolidine-2,4-dione Chemical compound ON1CC(=O)N(O)C1=O LEZIGLRXICVDNS-UHFFFAOYSA-N 0.000 description 2
- RBGUKBSLNOTVCD-UHFFFAOYSA-N 1-methylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C RBGUKBSLNOTVCD-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- VZMLJEYQUZKERO-UHFFFAOYSA-N 2-hydroxy-1-(2-methylphenyl)-2-phenylethanone Chemical compound CC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 VZMLJEYQUZKERO-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 description 1
- DYBIGIADVHIODH-UHFFFAOYSA-N 2-nonylphenol;oxirane Chemical compound C1CO1.CCCCCCCCCC1=CC=CC=C1O DYBIGIADVHIODH-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- NQSMEZJWJJVYOI-UHFFFAOYSA-N Methyl 2-benzoylbenzoate Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 NQSMEZJWJJVYOI-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は印刷回路基板や電子部品用コート材などとし
て有用な光硬化性樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to a photocurable resin composition useful as a coating material for printed circuit boards, electronic parts, and the like.
光硬化性樹脂組成物は、省資源、省エネルギー。 Photocurable resin compositions save resources and energy.
無公害などの観点から、有機溶剤を用いた従来の熱硬化
型材料に代わる硬化性材料として、近年特に注目を浴び
ている。In recent years, it has attracted particular attention as a curable material that can replace conventional thermosetting materials using organic solvents from the viewpoint of being non-polluting.
このような光硬化性樹脂組成物としては、エポキシ(メ
タ)アクリレートオリゴマー、ポリエステル(メタ)ア
クリレートオリゴマー、ウレタン(メタ)アクリレート
オリゴマーなどを主成分として用いたものが各種知られ
ており、特にエポキシ(メタ)アクリレートオリゴマー
を用いたものはm械的強度の良好な硬化塗膜を付与する
ことから、印刷回路基板や電子部品用コート材などの各
種用途への応用が期待されている。Various types of photocurable resin compositions are known that use epoxy (meth)acrylate oligomers, polyester (meth)acrylate oligomers, urethane (meth)acrylate oligomers, etc. as main components. Since those using meth)acrylate oligomers provide cured coatings with good mechanical strength, they are expected to be applied to various uses such as printed circuit boards and coating materials for electronic parts.
しかるに、上記の如き従来公知の光硬化性樹脂組成物は
、ガラスなどの無機物や金属に対する密着性に劣り、ま
た硬化性が悪く、さらに硬化塗膜の耐水性や耐熱性が充
分とはいえなかった。このため、光硬化性であることの
諸種の利点を有していながらも、各種用途への応用展開
が飛躍的に進行するには至っていないのが現状である。However, the conventionally known photocurable resin compositions as described above have poor adhesion to inorganic substances such as glass and metals, have poor curability, and furthermore, the water resistance and heat resistance of the cured coating film are not sufficient. Ta. For this reason, although it has various advantages of being photocurable, the current situation is that its application to various uses has not progressed dramatically.
したがって、この発明は、上記従来の問題点を解決して
、ガラスなどの無機物や金属の表面に密着性とさらに耐
水性や耐熱性にすくれた硬化塗膜を硬化性良好に形成で
きる、印刷回路基板や電子部品用コート材などとして特
に有用な光硬化性樹脂組酸物を提供することを目的とし
ている。Therefore, the present invention solves the above-mentioned conventional problems and provides a printing method that can form a cured coating film with good adhesion and water resistance and heat resistance on the surface of inorganic materials such as glass and metals. The object of the present invention is to provide a photocurable resin composition particularly useful as a coating material for circuit boards and electronic components.
