JPS63129390A - Electrode terminal takeoff construction for planar display panel - Google Patents
Electrode terminal takeoff construction for planar display panelInfo
- Publication number
- JPS63129390A JPS63129390A JP27512986A JP27512986A JPS63129390A JP S63129390 A JPS63129390 A JP S63129390A JP 27512986 A JP27512986 A JP 27512986A JP 27512986 A JP27512986 A JP 27512986A JP S63129390 A JPS63129390 A JP S63129390A
- Authority
- JP
- Japan
- Prior art keywords
- display panel
- wiring board
- flexible wiring
- electrode terminal
- takeoff
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010276 construction Methods 0.000 title 1
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 7
- 238000000605 extraction Methods 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 11
- 239000004020 conductor Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［−発明の目的］
（産業上の利用分野）
この発明は平面表示パネルの電極端子取出構造に関し、
特にその給電用のフレキシブル配線板との接続に関する
。[Detailed Description of the Invention] [-Objective of the Invention] (Field of Industrial Application) This invention relates to an electrode terminal extraction structure of a flat display panel,
In particular, it relates to connection with a flexible wiring board for power supply.
（従来の技術）
液晶ディスプレイパネル、ｉｌ１ｍＥＬパネル及びプラ
ズマディスプレイパネル等の平面表示パネルは、情報の
多様化に即応することを企図して、表示電極がＸ−Ｙマ
トリックス電極構造で構成されているものが一般的であ
り、ドツトマトリックス型の表示が行われる。従って、
大量の情報を鮮明に表示するためには駆動電極ライン数
を高密度に配列することが必要となり、必然的に電極取
り出し用端子も増大することとなる。これらの端子はパ
ネル基板上の周辺に微細ピッチで多数形成されており、
例えばポリイミドフィルム上に銅箔等をパターン形成し
てなるフレキシブル配線板と、例えば特開昭５７−１１
９３２５号公報や特開昭５９−１２４３２１号公報に記
載されているような方法で接続されている。(Prior Art) Flat display panels such as liquid crystal display panels, il1mEL panels, and plasma display panels have display electrodes configured in an X-Y matrix electrode structure in order to respond quickly to the diversification of information. is common, and a dot matrix type display is performed. Therefore,
In order to clearly display a large amount of information, it is necessary to arrange the number of drive electrode lines at a high density, and the number of terminals for taking out the electrodes inevitably increases. These terminals are formed in large numbers at fine pitches around the panel board.
For example, a flexible wiring board formed by patterning copper foil or the like on a polyimide film, and
The connection is made by the method described in Japanese Patent Application Laid-open No. 9325 and Japanese Patent Laid-Open No. 59-124321.
（発明が解決しようとする問題点）
このうち前者による方法は、液晶表示パネルを構成する
基板上に形成した透明導電膜の端子部上に金属メッキを
施し、液晶表示パネルと表示駆動回路部を半田付けによ
り接続しているが、金属メッキの透明導電膜への付着強
度が十分でない場合、表示駆動回路部接続俊のアセンブ
リの際に、接続部の剥がれや浮きにより、不点不良の発
生することが多かった。(Problems to be Solved by the Invention) Among these methods, the former method involves applying metal plating on the terminal portion of a transparent conductive film formed on a substrate constituting the liquid crystal display panel, thereby connecting the liquid crystal display panel and the display drive circuit portion. Although the connection is made by soldering, if the adhesion strength of the metal plating to the transparent conductive film is not sufficient, defects may occur due to peeling or lifting of the connection part during assembly of the display drive circuit connection. There were many things.
また後者による方法は、液晶表示器に接続する回路基板
の導体間に接着剤層を形成し、液晶表示器の入力端子と
導体とを当接させた後、加圧・加熱して接続している。The latter method involves forming an adhesive layer between the conductors of the circuit board to be connected to the liquid crystal display, bringing the input terminals of the liquid crystal display into contact with the conductors, and then applying pressure and heating to connect them. There is.
このため、接着後に接着部分を十分にシールドしなけれ
ば、水分等による回路基板の導体面の酸化や電蝕による
液晶表示器入力端子（透明導電膜）の切断等が発生する
。For this reason, if the bonded portion is not sufficiently shielded after bonding, the conductor surface of the circuit board may be oxidized due to moisture or the like, and the liquid crystal display input terminal (transparent conductive film) may be cut due to electrolytic corrosion.
この発明は、半田付けによる電極同志のｎ着と熱硬化性
の接着剤により、平面表示パネルとフレキシブル配線板
との接合力を強化することを目的としている。This invention aims to strengthen the bonding force between a flat display panel and a flexible wiring board by bonding electrodes together by soldering and using a thermosetting adhesive.
