JPS63128746U - - Google Patents
Info
- Publication number
- JPS63128746U JPS63128746U JP2034387U JP2034387U JPS63128746U JP S63128746 U JPS63128746 U JP S63128746U JP 2034387 U JP2034387 U JP 2034387U JP 2034387 U JP2034387 U JP 2034387U JP S63128746 U JPS63128746 U JP S63128746U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- resin
- semiconductor device
- bent
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2034387U JPS63128746U (ar) | 1987-02-13 | 1987-02-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2034387U JPS63128746U (ar) | 1987-02-13 | 1987-02-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63128746U true JPS63128746U (ar) | 1988-08-23 |
Family
ID=30815768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2034387U Pending JPS63128746U (ar) | 1987-02-13 | 1987-02-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63128746U (ar) |
-
1987
- 1987-02-13 JP JP2034387U patent/JPS63128746U/ja active Pending