JPS63136329U - - Google Patents

Info

Publication number
JPS63136329U
JPS63136329U JP2933687U JP2933687U JPS63136329U JP S63136329 U JPS63136329 U JP S63136329U JP 2933687 U JP2933687 U JP 2933687U JP 2933687 U JP2933687 U JP 2933687U JP S63136329 U JPS63136329 U JP S63136329U
Authority
JP
Japan
Prior art keywords
substrate
transferred
station
stage
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2933687U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2933687U priority Critical patent/JPS63136329U/ja
Publication of JPS63136329U publication Critical patent/JPS63136329U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案に係るマウンターの要部のみ
を示す側断面図、第２図は、従来のマウンターの
要部のみを示す上面図である。 １……基板、４……ペレツト、８……ステージ
、９……シユーター、１２……スタンプ状押圧棒
、Ｃ……ペレツト取付ステーシヨン。 FIG. 1 is a side sectional view showing only the main parts of a mounter according to the present invention, and FIG. 2 is a top view showing only the main parts of a conventional mounter. DESCRIPTION OF SYMBOLS 1...Substrate, 4...Pellet, 8...Stage, 9...Shooter, 12...Stamp-shaped pressing rod, C...Pellet mounting station.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ステーシヨン毎にピツチ送りする基板に、ペレ
ツト取付ステーシヨンに対設したステージ上のペ
レツトを、ステージより基板の搭載位置まで、シ
ユータを滑動させることにより移送し、搭載され
たペレツトを、スタンプ状押圧棒で押圧すること
により取付けるようにしたことを特徴とするマウ
ンター。 The pellets on the stage opposite the pellet mounting station are transferred to the substrate, which is fed in pitches at each station, by sliding the shutter from the stage to the mounting position of the substrate, and the loaded pellets are transferred with a stamp-shaped pressing rod. A mounter characterized in that it is installed by pressing.
JP2933687U 1987-02-27 1987-02-27 Pending JPS63136329U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2933687U JPS63136329U (en) 1987-02-27 1987-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2933687U JPS63136329U (en) 1987-02-27 1987-02-27

Publications (1)

Publication Number Publication Date
JPS63136329U true JPS63136329U (en) 1988-09-07

Family

ID=30833127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2933687U Pending JPS63136329U (en) 1987-02-27 1987-02-27

Country Status (1)

Country Link
JP (1) JPS63136329U (en)

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