JPS6313773B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a press device incorporating a toggle mechanism.

For example, a press device is used to bend and shape the leads of semiconductor devices such as resin-molded transistors, and uses a toggle mechanism to expand the force transmitted to the driven side to move the upper and lower molds of the press mold up and down. By changing the bending direction, a lower mold leading type and an upper mold leading type are selected. The lower die advance type press device bends the leads 2 of the semiconductor device 1 by about 90 degrees downward from a predetermined position, for example, as shown in FIG. To explain this with reference to FIGS. 5 and 5, numeral 3 is a horizontal turntable that supports a plurality of semiconductor devices 1, 1, . This is a lower mold advance type press device that bends the lead 2 of one semiconductor device 1 sent to the processing position P downward. This press device 4 has a lower mold 5 and an upper mold 6 arranged below and above the lead 2 in position P, each having stepped portions 5' and 6' that engage with each other, and the stepped portion 6' of the upper mold 6. Spring material 7
A lead holding pad 8 is fitted through the lead-holding pad 8 so as to be slidable up and down. This lower mold 5 and upper mold 6 are the fourth
As shown in the figure and FIG. 5, the lower die 5 first moves up to the position where it touches the bottom surface of the lead 2 and stops, then the upper die 6 descends and the pad 8 and the lower die 5 touch the lead 2. The lead 2 is held at a fixed position from above and below, and the lead 2 is bent downward.

In addition, when bending the lead 2 upward by approximately 90 degrees as shown in FIG. Because of the constraints that make this process difficult due to the relationship with other manufacturing processes, the press equipment was changed to an upper mold advance type as shown in FIGS. 6 to 8. That is, the lower mold 9 and upper mold 10 of this type have a structure similar to that of the lower mold 5 and upper mold 6 of the previous type, which are exchanged vertically. The lead 2 is lowered to the contact position, and then the lower mold 9 is raised and the lead 2 is held between the pad 11 and the upper mold 10 (Fig. 7), and the lead 2 is bent upward (Fig. 8). .

In this way, it is necessary for the press device to select between the lower mold leading type and the upper mold leading type by changing the lead bending direction. Furthermore, since the movement of the upper die and lower die of this type of press requires relatively large power transmission, this power is obtained through a toggle mechanism. However, the shapes and movements of the lower die and upper die are different depending on the change in the lead bending direction, so one press device has two functions, a lower die leading function and an upper die leading function, with a simple structure. It is difficult to do this, so conventionally, changes in the lead bending direction have been made to follow changes in the lead bending direction by installing two press machines, one dedicated to the lower die leading type and the other dedicated to the upper die leading type, and using them separately. As a result, the entire mechanism becomes larger and more expensive.
In addition, there were other problems such as difficulty in incorporating it into automatic machines.

The present invention has been made in view of the above problems, and provides a press device with a simple structure that selectively performs two functions, a lower mold advance function and an upper mold advance function, by a simple switching operation. The present invention will be explained below with reference to Examples.

In FIGS. 9 to 11, 12 is a frame that stands vertically, 13, 13 are two parallel guide rails fixed to the frame 12 and extend in the vertical direction, and 14, 15, 16 are guide rails 13, 1.
The first, second, and third slide tables are vertically lined up and are fitted and supported on both sides so as to be vertically movable and slidable, for example, each slide table 14, 15, 16.
A V-shaped groove is formed in the vertical direction on the opposing surfaces of the guide rails 13, 13, and a plurality of cross roller bearings 17, 17... are inserted into the opposing V-shaped grooves, thereby allowing each slide base to 14, 15, 16
moves smoothly in the vertical direction along the guide rails 13, 13. Reference numerals 18 and 18 denote connection members that integrally connect the first slide table 14 at the upper end and the third slide table 16 at the lower end on both sides thereof, and 19 denote the second slide table 15 and the third slide table in the middle. a toggle mechanism that provides power in opposite directions to 16;
is a power source for the toggle mechanism 19, which is, for example, a cylinder. The toggle mechanism 19 includes a first link 21 whose one end is rotatably connected to the second slide table 15, and a second link 22 whose one end is rotatably connected to the third slide table 16. It has a structure in which the other end and the tip of the piston rod 23 of the cylinder 20 are rotatably connected by a single pin 24, and the effective lengths of the first link 21 and the second link 22 are almost equal, and the piston rod 23 is connected at all times. As shown in FIG. 10, when the piston rod 23 is pushed out, both of them protrude outward in a dogleg shape. Assuming that the angles formed by each of the links 21 and 22 and the piston rod 23 are equal, and when the piston rod 23 is moved back into the cylinder 20 with the power F, each slide base 15 and 16 has the following relationship: T=F/2tan... I) External forces T act in opposite directions. The rear end of the cylinder 20 is rotatably supported by a part of the frame 12.

Reference numeral 25 denotes a load applying mechanism that selectively applies a predetermined load to either the second slide table 15 or the third slide table 16, and is composed of, for example, two springs 26, 26. This spring 2
6 and 26, as shown by the solid line in FIG. 10, have both ends locked to both sides of the third slide table 16 and the middle part of both sides of the frame 12, so as to pull the third slide table 16 upward. In the case where the second
There are cases in which the slide table 15 is pulled downward, and the proper use thereof will be described later. Further, 27 is a first stopper that determines the upper limit position of the first slide table 14, and 28 is a first stopper for determining the upper limit position of the first slide table 14.
The second stopper 29 determines the lower limit position and the upper limit position of the second slide table 15, and the third stopper 29 determines the lower limit position of the second slide table 15.
It is fixed to the side so that the vertical position can be adjusted freely.