この発明者らは、上記目的を達成するために鋭意検討し
た結果、光硬化性樹脂組成物の主成分として、ヒダント
イン型ジオールと(メタ)アクリル酸とのエステルとこ
れ以外の各種重合性化合物とを組み合わせ使用したとき
には、これをガラスなどの無機物や金属表面に塗布して
紫外線などの光を照射することにより、上記被塗物の表
面に対する密着性に著しくすぐれかつ耐水性や耐熱性の
良好な硬化塗膜を硬化性良好に形成できるものであるこ
とを知り、この発明をなすに至った。As a result of intensive studies to achieve the above object, the inventors found that esters of hydantoin diol and (meth)acrylic acid and various other polymerizable compounds were used as the main components of the photocurable resin composition. When used in combination, by applying this to an inorganic material such as glass or a metal surface and irradiating it with light such as ultraviolet rays, it is possible to create a product that has excellent adhesion to the surface of the object to be coated and has good water resistance and heat resistance. It was discovered that a cured coating film with good curability could be formed, and this invention was made.
すなわち、この発明は、a)ヒダントイン型ジオールと
(メタ)アクリル酸とのエステル、b)1分子中に重合
性炭素−炭素二重結合を1個以上含む上記a成分以外の
重合性化合物、C)光重合開始剤を含むことを特徴とす
る光硬化性樹脂組成物に係るものである。That is, this invention provides a) an ester of a hydantoin diol and (meth)acrylic acid, b) a polymerizable compound other than the above component a containing one or more polymerizable carbon-carbon double bonds in one molecule, C ) The present invention relates to a photocurable resin composition characterized by containing a photopolymerization initiator.
なお、この明細書において、(メタ)アクリロイル基と
はアクリロイル基および/またはメタクリロイル基を、
(メタ)アクリレートとはアクリレートおよび/または
メタクリレートを、(メタ)アクリル酸とはアクリル酸
および/またはメタクリル酸を、それぞれ意味し、また
粘度はブルックフィールド粘度計により測定される値を
意味する。In addition, in this specification, the (meth)acryloyl group refers to an acryloyl group and/or a methacryloyl group,
(Meth)acrylate means acrylate and/or methacrylate, (meth)acrylic acid means acrylic acid and/or methacrylic acid, and viscosity means a value measured by a Brookfield viscometer.
この発明において使用するa成分としてのエステルは、
ヒダントイン型ジオールと(メタ)アクリル酸とを、通
常触媒として塩酸、硫酸、p−トルエンスルホン酸など
の酸性化合物を0.1〜10重量%、好適には0.5〜
5重景重量度用いて、これと要すればハイドロキノンの
如き重合禁止剤の存在下、80〜120℃で5〜20時
間エステル化反応させることによって得られる、分子内
に2個の(メタ)アクリロイル基を含有する化合物であ
る。The ester as component a used in this invention is
A hydantoin type diol and (meth)acrylic acid are usually used as a catalyst in an amount of 0.1 to 10% by weight, preferably 0.5 to 10% by weight of an acidic compound such as hydrochloric acid, sulfuric acid, or p-toluenesulfonic acid.
A compound containing two (meth) molecules in the molecule, obtained by esterification reaction at 80 to 120°C for 5 to 20 hours in the presence of a polymerization inhibitor such as hydroquinone, using It is a compound containing an acryloyl group.
上記のヒダントイン型ジオールとは、ヒダントインまた
はその置換体から誘専されるジオールであって、その代
表的なものとしては、5・5位がアルキル基で置換され
たヒダントインにエチレンオキシドまたはプロピレンオ
キシドを付加反応させてなる下記の式にて表わされるジ
(ヒドロキシアルキル)ヒダントインがある。The above-mentioned hydantoin-type diol is a diol derived from hydantoin or its substituted product, and a typical example is a hydantoin substituted with an alkyl group at the 5-5 position, to which ethylene oxide or propylene oxide is added. There is a di(hydroxyalkyl)hydantoin represented by the following formula which is obtained by reaction.
R。R.
