JPS63133875U - - Google Patents
Info
- Publication number
- JPS63133875U JPS63133875U JP2131487U JP2131487U JPS63133875U JP S63133875 U JPS63133875 U JP S63133875U JP 2131487 U JP2131487 U JP 2131487U JP 2131487 U JP2131487 U JP 2131487U JP S63133875 U JPS63133875 U JP S63133875U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- manipulator
- flow
- current
- guard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図は本考案の一実施例の検出部の全体ブロ
ツク図、第2図は半田付けのための電流が流れる
経路より導き出される等価回路図、第3図はマニ
ピユレータ電極とガード電極を実装した際のヘツ
ダ部の構造図である。
5…マニピユレータ電極、6…ガード電極。
Fig. 1 is an overall block diagram of the detection section of an embodiment of the present invention, Fig. 2 is an equivalent circuit diagram derived from the path through which current flows for soldering, and Fig. 3 is a diagram showing the mounting of manipulator electrodes and guard electrodes. FIG. 5... Manipulator electrode, 6... Guard electrode.
Claims (1)
流すことの出来るマニピユレータ電極と、前記マ
ニピユレータ電極の近くに設けられ、電流を流し
込むガード電極とからなり、前記マニピユレータ
電極から前記ガード電極に流れる電流により、半
田を溶かし半田上げすることを特徴とするハンダ
上げ装置。 It consists of a manipulator electrode that can grip and support the terminal of an electronic component and allow current to flow through it, and a guard electrode that is provided near the manipulator electrode and allows current to flow through it, and the current flowing from the manipulator electrode to the guard electrode , a soldering device characterized by melting and soldering solder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2131487U JPS63133875U (en) | 1987-02-18 | 1987-02-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2131487U JPS63133875U (en) | 1987-02-18 | 1987-02-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63133875U true JPS63133875U (en) | 1988-09-01 |
Family
ID=30817644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2131487U Pending JPS63133875U (en) | 1987-02-18 | 1987-02-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63133875U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190006972A (en) * | 2016-05-20 | 2019-01-21 | 쌩-고벵 글래스 프랑스 | Resistance soldering method, antenna and glass assembly, and resistance soldering system |
-
1987
- 1987-02-18 JP JP2131487U patent/JPS63133875U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190006972A (en) * | 2016-05-20 | 2019-01-21 | 쌩-고벵 글래스 프랑스 | Resistance soldering method, antenna and glass assembly, and resistance soldering system |
US11298767B2 (en) | 2016-05-20 | 2022-04-12 | Saint-Gobain Glass France | Resistive soldering method, assembly of antenna and glass, and resistive soldering system |
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