［発明の構成コ
（問題点を解決するための手段）
平面表示パネルへ給電を行うフレキシブル配線板を半田
付けする場合において、平面表示パネルの入力端子上或
いはフレキシブル配線板上に熱硬化性接着剤層を形成し
、加熱手段により半田融着と接着剤の硬化を行い、平面
表示パネルとフレキシブル配線板を接続する。[Structure of the Invention (Means for Solving Problems) When soldering a flexible wiring board that supplies power to a flat display panel, a thermosetting adhesive is applied to the input terminal of the flat display panel or the flexible wiring board. A layer is formed, the solder is fused and the adhesive is cured by heating means, and the flat display panel and the flexible wiring board are connected.
（作 用）
平面表示パネルとフレキシブル配線板を半田付は及び熱
硬化性の接着剤により接続することで、作業性よく信頼
性の高い電気的接続と機械的強度を得ることができる。(Function) By connecting the flat display panel and the flexible wiring board by soldering or thermosetting adhesive, it is possible to obtain highly workable and reliable electrical connection and mechanical strength.
（実施例）
以下、この発明の詳細を、平面表示パネルの例として液
晶表示器をあげ、図面を参照して詳細に説明する。(Example) Hereinafter, the present invention will be described in detail with reference to the drawings, using a liquid crystal display as an example of a flat display panel.
第１図はこの発明の一実施例を示す断面図である。同図
において、ガラス板等による透明な基板（１０）、 （
１１）の間は、スペーサ（図示せず）を介して中空部が
生じるごとくエポキシ樹脂等によるシール材（１２）に
て接着されており、基板（１０）、 （１１）の中空部
との対向面にはそれぞれ酸化インジウム等による表示電
極（１３）、 （１４）が形成されている。FIG. 1 is a sectional view showing an embodiment of the present invention. In the figure, a transparent substrate (10) made of a glass plate or the like, (
11) is bonded with a sealing material (12) made of epoxy resin or the like via a spacer (not shown) so that a hollow part is created, and the space between the substrates (10) and (11) is opposite to the hollow part. Display electrodes (13) and (14) made of indium oxide or the like are formed on each surface.
このうち一方の基板、例えば下方の基板（１１）の表示
電極（１４）は、中空部からシール材（１２）を貫通し
て基板周辺に露出した端子（１５）を有している。そし
て中空部には液晶（１６）が封入されるとともに、基板
（１０）、 （１１）の外面にはそれぞれ偏光板（１７
）、偏光板（１８）と反射板（１９）が被着されている
。一方、回路基板（２０）、 （２１）上には例えばそ
れぞれ液晶駆動回路用のＩＣ（２２）、 （２３）が装
着されており、例えばフレキシケーブルであるフレキシ
ブル配線板（２４）により、回路基板（２０）、 （２
１）と端子（１５）との間を導電接続している。またフ
レキシブル配線板（２４）と基板（１１）との間には、
熱硬化性の接着剤（２５）が介在している。The display electrode (14) of one of the substrates, for example, the lower substrate (11), has a terminal (15) that penetrates the sealing material (12) from the hollow part and is exposed around the substrate. A liquid crystal (16) is sealed in the hollow part, and a polarizing plate (17) is placed on the outer surface of each of the substrates (10) and (11).
), a polarizing plate (18) and a reflecting plate (19) are attached. On the other hand, ICs (22) and (23) for liquid crystal drive circuits, for example, are mounted on the circuit boards (20) and (21), respectively, and the circuit board (20), (2
1) and the terminal (15) are electrically connected. Moreover, between the flexible wiring board (24) and the substrate (11),
A thermosetting adhesive (25) is interposed.
第２図は接続前のフレキシブル配線板（２４）を示す斜
視図である。同図において、厚さ６脚程度のポリエステ
ル等によるフィルム（３０）上には、帯状の導電体（３
１）が形成されており、更にこの導電体（３１）上の端
子（１５）との接触予定部分には半田めっき（３２）が
形成されている。そしてフィルム（３ｏ）上で半田めっ
き（３２）に隣接し且つ導電体（３１）を横切るように
、熱硬化性の接着剤（２５）が形成されている。FIG. 2 is a perspective view showing the flexible wiring board (24) before connection. In the same figure, a strip-shaped conductor (3
1) is formed, and furthermore, solder plating (32) is formed on the conductor (31) at a portion scheduled to come into contact with the terminal (15). A thermosetting adhesive (25) is formed on the film (3o) adjacent to the solder plating (32) and across the conductor (31).