■
0=CN(CHz −CHO)−、H
(式中、R,、R2はそれぞれ水素またはメチル基、R
3,R4はそれぞれ炭素数1〜5のアルキル基であるか
、両基が一緒になってヒダントインの5位の炭素とによ
りシクロへキサン環を構成するペンタメチレン基であり
、m、nはそれぞれ1〜4の整数である)この発明にお
いて使用するb成分としての重合性化合物は、前記のa
成分が主としてガラスや金属に対する硬化塗膜の密着性
および耐水性、耐熱性を向上させ、また硬化性の向上に
寄与するものであるのに対して、硬化塗膜の伸び1機械
的強度。■ 0=CN(CHz -CHO)-, H (wherein R,, R2 are hydrogen or methyl group, R
3 and R4 are each an alkyl group having 1 to 5 carbon atoms, or a pentamethylene group that together forms a cyclohexane ring with the 5th carbon of the hydantoin, and m and n are each (an integer of 1 to 4) The polymerizable compound used as component b used in this invention is the above-mentioned a
The components mainly improve the adhesion, water resistance, and heat resistance of the cured coating film to glass and metal, and also contribute to the improvement of curability, whereas the elongation of the cured coating film 1 mechanical strength.
柔軟性などの物性の調整を図るために用いられ、また前
記a成分の反応性希釈剤としての役割をも果たして組成
物の粘度を調整するために用いられるものである。It is used to adjust physical properties such as flexibility, and also serves as a reactive diluent for component a to adjust the viscosity of the composition.
このb成分としては、1分子中に重合性炭素−炭素二重
結合を1個以上含む重合性化合物が広く包含されるが、
その分子量は一般に90〜5,000程度である。この
b成分の代表的なものとしては、上記二重結合として(
メタ)アクリロイル基を有する(メタ)アクリレート化
合物がある。Component b broadly includes polymerizable compounds containing one or more polymerizable carbon-carbon double bonds in one molecule,
Its molecular weight is generally about 90 to 5,000. A typical example of this b component is (
There are (meth)acrylate compounds having a meth)acryloyl group.
上記(メタ)アクリレート化合物の具体例としては、2
−エチルヘキシル(メタ)アクリレート、テトラヒドロ
フルフリルアルコールカプロラクトン付加物の(メタ)
アクリレート、ノニルフェノールエチレンオキサイド付
加物の(メタ)アクリレート、ポリエチレングリコール
ジ(メタ)アクリレート、ポリプロピレングリコールジ
(メタ)アクリレート、ビスフェノールジエチレングリ
コールジ(メタ)アクリレート、水添ビスフェノールト
リエチレングリコールジ(メタ)アクリレ−ト、脂環族
ジ(メタ)アクリレート、トリメチロールプロパントリ
(メタ)アクリレート、ペンタエリスリトールトリ
(メタ)アクリレートなどが挙げられる。Specific examples of the above (meth)acrylate compounds include 2
- Ethylhexyl (meth)acrylate, tetrahydrofurfuryl alcohol caprolactone adduct (meth)
Acrylate, (meth)acrylate of nonylphenol ethylene oxide adduct, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, bisphenol diethylene glycol di(meth)acrylate, hydrogenated bisphenol triethylene glycol di(meth)acrylate , alicyclic di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri
Examples include (meth)acrylate.
b成分としては、上記の(メタ)アクリレート化合物の
ほか、ジアリルアジペート、ジアリルフタレート、トリ
アリルイソシアヌレートなどのアリルエステル、スチレ
ン、ビニルアセテート、N−ビニルピロリドン、N−N
−ジメチルアクリルアミド、N−N−ジメチルアミノプ
ロピルアクリルアミド、N−N−ジメチルアミノエチル
アクリレートな°どの各種ビニル化合物を使用できる。As component b, in addition to the above-mentioned (meth)acrylate compounds, allyl esters such as diallyl adipate, diallyl phthalate, and triallyl isocyanurate, styrene, vinyl acetate, N-vinylpyrrolidone, N-N
Various vinyl compounds such as -dimethylacrylamide, N-N-dimethylaminopropylacrylamide, and N-N-dimethylaminoethyl acrylate can be used.
