JPS63133953U - - Google Patents

Info

Publication number
JPS63133953U
JPS63133953U JP2505187U JP2505187U JPS63133953U JP S63133953 U JPS63133953 U JP S63133953U JP 2505187 U JP2505187 U JP 2505187U JP 2505187 U JP2505187 U JP 2505187U JP S63133953 U JPS63133953 U JP S63133953U
Authority
JP
Japan
Prior art keywords
ball nut
cooling device
ball
cooler
nut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2505187U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2505187U priority Critical patent/JPS63133953U/ja
Publication of JPS63133953U publication Critical patent/JPS63133953U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例を示す平面図、第２図
は第１図の断面図である。 １１……ボールナツト、１２……ボールナツト
平面加工部、１３……サーモモジユール、１４…
…冷却器、１５……冷却液流入管、１６……サー
モモジユール用配線、１７……リターンチユーブ
、１８……冷却液流出管、１９……ボール。 FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a sectional view of FIG. 1. 11... Ball nut, 12... Ball nut flat processing section, 13... Thermo module, 14...
... Cooler, 15 ... Coolant inflow pipe, 16 ... Thermo module wiring, 17 ... Return tube, 18 ... Coolant outflow pipe, 19 ... Ball.

Claims (1)

【実用新案登録請求の範囲】 (1) ボールネジ軸に螺合するボールナツトの周
囲に冷却液を通す冷却器を設け、ボールネジナツ
ト機構と前記冷却器の間にペルチエ効果により熱
移動を行なわせることができるサーモモジユール
を設置したことを特徴とするボールナツト冷却装
置。 (2) 冷却器が、フイン構造であることを特徴と
する実用新案登録請求の範囲第１項記載のボール
ナツト冷却装置。 (3) サーモモジユールに熱電半導体素子を使用
していることを特徴とする実用新案登録請求の範
囲第１項記載のボールナツト冷却装置。 (4) ボールナツトの周囲が、ボールナツトの平
面加工部であることを特徴とする実用新案登録請
求の範囲第１項記載のボールナツト冷却装置。[Claims for Utility Model Registration] (1) A cooler for passing a cooling liquid around a ball nut screwed onto a ball screw shaft is provided, and heat is transferred between the ball screw nut mechanism and the cooler by the Peltier effect. A ball nut cooling device characterized by being equipped with a thermo module that can (2) The ball nut cooling device according to claim 1, wherein the cooler has a fin structure. (3) The ball nut cooling device according to claim 1, which is characterized in that a thermoelectric semiconductor element is used in the thermo module. (4) The ball nut cooling device according to claim 1, wherein the periphery of the ball nut is a flat surface processed portion of the ball nut.
JP2505187U 1987-02-23 1987-02-23 Pending JPS63133953U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2505187U JPS63133953U (en) 1987-02-23 1987-02-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2505187U JPS63133953U (en) 1987-02-23 1987-02-23

Publications (1)

Publication Number Publication Date
JPS63133953U true JPS63133953U (en) 1988-09-01

Family

ID=30824841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2505187U Pending JPS63133953U (en) 1987-02-23 1987-02-23

Country Status (1)

Country Link
JP (1) JPS63133953U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999028220A1 (en) * 1997-12-03 1999-06-10 Nikon Corporation Substrate transferring device and method
JP2013072475A (en) * 2011-09-27 2013-04-22 Hiwin Technologies Corp Transmission module provided with cooling device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5922735A (en) * 1982-07-30 1984-02-06 Hashimoto Forming Co Ltd Molding of end cap of extruded synthetic resin braid

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5922735A (en) * 1982-07-30 1984-02-06 Hashimoto Forming Co Ltd Molding of end cap of extruded synthetic resin braid

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999028220A1 (en) * 1997-12-03 1999-06-10 Nikon Corporation Substrate transferring device and method
US6577382B2 (en) 1997-12-03 2003-06-10 Nikon Corporation Substrate transport apparatus and method
JP2013072475A (en) * 2011-09-27 2013-04-22 Hiwin Technologies Corp Transmission module provided with cooling device

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