第３図は基板（１１）上の端子（１５）にフレキシブル
配線板（２４）を接続する工程を説明するための要部断
面図である。同図かられかるように、第２図に示したフ
レキシブル配線板（２４）は、半田めっき（３２）が予
め端子（１５）上にめっき或いは蒸着によって形成しで
ある半田と親和性の高い金属膜（４０）と対向し且つ接
着剤（２５）が基板（１１）とフレキシブル配線板（２
４）の間に介在するように、基板（１１）に重ね合わせ
、加熱手段（４１）として例えば熱ヘッドを一定圧力で
一定時間、フレキシブル配線板（２４）側から押し当て
ることにより、半田融着と接着剤（２５）の硬化を同時
に行う。FIG. 3 is a sectional view of a main part for explaining the process of connecting the flexible wiring board (24) to the terminal (15) on the board (11). As can be seen from the same figure, the flexible wiring board (24) shown in FIG. facing the film (40) and the adhesive (25) is attached to the substrate (11) and the flexible wiring board (2).
Solder fusion is performed by placing the board (11) on top of the board (11) so as to be interposed between and the adhesive (25) are cured at the same time.
この実施例では、フレキシブル配線板（２４）と液晶表
示器の両端子を半田付けすることで、信惰性の高い電気
的接続が得られる。更に接着剤（２５）も介在させるこ
とで、従来の半田付けのみのときにはフレキシブル配線
板（２４）は引っ張り強度が２〜３に９であったが、こ
こでは７〜８に’ｌと約２倍の強度が得られ、十分な機
械的強度も得ることができる。In this embodiment, a highly reliable electrical connection can be obtained by soldering both terminals of the flexible wiring board (24) and the liquid crystal display. Furthermore, by interposing the adhesive (25), the tensile strength of the flexible wiring board (24) was 2 to 3 to 9 when conventional soldering alone was used, but here it has been increased to 7 to 8'l, which is about 2. Double the strength can be obtained and sufficient mechanical strength can also be obtained.
なお今までは、フレキシブル配線板（２４）はフレキシ
ブルケーブルとしていたが、駆動回路用のＩＣ等が搭載
されたフレキシブル回路基板でもよい。Up to now, the flexible wiring board (24) has been a flexible cable, but it may also be a flexible circuit board on which an IC for a drive circuit or the like is mounted.
また加熱手段（４１）としては、熱ヘツド以外にレーザ
ー等であってもよいことは言うまでもない。It goes without saying that the heating means (41) may be a laser or the like in addition to a thermal head.
［発明の効果］
この発明は、平面表示パネルとフレキシブル配線板との
接続に、半田融着及び接着剤の硬化という両方の手段を
利用することにより、十分な機械的及び電気的接続が得
られ、接続部分の剥がれや浮き等が減少する。[Effects of the Invention] This invention provides sufficient mechanical and electrical connection by using both means of solder fusion and curing of adhesive to connect a flat display panel and a flexible wiring board. , peeling and lifting of the connected parts are reduced.
第１図はこの発明により得られる液晶表示装置の一例を
示す図、第２図はフレキシブル配線板の端部の一例を示
す斜視図、第３図はこの発明による平面表示パネルとフ
レキシブル配線板の接続状態の一例を示す断面図である
。
（１０）、 （１１）・・・・・・基板（１３）、 （
１４）・・・・・・表示電極（１５）・・・・・・端子
（２４）・・・・・・フレキシブル配線板（２５）・・
・・・・接着剤、 （４１）・・・・・・加熱手段第
１ 図
第 ２ 図FIG. 1 is a diagram showing an example of a liquid crystal display device obtained according to the present invention, FIG. 2 is a perspective view showing an example of an end portion of a flexible wiring board, and FIG. 3 is a diagram showing an example of a flat display panel and a flexible wiring board according to the present invention. FIG. 3 is a cross-sectional view showing an example of a connected state. (10), (11)...Substrate (13), (
14)...Display electrode (15)...Terminal (24)...Flexible wiring board (25)...
...adhesive, (41) ... heating means No.
1 Figure 2
Claims (1)
表示パネルの前記端子と前記表示電極に給電を行うフレ
キシブル配線板とを半田付けするに際し、前記基板と前
記フレキシブル配線板との間に熱硬化性の接着剤を介在
させてあることを特徴とする平面表示パネルの電極端子
取出構造。When soldering the terminals of a flat display panel in which terminals connected to display electrodes are arranged around the substrate and a flexible wiring board that supplies power to the display electrodes, heat is generated between the substrate and the flexible wiring board. An electrode terminal extraction structure for a flat display panel characterized by interposing a curable adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27512986A JPS63129390A (en) | 1986-11-20 | 1986-11-20 | Electrode terminal takeoff construction for planar display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27512986A JPS63129390A (en) | 1986-11-20 | 1986-11-20 | Electrode terminal takeoff construction for planar display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63129390A true JPS63129390A (en) | 1988-06-01 |
Family
ID=17551104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27512986A Pending JPS63129390A (en) | 1986-11-20 | 1986-11-20 | Electrode terminal takeoff construction for planar display panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63129390A (en) |
-
1986
- 1986-11-20 JP JP27512986A patent/JPS63129390A/en active Pending
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