この発明におけるa、b成分の使用割合は、組成物の粘
度、硬化塗膜の物性などにより決定されるが、C成分が
少なすぎるとガラスや金属などに対する硬化塗膜の密着
性や耐水性、゛耐熱性が悪くなるほか、硬化性も悪くな
り、逆に多すぎると硬化塗膜が硬くなって強靭性などの
物性を低下させる。これらの特性をいずれも満足させる
ためには、a、b成分の合計量中に占めるC成分の割合
が3θ〜90重量%、好ましくは40〜80重量%とな
るようにするのが望ましい。The ratio of components a and b used in this invention is determined by the viscosity of the composition, the physical properties of the cured coating, etc., but if the amount of component C is too small, the adhesion and water resistance of the cured coating to glass, metal, etc. ``In addition to deteriorating heat resistance, curability also deteriorates; conversely, if too much is used, the cured coating film becomes hard and physical properties such as toughness deteriorate. In order to satisfy all of these characteristics, it is desirable that the proportion of component C in the total amount of components a and b be 3θ to 90% by weight, preferably 40 to 80% by weight.
この発明においてC成分として用いられる光重合開始剤
としては、一般に紫外線硬化型塗料の開始剤、増悪剤と
して用いられている各種のものが使用できる。たとえば
ベンゾイン、ベンゾインメチルエーテル、ベンゾインエ
チルエーテル、ベンゾインイソプロピルエーテル、ベン
ゾインイソブチルエーテル、2−メチルベンゾイン、ベ
ンゾフェノン、ミヒラーズケトン、ベンジル、ベンジル
ジメチルケタール、ベンジルジエチルケタール、アント
ラキノン、メチルアントラキノン、2・2−ジェトキシ
アセトフェノン、2−メチルチオキサントン、2−イソ
プロピルチオキサントン、2−クロロチオキサントン、
アントラセン、■・1−ジクロロアセトフェノン、メチ
ルオルソベンゾイルベンゾエートなど、またこれらとア
ミン類などの少量の増感助剤と併用したものなどを挙げ
ることができる。As the photopolymerization initiator used as component C in this invention, various kinds of initiators generally used as initiators and aggravating agents for ultraviolet curable coatings can be used. For example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2-methylbenzoin, benzophenone, Michler's ketone, benzyl, benzyl dimethyl ketal, benzyl diethyl ketal, anthraquinone, methylanthraquinone, 2,2-jethoxyacetophenone , 2-methylthioxanthone, 2-isopropylthioxanthone, 2-chlorothioxanthone,
Examples include anthracene, 1.1-dichloroacetophenone, methylorthobenzoylbenzoate, and those used in combination with small amounts of sensitizing aids such as amines.
これら光重合開始剤の使用量としては、前記のa、b成
分の合計量100重量部に対して通常0゜1〜10重量
部程度、好適には1〜5重量部である。この量が少なす
ぎると硬化性を満足できず、また所定量を超えて用いて
もそれ以上の硬化速度の向上は望めない。The amount of these photopolymerization initiators to be used is usually about 0.1 to 10 parts by weight, preferably 1 to 5 parts by weight, based on 100 parts by weight of the total amount of components a and b. If this amount is too small, the curability cannot be satisfied, and even if it is used in excess of a predetermined amount, no further improvement in the curing rate can be expected.
この発明の光硬化性樹脂組成物には、必要に応じてアク
リル樹脂、ポリアミド樹脂、ポリエステル樹脂、ポリエ
ーテル樹脂、ポリウレタン樹脂、シリコーン樹脂、フェ
ノール樹脂などの各種変性用樹脂や、有機けい素化合物
、界面活性剤などの各種添加剤を配合してもよく、組成
物全体の粘度としては塗工作業性の観点から通常10〜
10.000センチボイズ(cps)(25℃)の範囲
に調整されているのが望ましい。The photocurable resin composition of the present invention may optionally contain various modifying resins such as acrylic resin, polyamide resin, polyester resin, polyether resin, polyurethane resin, silicone resin, and phenol resin, as well as organic silicon compounds, Various additives such as surfactants may be added, and the viscosity of the entire composition is usually from 10 to 10, from the viewpoint of coating workability.
