JPS631339U - - Google Patents

Description

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing the configuration of an embodiment of this invention, and FIGS. 2 and 3 are respectively a mechanism for preventing and stopping a semiconductor element from sliding halfway on a guide rail in the embodiment shown in FIG. 1. FIG. 4 is an explanatory view showing the structure of an example of a conventional semiconductor device printing apparatus of this type. DESCRIPTION OF SYMBOLS 1... Supply part, 2... Semiconductor element, 4a... Guide rail, 6... Storage part, 7a... Feed claw, 8a... Disc,
9... Printing roller, 11... Movable piece, 12... Shaft, 13
...Coil spring, and the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Scope of utility model registration request] A semiconductor device printing device that prints a mark on the package surface of a semiconductor device using a printing roller while conveying the semiconductor device on a guide rail, and conveys a semiconductor device arranged at an angle so that the semiconductor device naturally slides down. a guide rail, a movable piece that is attached in the middle of the guide rail in a structure that is swingable about an axis, is held by a spring, and prevents and stops a semiconductor element sliding down the guide rail;
A rotary feed pawl that rotates about a shaft as a fulcrum to back up the semiconductor element stopped by the movable piece and forcibly conveys it against a spring that holds the movable piece; A semiconductor device printing device equipped with a printing roller that stamps on the surface of a semiconductor device package.