JPS63141489U - - Google Patents

Info

Publication number
JPS63141489U
JPS63141489U JP1987034015U JP3401587U JPS63141489U JP S63141489 U JPS63141489 U JP S63141489U JP 1987034015 U JP1987034015 U JP 1987034015U JP 3401587 U JP3401587 U JP 3401587U JP S63141489 U JPS63141489 U JP S63141489U
Authority
JP
Japan
Prior art keywords
circuit board
chip
semiconductor non
memory
circuit block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987034015U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987034015U priority Critical patent/JPS63141489U/ja
Publication of JPS63141489U publication Critical patent/JPS63141489U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Wire Bonding (AREA)
  • Non-Volatile Memory (AREA)
  • Electric Clocks (AREA)
  • Electromechanical Clocks (AREA)

Description

【図面の簡単な説明】
第１図は本考案による電子時計用回路ブロツク
の平面図、第２図は本考案による電子時計用回路
ブロツクの断面図、第３図は本考案による電子時
計用回路ブロツクを組み込んだムーブメントの平
面図、第４図は本考案による電子時計用回路ブロ
ツクを組み込んだムーブメントの断面図である。 １……ＩＣチツプ、２……不輝発性メモリー内
蔵部、３……フレキシブル回路基板、４……銅箔
パターン、５……超小型水晶振動子、６……モー
ルド剤、７……はんだバンプ、８……メモリー消
去用穴、９……地板、１０……回路押え板、１０
ａ……回路押え板の穴、１１……コイル、１２…
…磁心、１３……コイルリード基板、１４……ス
テータ、１５……電池、１６……巻真、１７……
規正レバー、１８……輪列受、１９……電池マイ
ナス端子、２０……電池絶縁板、２１，２２，２
３，２４，２５……ねじ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 紫外線消去タイプの半導体不輝発性メモリーを
    内蔵するＩＣチツプを回路基板にフエイスダウン
    実装する電子時計用回路ブロツクに於いて、前記
    回路基板の前記半導体不輝発性メモリー内蔵部に
    対応する位置に前記半導体不輝発性メモリーを消
    去するための穴を設けるとともに、前記ＩＣチツ
    プ及び前記回路基板に前記回路基板の前記ＩＣチ
    ツプ装着側からモールド剤等の接着剤を塗布した
    ことを特徴とする電子時計用回路ブロツク。
JP1987034015U 1987-03-09 1987-03-09 Pending JPS63141489U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987034015U JPS63141489U (ja) 1987-03-09 1987-03-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987034015U JPS63141489U (ja) 1987-03-09 1987-03-09

Publications (1)

Publication Number Publication Date
JPS63141489U true JPS63141489U (ja) 1988-09-19

Family

ID=30842163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987034015U Pending JPS63141489U (ja) 1987-03-09 1987-03-09

Country Status (1)

Country Link
JP (1) JPS63141489U (ja)

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