JPS63127763U - - Google Patents
Info
- Publication number
- JPS63127763U JPS63127763U JP1973187U JP1973187U JPS63127763U JP S63127763 U JPS63127763 U JP S63127763U JP 1973187 U JP1973187 U JP 1973187U JP 1973187 U JP1973187 U JP 1973187U JP S63127763 U JPS63127763 U JP S63127763U
- Authority
- JP
- Japan
- Prior art keywords
- side wall
- solder
- jet
- type automatic
- soldering device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973187U JPS63127763U (en, 2012) | 1987-02-13 | 1987-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973187U JPS63127763U (en, 2012) | 1987-02-13 | 1987-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63127763U true JPS63127763U (en, 2012) | 1988-08-22 |
Family
ID=30814592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973187U Pending JPS63127763U (en, 2012) | 1987-02-13 | 1987-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63127763U (en, 2012) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012143966A1 (ja) * | 2011-04-18 | 2012-10-26 | 三菱電機株式会社 | はんだ噴流ノズルおよびはんだ付け装置 |
| JP2013536994A (ja) * | 2010-09-01 | 2013-09-26 | ピラーハウス・インターナショナル・リミテッド | 溶融はんだをｐｃｂの下面へと届けるためのはんだ付けノズル、はんだノズルの乾きの発生の程度を軽減する方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038661B2 (ja) * | 1978-07-26 | 1985-09-02 | 松下電器産業株式会社 | 酸素濃度検出器 |
-
1987
- 1987-02-13 JP JP1973187U patent/JPS63127763U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038661B2 (ja) * | 1978-07-26 | 1985-09-02 | 松下電器産業株式会社 | 酸素濃度検出器 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013536994A (ja) * | 2010-09-01 | 2013-09-26 | ピラーハウス・インターナショナル・リミテッド | 溶融はんだをｐｃｂの下面へと届けるためのはんだ付けノズル、はんだノズルの乾きの発生の程度を軽減する方法 |
| US20130306711A1 (en) * | 2010-09-01 | 2013-11-21 | Alexander J. Ciniglio | Soldering nozzle for delivering molten solder to the underside of a pcb, method of reducing the rate of occurence of dewetting of a solder nozzle |
| US20150174677A1 (en) * | 2010-09-01 | 2015-06-25 | Pillarhouse International Limited | Soldering nozzle for delivering molten solder to the underside of a pcb, method of reducing the rate of occurrence of dewetting of a solder nozzle |
| JP2016165759A (ja) * | 2010-09-01 | 2016-09-15 | ピラーハウス・インターナショナル・リミテッド | 溶融はんだをｐｃｂの下面へと届けるためのはんだ付けノズル、はんだノズルのディウェッティングの発生の程度を軽減する方法 |
| WO2012143966A1 (ja) * | 2011-04-18 | 2012-10-26 | 三菱電機株式会社 | はんだ噴流ノズルおよびはんだ付け装置 |