An upper mold 30 for pressing is detachably fixed to the front surface of the first slide table 14, and a lower mold 31 for pressing is fixed to the front surface of the second slide table 15, respectively.
For example, the lead 2 of the semiconductor device 1 shown in FIG.
When bending downward, the upper mold 30 and lower mold 31 shown in FIG. 3 are used. The operation at this time will be explained with reference to FIGS. 12 to 14.

First, as shown in FIG. 12, springs 26, 26 are installed between the third slide table 16 and the frame 12 in normal times. At this time, the third slide table 16 receives an upward force from the spring force of the springs 26 , 26 , but the first slide table 14 , which is integrally connected to the third slide table 16 , is pressed against the first stopper 27 . Since they are in contact with each other, both of them are stabilized in a fixed position, and the second slide table 15 is also stationary in a fixed position. Also, at this time, the second slide table 15
The distance between the second stopper 28 and the second stopper 28 is set equal to the distance between the lower die 31 and the lead 2 of the semiconductor device 1 in a fixed position. Then, the piston rod 23 is moved back and forth by the cylinder 20, and an upward external force is applied to the second slide table 15 and a downward external force is applied to the third slide table 16 via the toggle mechanism 19 at the same time. Then, since the upward spring force of the springs 26, 26 is applied to the third slide table 16, this spring force acts as an additional load on the downward external force applied by the toggle mechanism 19, and Since the second slide table 15 is in a free state, the first
As shown in FIG. 3, only the free second slide base 15 rises to a position where it touches the second stopper 28 and receives a portion of the lower surface of the lead 2. In other words, perform a lower die leading type movement. Next, when the second slide base 15 hits the second stopper 28 and stops,
The external force pushing down the third slide table 16 overcomes the spring force of the springs 26, 26, and both the third slide table 16 and the first slide table 14 begin to descend, and as shown in FIG. lead 2
Bend it downward. Thereafter, the restoring force of the springs 26 and the advancement of the piston rod of the cylinder are used to automatically return to the state shown in FIG. 12, the semiconductor device 1 is replaced, and the above operation is repeated.

Next, the case of bending the leads 2 of the semiconductor device 1 upward will be explained with reference to FIGS. 15 to 17. In this case, as shown in FIG. 15, the upper mold 30' and the lower mold 3
1' is replaced with the one shown in FIG. When the piston rod 23 is retracted, the second slide table 15 does not move because a load is applied to the second slide table 15 by the spring force of the springs 26, 26.
Only the third slide table 16 and the first slide table 14 in the free state are lowered. This lowering is performed until the first slide base 14 hits the second stopper 28 and the upper die 30' receives a portion of the upper surface of the lead 2. In other words, it performs an upper-type advance type operation.
When the piston rod 23 is further retracted, the second slide table 15 rises and bends the lead 2 upward.

It should be noted that the present invention is not limited to the above-mentioned embodiments; for example, each of the three slides may move in the horizontal direction, and a cam or solenoid may be used as the drive source for the toggle mechanism. It is also possible to do so. Further, the object to be pressed can be sufficiently applied to things other than leads for semiconductor devices.

As explained above, according to the present invention, the lower die leading motion and the upper die leading motion are selected by changing the load to the slide table, so that the work of selecting the press form is facilitated. Furthermore, it is possible to downsize a press device that has both the lower die advance function and the upper die advance function, and it is possible to realize a significant cost reduction of this type of press device, and furthermore, it becomes easy to incorporate it into an automatic machine.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a semiconductor device showing an example of an object to be pressed, FIG. 2 is an overall schematic plan view of a lead bending device for the semiconductor device in FIG. 1, and FIGS. 3 to 8 are the same as those in FIG. A schematic side view during each operation to explain the operation of the upper die and lower die of a press device for bending leads of a semiconductor device, and FIGS. 9 and 10 are front views showing an embodiment of the present invention. and side view, Fig. 11 is No. 9
An enlarged sectional view taken along line II in the figure, and FIGS. 12 to 17 are schematic side views during each press operation for explaining each press operation in the embodiment of the present invention. 13...Guide rail, 14...First slide stand, 15...Second slide stand, 16...Third
Slide base, 18... Connection member, 19... Toggle mechanism, 20... Drive source, 25... Load addition mechanism, 27, 28, 29... Stopper, 30, 3
0'... Press die (upper die), 31, 31'... Press die (lower die).

Claims (1)

[Claims] 1 The first, second, and third slide tables arranged in a series that reciprocate appropriately in sections determined by multiple stoppers along a common guide rail and the first and third slide tables at both ends are integrated. A connecting member to be connected, a drive source that reciprocates the third slide table and the intermediate second slide table in opposite directions via a toggle mechanism, and the first or third slide table and the second slide table.
It is equipped with a load applying mechanism made of a spring material etc. that removably applies a required load selectively to one of the slide bases, and a pair of press molds that are removably attached to the first and second slide bases. A press device that is characterized by: