JPS63131126U - - Google Patents
Info
- Publication number
- JPS63131126U JPS63131126U JP2310587U JP2310587U JPS63131126U JP S63131126 U JPS63131126 U JP S63131126U JP 2310587 U JP2310587 U JP 2310587U JP 2310587 U JP2310587 U JP 2310587U JP S63131126 U JPS63131126 U JP S63131126U
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- reciprocating
- output part
- semiconductor element
- upper mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2310587U JPS63131126U (en:Method) | 1987-02-18 | 1987-02-18 | |
| US07/056,764 US4735563A (en) | 1986-06-05 | 1987-06-02 | Apparatus for sealing a semiconductor element in a resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2310587U JPS63131126U (en:Method) | 1987-02-18 | 1987-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63131126U true JPS63131126U (en:Method) | 1988-08-26 |
Family
ID=30821117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2310587U Pending JPS63131126U (en:Method) | 1986-06-05 | 1987-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63131126U (en:Method) |
-
1987
- 1987-02-18 JP JP2310587U patent/JPS63131126U/ja active Pending