JPS63140635U - - Google Patents
Info
- Publication number
- JPS63140635U JPS63140635U JP3244787U JP3244787U JPS63140635U JP S63140635 U JPS63140635 U JP S63140635U JP 3244787 U JP3244787 U JP 3244787U JP 3244787 U JP3244787 U JP 3244787U JP S63140635 U JPS63140635 U JP S63140635U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- whose
- protrusion
- solder
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3244787U JPS63140635U (nl) | 1987-03-05 | 1987-03-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3244787U JPS63140635U (nl) | 1987-03-05 | 1987-03-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63140635U true JPS63140635U (nl) | 1988-09-16 |
Family
ID=30839133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3244787U Pending JPS63140635U (nl) | 1987-03-05 | 1987-03-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63140635U (nl) |
-
1987
- 1987-03-05 JP JP3244787U patent/JPS63140635U/ja active Pending