JPS63140638U - - Google Patents

Info

Publication number
JPS63140638U
JPS63140638U JP1987034297U JP3429787U JPS63140638U JP S63140638 U JPS63140638 U JP S63140638U JP 1987034297 U JP1987034297 U JP 1987034297U JP 3429787 U JP3429787 U JP 3429787U JP S63140638 U JPS63140638 U JP S63140638U
Authority
JP
Japan
Prior art keywords
adhesive
ring
board
circuit board
mount portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987034297U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987034297U priority Critical patent/JPS63140638U/ja
Publication of JPS63140638U publication Critical patent/JPS63140638U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987034297U 1987-03-07 1987-03-07 Pending JPS63140638U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987034297U JPS63140638U (enrdf_load_stackoverflow) 1987-03-07 1987-03-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987034297U JPS63140638U (enrdf_load_stackoverflow) 1987-03-07 1987-03-07

Publications (1)

Publication Number Publication Date
JPS63140638U true JPS63140638U (enrdf_load_stackoverflow) 1988-09-16

Family

ID=30842710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987034297U Pending JPS63140638U (enrdf_load_stackoverflow) 1987-03-07 1987-03-07

Country Status (1)

Country Link
JP (1) JPS63140638U (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133644U (ja) * 1984-07-31 1986-02-28 株式会社神戸製鋼所 都市ごみの破袋装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133644U (ja) * 1984-07-31 1986-02-28 株式会社神戸製鋼所 都市ごみの破袋装置

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