JPS63131140U - - Google Patents

Info

Publication number
JPS63131140U
JPS63131140U JP2226087U JP2226087U JPS63131140U JP S63131140 U JPS63131140 U JP S63131140U JP 2226087 U JP2226087 U JP 2226087U JP 2226087 U JP2226087 U JP 2226087U JP S63131140 U JPS63131140 U JP S63131140U
Authority
JP
Japan
Prior art keywords
double
circuit board
integrated circuit
heat sink
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2226087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2226087U priority Critical patent/JPS63131140U/ja
Publication of JPS63131140U publication Critical patent/JPS63131140U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の構成図、第２図は
従来例を示す構成である。 １……絶縁シート、２Ａ，２Ｂ……両面粘着テ
ープ、３Ａ，３Ｂ……塵埃付着防止タツク紙、４
……放熱板、５……混成集積回路基板。 FIG. 1 is a configuration diagram of an embodiment of the present invention, and FIG. 2 is a configuration diagram showing a conventional example. 1...Insulating sheet, 2A, 2B...Double-sided adhesive tape, 3A, 3B...Dust adhesion prevention paper, 4
... Heat sink, 5 ... Hybrid integrated circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 両面に両面粘着テープを貼り付けた絶縁シート
を介して混成集積回路基板に放熱板を固定する際
、中央部に切り込みを有し前記両面粘着テープに
貼り付けられている塵埃付着防止タツク紙を剥離
することを特徴とする混成集積回路基板の放熱板
固定構造。 When fixing a heat sink to a hybrid integrated circuit board via an insulating sheet with double-sided adhesive tape pasted on both sides, peel off the dust-preventing tack paper that has a notch in the center and is pasted on the double-sided adhesive tape. A heat sink fixing structure for a hybrid integrated circuit board, characterized by:
JP2226087U 1987-02-17 1987-02-17 Pending JPS63131140U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2226087U JPS63131140U (en) 1987-02-17 1987-02-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2226087U JPS63131140U (en) 1987-02-17 1987-02-17

Publications (1)

Publication Number Publication Date
JPS63131140U true JPS63131140U (en) 1988-08-26

Family

ID=30819477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2226087U Pending JPS63131140U (en) 1987-02-17 1987-02-17

Country Status (1)

Country Link
JP (1) JPS63131140U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008159658A (en) * 2006-12-21 2008-07-10 Sumitomo Bakelite Co Ltd Circuit board
JP2013089843A (en) * 2011-10-20 2013-05-13 Panasonic Corp Thermal conductive sheet
JP2015023082A (en) * 2013-07-17 2015-02-02 日東シンコー株式会社 Method for using heat-conductive sheet

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008159658A (en) * 2006-12-21 2008-07-10 Sumitomo Bakelite Co Ltd Circuit board
JP2013089843A (en) * 2011-10-20 2013-05-13 Panasonic Corp Thermal conductive sheet
JP2015023082A (en) * 2013-07-17 2015-02-02 日東シンコー株式会社 Method for using heat-conductive sheet

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