It is desirable that the temperature be adjusted within the range of 10,000 centivoise (cps) (25° C.).
この発明の光硬化性樹脂組成物を使用するにあたっては
、たとえば被塗物の表面に硬化後の厚みが通常10〜2
00μmとなるように適宜の手段で塗布したのち、その
塗布面に80〜120w/個程度の高圧水銀ランプを用
いて照射量がlO〜500mJ/aaとなるように照射
して硬化させればよい。これによってガラスや金属など
の被塗物の表面に密着性にすぐれ、また耐水性、耐熱性
にすぐれる硬化塗膜を硬化性良好に形成することができ
る。When using the photocurable resin composition of the present invention, for example, the thickness of the surface of the object to be coated after curing is usually 10 to 2.
After applying it by an appropriate means to a thickness of 00 μm, the coated surface may be cured by irradiating it with a high-pressure mercury lamp of about 80 to 120 W/piece at an irradiation dose of 10 to 500 mJ/aa. . As a result, it is possible to form a cured coating film having excellent adhesion to the surface of the object to be coated, such as glass or metal, and having excellent water resistance and heat resistance.
以上のように、この発明の前記a、b、c成分を用いた
光硬化性樹脂組成物は、硬化速度が速く、ガラスや金属
などの被塗物に対する密着性が良好で、かつ耐水性、耐
熱性にすぐれた硬化塗膜を形成することができるから、
印刷回路基板や電子部品用コート材などの各種用途に有
利に応用することができる。As described above, the photocurable resin composition using the a, b, and c components of the present invention has a fast curing speed, good adhesion to coated objects such as glass and metal, and has water resistance and Because it can form a cured coating film with excellent heat resistance,
It can be advantageously applied to various uses such as printed circuit boards and coating materials for electronic parts.
以下に、この発明の実施例を記載してより具体的に説明
する。なお、以下において、部とあるは重量部を意味す
るものとする。EXAMPLES Below, examples of the present invention will be described in more detail. In addition, in the following, parts shall mean parts by weight.
実施例1
1・3−ジー(2−ヒドロキシエチル)−5・5−ジメ
チルヒダントイン〔前記式中のR,、R2=水素、R3
,R4”メチル基、m、n=1のジオ−ル〕 1モルと
アクリル酸2モルとを、P−トルエンスルホン酸5部と
ハイドロキノン0.01部と生成水を除去できる量のベ
ンゼンとの存在下、90−110℃で15時間反応させ
たのち、水洗し、ベンゼンを減圧除去して、分子内にア
クリロイル基を2個含有するエステル(以下、これをエ
ステルAという)を得た。Example 1 1,3-di(2-hydroxyethyl)-5,5-dimethylhydantoin [R,, R2=hydrogen, R3 in the above formula
, R4'' methyl group, m, diol with n=1] and 2 moles of acrylic acid were combined with 5 parts of P-toluenesulfonic acid, 0.01 part of hydroquinone, and an amount of benzene that can remove the produced water. After reacting at 90-110° C. for 15 hours in the presence of the ester, it was washed with water and benzene was removed under reduced pressure to obtain an ester containing two acryloyl groups in the molecule (hereinafter referred to as ester A).
上記のエステルA50部に、脂環族ジアクリレート(三
菱油化ファイン社製の商品名5A1002)50部、ベ
ンジルジメチルケタール2部を混合し、粘度450cp
s (25℃)の光硬化性樹脂組成物を得た。50 parts of alicyclic diacrylate (trade name 5A1002 manufactured by Mitsubishi Yuka Fine Co., Ltd.) and 2 parts of benzyl dimethyl ketal were mixed with 50 parts of the above ester A, and the mixture had a viscosity of 450 cp.
A photocurable resin composition of 25° C. was obtained.
実施例2
実施例1で得たエステルA50部に、ビスフェノールジ
エチレングリコールジアクリレート50部およびベンジ
ルジメチルケタール2部を混合し、粘度700cps
(25℃)の光硬化性樹脂組成物を得た。Example 2 50 parts of bisphenol diethylene glycol diacrylate and 2 parts of benzyl dimethyl ketal were mixed with 50 parts of ester A obtained in Example 1, and the mixture had a viscosity of 700 cps.
(25° C.) A photocurable resin composition was obtained.
実施例3
実施例1で得たエステルA80部に、N−ビニルピロリ
ドン20部およびベンジルジメチルケタール2部を混合
し、粘度220cps (25℃)の光硬化性樹脂組
成物を得た。Example 3 20 parts of N-vinylpyrrolidone and 2 parts of benzyl dimethyl ketal were mixed with 80 parts of the ester A obtained in Example 1 to obtain a photocurable resin composition with a viscosity of 220 cps (25°C).
実施例4
1・3−ジー(2−ヒドロキシエチル)−5・5−ジメ
チルヒダントインの代わりに、■・3−ジー(2−ヒド
ロキシエチル)−5・5−ペンタメチレンヒダントイン
〔前記式中のR,、R,=水素、R3,RJ=両基が一
緒になってヒダントインの5位の炭素とによりシクロヘ
キサン環を構成するペンタメチレン基、m、n=1のジ
オール〕を同量使用した以外は、実施例1と同様にして
エステル(以下、これをエステルBという)を得た。Example 4 Instead of 1,3-di(2-hydroxyethyl)-5,5-dimethylhydantoin, ■,3-di(2-hydroxyethyl)-5,5-pentamethylenehydantoin [R in the above formula ,, R, = hydrogen, R3, RJ = pentamethylene group in which both groups together form a cyclohexane ring with the 5-position carbon of hydantoin, diol with m and n = 1] were used in the same amount. An ester (hereinafter referred to as ester B) was obtained in the same manner as in Example 1.
このエステルBを用いて、実施例1と同様の配合組成に
て、粘度450cps (25℃)の光硬化性樹脂組成
物を得た。Using this ester B, a photocurable resin composition having a viscosity of 450 cps (25° C.) was obtained with the same formulation as in Example 1.
実施例5
1・3−ジー(2−ヒドロキシエチル)−5・5−ジメ
チルヒダントインの代わりに、1・3−(γ−ヒドロキ
シプロピル)−5・5−ジエチルヒダントイン〔前記式
中のR,、R2=メチル基、R:1.R4=エチル基、
m、n=1のジオール〕を同量使用した以外は、実施例
1と同様にしてエステル(以下、これをエステルCとい
う)を得た。Example 5 Instead of 1,3-di(2-hydroxyethyl)-5,5-dimethylhydantoin, 1,3-(γ-hydroxypropyl)-5,5-diethylhydantoin [R in the above formula, R2=methyl group, R:1. R4=ethyl group,
An ester (hereinafter referred to as ester C) was obtained in the same manner as in Example 1, except that the same amount of diol with m and n=1 was used.
このエステルCを用いて、実施例1と同様の配合組成に
て、粘度600cps (25℃)の光硬化性樹脂組成
物を得た。Using this ester C, a photocurable resin composition with a viscosity of 600 cps (25° C.) was obtained with the same formulation as in Example 1.
比較例
5A1002(前出)100部とベンジルジメチルケタ
ール2部とを混合して、粘度7Qcps(25℃)の光
硬化性樹脂組成物を得た。Comparative Example 5 100 parts of A1002 (described above) and 2 parts of benzyl dimethyl ketal were mixed to obtain a photocurable resin composition with a viscosity of 7 Qcps (25°C).
上記の実施例および比較例の各光硬化性樹脂組成物を、
ガラス板上にlO〜20μm厚に塗布し、高圧水銀ラン
プ(80w /C0I)を用いた光照射により硬化させ
、完全硬化に要した照射量(m J /cr&)と、完
全硬化後の硬化塗膜の密着性、耐熱性および耐水性とを
、調べた。結果は、後記の表に示されるとおりであった
。なお、密着性、耐熱性および耐水性は下記の方法で測
定した。Each of the photocurable resin compositions of the above examples and comparative examples,
It was coated on a glass plate to a thickness of lO to 20 μm and cured by light irradiation using a high-pressure mercury lamp (80w/C0I). The adhesion, heat resistance, and water resistance of the film were examined. The results were as shown in the table below. Note that adhesion, heat resistance, and water resistance were measured by the following methods.
〈密着性〉
硬化塗膜にl am間隔で100個のご盤目をつくり、
この上に感圧性接着テープ(日東電気工業社製の商品名
N0.21)を圧着後テープを剥離したときの残存個数
を調べた。<Adhesion> 100 dimples are made on the cured coating film at intervals of 1 am,
A pressure-sensitive adhesive tape (trade name No. 21, manufactured by Nitto Electric Industry Co., Ltd.) was crimped onto this, and the number of pieces remaining when the tape was peeled off was examined.
〈耐熱性〉
硬化塗膜に1鰭間隔で100個のご盤目をつくり、80
℃の空気中に30日間放置したのち、この上に感圧性接
着テープ(日東電気工業社製の商品名N0.21)を圧
着後テープを剥離したときの残存個数を調べた。<Heat resistance> 100 cuts are made in the cured coating film at 1 fin intervals, and 80
After being left in the air at .degree. C. for 30 days, a pressure-sensitive adhesive tape (trade name No. 21, manufactured by Nitto Electric Industry Co., Ltd.) was crimped thereon, and the number of pieces remaining when the tape was peeled off was examined.
く耐水性〉
硬化塗膜を80℃の温水中に24時間浸漬し、このとき
の塗膜の状態を調べ、塗膜がガラス表面に良好に密着し
ている場合を○、塗膜が剥離してしまった場合を×、と
評価した。Water resistance> The cured coating film was immersed in warm water at 80℃ for 24 hours, and the condition of the coating film at this time was examined. If the coating film adhered well to the glass surface, it was evaluated as ○, and the coating film did not peel off. Cases in which this occurred were rated as ×.
上記の試験結果から明らかなように、この発明に係る光
硬化性樹脂組成物は、硬化速度が速く、ガラス板に対す
る密着性にすぐれ、しかも耐水性。As is clear from the above test results, the photocurable resin composition according to the present invention has a fast curing speed, excellent adhesion to glass plates, and is water resistant.
耐熱性にすぐれる硬化塗膜を付与しうるちのであること
が判る。It can be seen that this material provides a cured coating film with excellent heat resistance.
Claims (1)
酸とのエステル、b)1分子中に重合性炭素−炭素二重
結合を1個以上含む上記a成分以外の重合性化合物、c
)光重合開始剤を含むことを特徴とする光硬化性樹脂組
成物。(1) a) Ester of hydantoin type diol and (meth)acrylic acid, b) Polymerizable compound other than the above component a containing one or more polymerizable carbon-carbon double bonds in one molecule, c
) A photocurable resin composition comprising a photopolymerization initiator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29013386A JPS63142006A (en) | 1986-12-05 | 1986-12-05 | Photocurable resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29013386A JPS63142006A (en) | 1986-12-05 | 1986-12-05 | Photocurable resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63142006A true JPS63142006A (en) | 1988-06-14 |
Family
ID=17752219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29013386A Pending JPS63142006A (en) | 1986-12-05 | 1986-12-05 | Photocurable resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63142006A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007112722A (en) * | 2005-10-18 | 2007-05-10 | Nof Corp | Polymerizable imidazole salt |
JP2015510501A (en) * | 2012-02-01 | 2015-04-09 | エルジー・ケム・リミテッド | Novel compound, photosensitive composition containing the same, and photosensitive material |
-
1986
- 1986-12-05 JP JP29013386A patent/JPS63142006A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007112722A (en) * | 2005-10-18 | 2007-05-10 | Nof Corp | Polymerizable imidazole salt |
JP2015510501A (en) * | 2012-02-01 | 2015-04-09 | エルジー・ケム・リミテッド | Novel compound, photosensitive composition containing the same, and photosensitive material |
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